Bing Dang joined IBM Research in 2006 after graduation with a Ph.D. degree in Electrical and Computer Engineering at Georgia Institute of Technology. He has worked in the field of semiconductor integration and packaging for more than 18 years. He developed numerous technologies and processes for 3D IC and is currently working on IoT device miniaturization and system integration for healthcare and life science applications. In the past 10 years, he received 22 IBM Inovation Achievement Awards, an Outstanding Innovation Award and an Outstanding Technical Achievement Award. Recently, he has been named as an IBM Master Inventor for his sustained and outstanding contribution to intellectural Property.
Bing has published more than 70 technical papers in journals and international conferences and authored 2 book chapters. He also received numerous paper awards at international conferences. He has been actively involved in IEEE Electronic Packaging Society and elected as an IEEE Senior Member. He has served as an Associate Editor for IEEE Transactions on Component Packaging and Manufacturing Technology and the IEEE EPS Technical Committee Chair.