Ken Rodbell is a Manager of the Thin Film Metallurgy and Soft Error Rate (SER) Research Department at the IBM Thomas J. Watson Research Center in Yorktown Heights, NY.
He joined IBM Research as a Research Staff Member in 1989 after spending three years at the IBM Semiconductor Development Laboratory in Hopewell Junction, NY.
He received his B.S. (1982), M.S. (1983) and Ph.D. (1986) in Materials Science and Engineering, with a minor in statistics, from Rensselaer Polytechnic Institute, where he was a recipient of an IBM Research Fellowship for his graduate work.
His research interests have focused on Si based electronic materials; including thin film metallurgy, crystallographic texture, electromigration, and radiation induced soft errors in semiconductor devices; and has co-authored more than 60 issued U.S. patents.
He was one of a team recognized as the New York State 2006 Inventor of the Year for a Cu plating technology patent. Ken is a Senior Member of the IEEE.