Silicon Nanophotonic Packaging

links

Silicon Nanophotonic Packaging - References

Key project publications

Project overview

Overview paper in the IEEE Journal of Selected Topics in Quantum Electronics

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, Y. Martin, H. Numata, J.-W. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. H. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, “A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities” IEEE Journal of Selected Topics in Quantum Electronics, 22 (6), 8200712, Nov.-Dec. 2016.
[manuscript in PDF], [open access at publisher]

Plenary talk at Group-IV Photonics 2015

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, H. Numata, Y. Martin, J.-W. Nah, S. Takenobu, A. Janta-Polczynski, E. L. Kimbrell, R. Leidy, M. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, P. Fortier,"Enabling large-scale deployment of photonics through cost-efficient and scalable packaging", in Proceedings of the 12th IEEE International Conference on Groupe IV Photonics, Vancouver, Canada, August 26-28, 2015, paper ThA1. [slides in PDF]

Invited symposium talk at OFC 2015

T. Barwicz, Y. Taira, T. W. Lichoulas, N. Boyer, H. Numata, Y. Martin, J. Nah, S. Takenobu, A. Janta-Polczynski, E. Kimbrell, R. Leidy, M. Khater, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov, and P. Fortier, "Photonic Packaging in High-Throughput Microelectronic Assembly Lines for Cost-Efficiency and Scalability," in Optical Fiber Communication Conference, OSA Technical Digest (online) (Optical Society of America, 2015), paper W3H.4. [manuscript in PDF], [link to publisher]

Parallelized fiber assembly

Metamaterial converter centered at 1490 nm.

T. Barwicz, N. Boyer, A. Janta-Polczynski, J.-F. Morissette, Y. Thibodeau, L. Patry, T. W. Lichoulas, E. L. Kimbrell, S. Martel, S. Kamlapurkar, S. Engelmann, R. L. Bruce, Y. A. Vlasov and P. Fortier, “A Metamaterial Converter Centered at 1490nm for Interfacing Standard Fibers to Nanophotonic Waveguides,” in Optical Fiber Communication Conference, OSA Technical Digest (online) (Optical Society of America, 2016), paper M2I.3. [manuscript in PDF], [link to publisher]

O-band metamaterial converter perfromance.

T. Barwicz, A. Janta-Polczynski, M. Khater, Y. Thibodeau, R. Leidy, J. Maling, S. Martel, S. Engelmann, J. S. Orcutt, P. Fortier, and W. M. Green, "An O-band Metamaterial Converter Interfacing Standard Optical Fibers to Silicon Nanophotonic Waveguides," in Optical Fiber Communication Conference, OSA Technical Digest (online) (Optical Society of America, 2015), paper Th3F.3 [manuscript in PDF], [link to publisher]

Fiber assembly method and Monte Carlo analysis of self-alignment accuracy.
(Best of conference paper award at ECTC 2015)

T. Barwicz, N. Boyer, S. Harel, T. W. Lichoulas, E. L. Kimbrell, A. Janta-Polczynski, S. Kamlapurkar, S. Engelmann, Y. A. Vlasov and P. Fortier, "Automated, self-aligned assembly of 12 fibers per nanophotonic chip with standard microelectronics assembly tooling," in Proceedings of the IEEE Electronic Components and Technology Conference (ECTC), (IEEE, 2015) pp.775-782, 26-29 May 2015.
[manuscript in PDF], [link to publisher]

Compliant polymer interface

Demonstration of improved optical performance

T. Barwicz, A. Janta-Polczynski, S. Takenobu, J.-F. Morissette, B. Peng, Y. Taira, H. Numata, S. Kamlapurkar, S. Engelmann, P. Fortier, and N. Boyer, “A compliant polymer interface with 1.4dB loss between standard fibers and nanophotonic waveguides,” in 2016 Frontiers in Optics, OSA Technical Digest (online) (Optical Society of America, 2016), paper FTu1D.2. [manuscript in PDF], [link to publisher]

