Todd Takken serves as the technical lead for systems power, packaging and cooling (PPC) in the high performance computing (HPC) systems group at the IBM T. J. Watson Research Center. After modeling superconducting interconnects for his Ph.D. work at Stanford University, Dr. Takken proceeded to work on a wide variety of electrical modeling, system architecture and systems PPC projects within IBM. Dr. Takken became the principal hardware lead for the second and third generations of Blue Gene, leading the conception and implementation of multiple power, packaging and cooling systems technologies, including dense air- and water-cooling, redundancy and failure design for massively parallel systems, early use of on-board optics plus redundant AC-DC and DC-DC system-level power distribution and conversion using 48 V intermediate busses. More recently Dr. Takken has lead the design prototyping and system implementation of the flexible multiprocessor cold plates used in the Summit and Sierra supercomputers, and he has lead the creation and prototyping of multiple ideas for novel power converters and power packaging. Dr. Takken is currently investigating systems architecture, power, packaging and cooling innovations for future IBM HPC and cloud systems.