Dr. Tymon Barwicz is currently leading the silicon nanophotonic packaging research at IBM.
He joined the IBM Thomas J. Watson Research Center in 2006. From 2006 to 2010, he worked on shape and dimensional control of sub-10-nm silicon nanowires as well as their applications to FETs, NEMS and photovoltaics. His current research focus is on enabling large-scale deployment of silicon photonics through low-cost, high-throughput photonic packaging. This involves design, fabrication, and assembly of fiber-to-chip and chip-to-chip photonic interfaces. In addition, he contributes to the IBM CMOS-integrated photonics platform commercialized by GlobalFoundries and to research on silicon photonic gas sensors.
Dr. Barwicz was born in Warsaw, Poland. He received the B.Eng. degree in engineering physics from the Ecole polytechnique de Montreal, Canada, in 2000 and a joint M.Sc./Ph.D. degree in materials science and engineering at the Massachusetts Institute of Technology (MIT) in 2005. His doctoral dissertation focused on accurate nanofabrication techniques for strong-confinement microphotonic devices. From 2005 to 2006, he was a postdoctoral associate at MIT where he lead nanofabrication of silicon photonic reconfigurable add-drop multiplexers. He joined IBM in late 2006.
Dr. Barwicz is a senior member of IEEE and OSA, author on more than 115 conference and journal publications, and inventor on more than 45 granted patents and 35 pending applications.
Dr. Barwicz's publication list is available on the "Publication list" tab.
Dr. Barwicz's patent list is available on the "Patent list" tab.
Dr. Barwicz's resume is available on Linkedin