Electrical Interconnect and Packaging (Computer Systems Design sub-discipline) - Seminar

Title: Integrated Power Distribution Design and Research (Broadcast from On-Site Visit in IBM Poughkeepsie)
Speaker: Madhavan Swaminathan, Sudhakar Yalamanchili, Arijit Raychowdhury, Goergia Tech.
Date: 03/25/2015

Title: Recent Advances in Multilayer Organic Microwave and mm-wave Front Ends
Speaker: Prof. John Papapolymerou, Goergia Tech.
Date: 08/08/2014

Title: Why Model 10,000 Vias?
Speaker: Prof. Christian Schuster, Hamburg University of Technology (TUHH), Germany
Date: 09/07/2012

Title: Connectivity in Future Systems
Speaker: Prof. Paul Franzon, North Carolina State University
Date: 06/29/2012

Title: Multi-Scale, Multi-Physics, Computational Electromagnetics
Speaker: Prof. Weng Cho Chew, University of Illinois at Urbana-Champaign
Date: 04/06/2012

Title: Signal Integrity of TSV Based 3D IC
Speaker: Prof. Joungho Kim, KAIST (Korea Advanced Institute of Science and Technology)
Date: 07/23/2010

Title: 3D Heterogeneous Technologies for Processor-Memory & CMOS-Biosensor Stacking
Speaker: Prof. Muhannad S. Bakir, Georgia Tech.
Date: 04/30/2010

Title: Substrate Integrated Circuits (SICs): A Paradigm for Future GHz and THz Electronic and Photonic Systems
Speaker: Prof. Ke Wu, Ecole Polytechnique (University of Montreal), Canada
Date: 03/05/2010

Title: Antennas & RF Sensors: Changing the Way We Live (From mobile communications to electronic textiles and RFIDs)
Speaker: Prof. John L. Volakis, The Ohio State University
Date: 12/18/2010

Title: The Future of Wires
Speaker: Prof. Paul D. Franzon, North Carolina State University
Date: 12/04/2009

Title: 3D TSV Technology, Challenges and Opportunities
Speaker: Prof. James Lu, Rensselaer Polytechnic Institute (RPI)
Date: 10/30/2009

Title: Research in Applied Electromagnetics at TUHH
Speaker: Prof. Christian Schuster, Technische Universit