Professional AssociationsProfessional Associations: IEEE Member | Japan Institute of Electronics Packaging
more informationMore information: linkedIn
Keishi Okamoto received his M.S in Informatics from Kyoto University in 2003.His research topic in the university was a technique for developing a precise thermal compact model. He joined IBM Japan in 2003. He has been working in semiconductor packaging for 12 years and contributed to packaging developments through mechanical modeling and material characterization. Now his work focuses on next generation organic interposers with ultra-high-density circuitries for 2.1D/2.5D semiconductor package for future IoT systems.