Bing Dang  Bing Dang photo         

contact information

Manager, Digitial Health Engineering Group
Thomas J. Watson Research Center, Yorktown Heights, NY USA


Professional Associations

Professional Associations:  IEEE Electronics Packaging Society  |  IEEE, Senior Member


Bing Dang joined IBM Research as a Research Staff Memeber (RSM) in 2006. Currently, he is the Manager of Digital Health Engineering Group, where he leads research and development of Digital Health Software Platform and System Integration. In the past 10 years, he has worked on healthcare IoT device miniaturization and system integration for healthcare and life science applications. He holds a Ph.D. degree in Electrical and Computer Engineering from Georgia Institute of Technology. He also earned his M.S. degree in Electrical and Computer Engineering and M.S. degree in Mechanical Engineering from Auburn University. In addition, he holds B.S. and M.S. degrees in Physical Chemistry from University of Science and Technology, Beijing.  In the past 22 years,  he developed numerous technologies and processes for 3D semiconductor and ICs, as well as microsystem packaging and integration for several helathcare applications. He has been granted 122 patents and received 27 IBM Inovation Achievement Awards, an Outstanding Innovation Award and an Outstanding Technical Achievement Award. He was named as an IBM Master Inventor for his sustained and outstanding and sustained contribution to intellectural Property.

Bing has published more than 70 technical papers in journals and international conferences and authored 2 book chapters. He also received numerous paper awards at international conferences. He has been actively involved in IEEE Electronic Packaging Society (EPS) and elected as an IEEE Senior Member. He is a Technical Committee Chair for IEEE EPS . He also served as an Associate Editor for IEEE Transactions on Component Packaging and Manufacturing Technology and serves as a ECTC conference technical committee member and session chairs.