Professional AssociationsProfessional Associations: IEEE Components, Packaging and Manufacturing Technology Society | IEEE, Senior Member
Bing Dang joined IBM Research in 2006 after graduation with a Ph.D. degree in Electrical and Computer Engineering at Georgia Institute of Technology. He has worked in the field of semiconductor integration and packaging for more than 18 years. He developed numerous technolgies and processes for 3D IC and is currently working on IoT electronics miniturization and system integration for healthcare applications. He also has R&D background in battery and electrochemistry. He has published more than 70 technical papers in journals and international conferences. He has been actively involved in IEEE Electronic Packaging Society. He has served as an Associate Editor for IEEE Transactions on EPS and a Committeee Chair for IEEE ECTC Materials and Processing. He received 22 IBM Inovation Achievement Awards and has been named as IBM Master Inventor.