Dr. Tymon Barwicz has been leading silicon nanophotonic packaging research at IBM.
He joined the IBM Thomas J. Watson Research Center in 2006. From 2006 to 2010, he worked on shape and dimensional control of sub-10-nm silicon nanowires as well as their applications to FETs, NEMS and photovoltaics. Since then, he has focused on enabling large-scale deployment of silicon photonics through low-cost, high-throughput photonic packaging. This involves design, fabrication, and assembly of fiber-to-chip and chip-to-chip photonic interfaces. In addition, he has contributed to the IBM CMOS-integrated photonics platform commercialized by GlobalFoundries, to silicon photonic gas sensors, and quantum photonics.
Dr. Barwicz was born in Warsaw, Poland. He received the B.Eng. degree in engineering physics from the Ecole polytechnique de Montreal, Canada, in 2000 and a joint M.Sc./Ph.D. degree in materials science and engineering at the Massachusetts Institute of Technology (MIT) in 2005. His doctoral dissertation addressed accurate nanofabrication techniques for strong-confinement microphotonic devices. From 2005 to 2006, he was a postdoctoral associate at MIT leading nanofabrication of silicon photonic reconfigurable add-drop multiplexers. He joined IBM in late 2006.
Dr. Barwicz is a senior member of IEEE and OSA, author on more than 140 conference and journal publications, and inventor on more than 80 granted patents.
Dr. Barwicz's publication list is available on the "Publication list" tab.
Dr. Barwicz's patent list is available on the "Patent list" tab.
Dr. Barwicz's resume is available on Linkedin