Cooling 3D Chips     

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Cooling 3D Chips - overview


Physics Accomplishment | 2008 - 2015

IBM researcher: TBD

Where the work was done: IBM T.J. Watson Research Center, IBM Zurich Research Lab

What we accomplishedA major problem in building 3D chips (with multiple layers of logic and memory stacked on top of each other) is how to cool the chip. Power that normally could be dissipated from the surface of the chip in a 2D design is now trapped in the interior, absent improvements and breakthroughs of the types noted below.

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Image credit: c/net

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