I currently work in the Interconnect Patterning Research group at IBM Research in Albany, NY, where my research focuses on reactive ion etch (RIE) solutions for EUV lithography patterning. My expertise lies in middle-of-the-line (MOL) contact etching and back-end-of-the-line (BEOL) metal hardmask etching across a range of technology nodes and device architectures. Additionally, I have interest in advanced patterning solutions, materials development, plasma-surface interactions, and plasma processing for bioengineering. I currently serve on the Program Committee for the 2017 AVS Plasma Science and Technology Division.
I received my Ph.D. in Analytical Chemistry from Colorado State Univerisity, where I studied plasma-based functionalization of surfaces with a focus on biocompatibility. I have a B.S. in Chemistry from the University of Central Arkansas, where my undergraduate research explored carbon dating archeological rock art samples using non-destructive plasma techniques.