Piyas Chowdhury  Piyas Chowdhury photo         

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Albany Nanotech / Thomas J. Watson Research Center, NY, USA
  

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Dr. Piyas Chowdhury specializes in innovating materials, mechanics and thermal attributes of deep learning cores. At IBM Research, he has developed physics-based models to discover enhanced interface materials, and devised experimental techniques to ensure high reliability underfills for very fine-pitched C4 interconnects in heterogeneously integrated flip chips. He is also co-designing bond & assembly processes for novel integration schemes via FEM simulations. His research contributes directly to the development of next generation AI supercomputers.