Professional AssociationsProfessional Associations: IEEE Circuits and System Society
My contributions to the communication circuit and technology I am proud of:
_ Lead a team working on technology development and circuit demonstration of RF SOI on high-resistivity substrate
_ Demonstrated the first integration of high-Q passives on High-Resistivity SOI, with inductor peak-Q of 50 and its impact on VCO, and the integration of the Vertical Native Capacitor with density better than 2fF/um2.
_ Lead a team working on low-power high-performance SOI SoC technology and enablement, leading to the first demonstration of 130 and 90nm SOI ASIC, as well as the enablement of the first 3.5W 1GHz Pentium class microprocessor.
_Pioneered the design of millimeter wave SOI CMOS from 30 to 94GHz in standard microprocessor technology with performances similar to coumpound technologies. Demonstrated the importance of FET layout optimization in nanometer technologies, with the fastest switch delay of 1.9ps reported.
_ Design world class performance VCO and PLL for TRx applications. Proposed VCO FOMT which is widely used in the industry to benchmark VCO.
_ Lead a team working on analog benchmarking with the statistical measurement and analysis of variability in high-speed circuits.
_ Pioneered design work of SiGe BiCMOS with first record noise figure measurements for bipolar and first CMOS RFIC circuits for wireless LAN applications.
solid-state technologies, the design and optimization of high-speed circuits, the integration of RF transceivers, PLL and Analog to Digital converter with microprocessors for SoC applications, the RF measurement automation and the Design For Yield in nanometer technologies.
h-index of 24, i10-index of 54, 2031 citations,
19 patents issued,
Senior IEEE member,
Chairman of the IEEE CSICS CMOS committee,
Coauthor of the best student paper award at the 2002 IEEE Radio Frequency Integrated Circuit Conference,
Book Chapter, "mmWave Electronic Switches," Book Chapter from Advanced Millimeter-wave Technologies - Antennas, Packaging and Circuits, Wiley 09