Dielectric Materials Research for Advanced Microelectronic Devices - Collaborations


Stanford University - Prof. Reinhold Dauskardt - Fracture Mechanics

Rensselaer Polytechnic Institute - Prof. Leonard Interrante - Novel low-oxygen content ILD candidate materials

Laboratoire des Technologies de la Microelectronique - Maxime Darnon - Etch and plasma damage of ULK materials