Bing Dang  Bing Dang photo         

contact information

Micro System Technology Solution, Healthcare & LifeScience
Thomas J. Watson Research Center, Yorktown Heights, NY USA
  +1dash914dash945dash1568

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Professional Associations

Professional Associations:  IEEE Electronics Packaging Society  |  IEEE, Senior Member

profile


Bing Dang joined IBM Research as a Research Staff Memeber (RSM) in 2006. Currently, he is currently working on IoT device miniaturization and system integration for healthcare and life science applications. He holds a Ph.D. degree in Electrical and Computer Engineering from Georgia Institute of Technology. He also earned his M.S. degree in Electrical and Computer Engineering and M.S. degree in Mechanical Engineering from Auburn University. In addition, he holds B.S. and M.S. degrees in Physical Chemistry from University of Science and Technology, Beijing.  He has worked in the field of microelectronics integration and packaging for more than 18 years.  He developed numerous technologies and processes for 3D IC and microsystem packaging and integration for several helathcare applications. In the past 10 years, he received 23 IBM Inovation Achievement Awards, an Outstanding Innovation Award and an Outstanding Technical Achievement Award. Recently, he has been named as an IBM Master Inventor for his sustained and outstanding and sustained contribution to intellectural Property.

Bing has published more than 70 technical papers in journals and international conferences and authored 2 book chapters. He also received numerous paper awards at international conferences. He has been actively involved in IEEE Electronic Packaging Society and elected as an IEEE Senior Member. He has served as an Associate Editor for IEEE Transactions on Component Packaging and Manufacturing Technology and the IEEE EPS Technical Committee Chair.