Dr. Rahel Straessle joined IBM Research - Zurich in 2015 as a post-doctoral research fellow in the group of Advanced Micro Integration (AMI). Her work is currently focused on thermally aware electronic packaging and 3D integration.
Rahel received her PhD in Microtechnology from the Swiss Federal Institute of Technology Lausanne (EPFL) in 2013, where she was a member of the STI IMT SAMLAB – Sensors, Actuators, and Microsystems Laboratory of Prof. N.F. de Rooij.
In 2008, Rahel received her Master of Science degree in Mechanical Engineering at the Swiss Federal Institute of Technology Zurich (ETHZ) in the Institute of Robotics and Intelligent Systems under Prof. B. Nelson.
In her free time, Rahel is working toward becoming a certified sports climbing guide of the Swiss Alpine Club (SAC).