Subsystem Cooling and Integration       


 Pritish R. Parida photo

Subsystem Cooling and Integration - overview

The Subsystem Cooling and Integration Department mission is to provide thermo-mechanical cooling solutions for the design and manufacture of IT Systems. The increase in computing performance has resulted in increasing power consumption and corresponding heat generation for IT subsystems including processor modules, memory, I/O and power distribution. The integration of cooling solutions to provide thermally efficient designs is critical to reduce the energy required to cool systems in Data Centers.