Daniel C Edelstein  Daniel C Edelstein photo         

contact information

Academy of Technology LogoIBM Fellow; Manager: Processes, Materials, & Integration
Thomas J. Watson Research Center, Yorktown Heights, NY USA


Professional Associations

Professional Associations:  IEEE Electron Devices Society (EDS)  |  National Academy of Engineering


IBM Fellow and Manager, MRAM Manufacturability.  Career work has focused on CMOS on-chip Cu-based interconnection technologies, including integration with low-k/ultralow-k dielectrics, reliability physics, performance modeling and measurement, and evaluation of new materials and integration schemes.  Led other projects, including: "2.5D" Si Carrier with through-Si vias for 3D integration; Quantum Computing processes, integration, and interconnects; and currently MRAM technology manufacturability.