Dielectric Materials Research for Advanced Microelectronic Devices - Materials Chemistry
Incorporation of carbon units in the form of bridging groups, as opposed to pendant organic moieties employed in traditional organosilicates, maintains high network connectivity and significantly improves mechanical properties. In addition, the presence of sufficient carbon content in the dielectric material mitigates plasma damage during typical dual damascene processing. These materials are known as bridged polysilsesquioxanes, oxycarbosilanes, or carbosiloxanes. Their unique properties have influenced the design of both spin-on and CVD based interlayer dielectric materials. This class of materials along with our extensive knowledge in the introduction of controlled porosity is the focus of dielectric applications oriented material research of our group.