Xiaoxiong Gu (Kevin) joined IBM Research as a Research Staff Member in January 2007. His research activities are focused on 5G radio access technologies, optoelectronic and mm-wave packaging, electrical designs, modeling and characterization of communication and computation systems. He has recently worked on antenna-in-package design and integration for mm-wave imaging and communication systems including K-band, V-band and W-band phased-array modules. He has also worked on 3D electrical packaging and signal/power integrity analysis for high-speed I/O subsystems including on-chip and off-chip interconnects. He has been involved in developing novel TSV and interposer technologies for heterogeneous system integration.
Dr. Gu has authored and co-authored over 70 technical papers and has 8 issued patents. He received an IBM Outstanding Technical Achievement Award in 2016, four IBM Plateau Invention Awards in 2012 ~ 2016, the IEEE EMC Symposium Best Paper Award in 2013, two SRC Mahboob Khan Outstanding Industry Liaison Awards in 2012 and 2014, the Best Conference Paper Award at IEEE EPEPS in 2011, IEC DesignCon Paper Awards in 2008 and 2010, the Best Interactive Session Paper Award at IEEE DATE in 2008, and the Best Session Paper Award at IEEE ECTC in 2007. Dr. Gu is the co-chair of Professional Interest Community (PIC) on Computer System Designs at IBM. He is a Senior Member of IEEE and has been serving on the technical program committees for MTT-S, EPEPS, ECTC, EDAPS and DesignCon.