Improved assembly of polymer ribbons to silicon chips

N. Boyer, A. Janta-Polczynski, J.-F. Morissette, S. Kamlapurkar, S. Engelmann, Y. Taira, S. Takenobu, H. Numata, P. Fortier, T. Barwicz, “Sub-Micron Bondline-Shape Control in Automated Assembly of Photonic Devices,” in Proc. of IEEE Electronic Components and Technology Conference (ECTC), (IEEE, New York, 2016), pp. 2257 - 2263. [manuscript in PDF], [link to publisher]

First optical demonstration of compliant interface

T. Barwicz, Y. Taira, S. Takenobu, N. Boyer, A. Janta-Polczynski, Y. Thibodeau, S. Kamlapurkar, S. Engelmann, H. Numata, R. Bruce, S. Laflamme, P. Fortier, and Y. Vlasov, "Optical Demonstration of a Compliant Polymer Interface between Standard Fibers and Nanophotonic Waveguides," in Optical Fiber Communication Conference, OSA Technical Digest (online) (Optical Society of America, 2015), paper Th3F.5.
[manuscript in PDF], [link to publisher]

Improved self-alignment between ferrule and polymer ribbon.

Y. Taira, H. Numata, S. Takenobu, T. Barwicz, "Improved connectorization of compliant polymer waveguide ribbon for silicon nanophotonics chip interfacing to optical fibers," in proceedings of IEEE Electronic Components and Technology Conference (ECTC) , (IEEE, 2015) pp.1640-1645, 26-29 May 2015.
[link to publisher]

Feasibility study with comprehensive tolerance analysis in fabrication and assembly.

T. Barwicz and Y. Taira, "Low-cost interfacing of fibers to nanophotonic waveguides: design for fabrication and assembly tolerances," IEEE Photonics Journal, vol. 6, no. 4, 6600818, 2014.
[open access at publisher]

Performance of mechanical self-alignment. We demonstrate +/- 1-2 um final alignment when starting from +/- 10 um purposeful initial misalignment.

T. Barwicz, Y. Taira, H. Numata, N. Boyer, S. Harel, S. Kamlapurkar, S. Takenobu, S. Laflamme, S. Engelmann, Y. Vlasov, and P. Fortier “Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips,” in Proceedings of the IEEE Electronic Components and Technology Conference, Lake Buena Vista, FL USA, May 27-30, 2014.
[slides in PDF], [link to publisher]

Solder self-aligned photonic flip-chip assembly

Optical demonstration of solder self-aligned flip-chip assembly.

T. Barwicz, Y. Martin, J.-W. Nah, S. Kamlapurkar, R. L. Bruce, S. Engelmann, and Y. A. Vlasov, “Demonstration of Self-Aligned Flip-Chip Photonic Assembly with 1.1dB Loss and >120nm Bandwidth,” in 2016 Frontiers in Optics, OSA Technical Digest (online) (Optical Society of America, 2016), paper FF5F.3.
[manuscript in PDF], [link to publisher]

First identification of yield-limiting mechanism in solder self-alignment and proposed solution

Y. Martin, J.-W. Nah, S. Kamlapurkar, S. Engelmann, T. Barwicz, “Toward high-yield 3D self-alignment of flip-chip assemblies via solder surface tension,” in Proc. of IEEE Electronic Components and Technology Conference (ECTC), (IEEE, New York, 2016), pp. 588-594.
[manuscript in PDF], [link to publisher]

First demonstration of solder self-aligned photonic flip-chip

J.-W. Nah; Y. Martin, S. Kamlapurkar, S. Engelmann, R.L. Bruce, T. Barwicz, "Flip chip assembly with sub-micron 3D re-alignment via solder surface tension," in Proceedings of IEEE Electronic Components and Technology Conference (ECTC), (IEEE, 2015) pp.35-40, 26-29 May 2015.
[manuscript in PDF], [link to publisher]

Relevant publications from other IBM groups

Experimental study of adiabatic coupling between silicon and polymer waveguides showing very low coupling loss. The parameter space here is different from what was found required in our tolerance study (i.e. zero gap assumed here) but the acceptable misalignment agrees well with our computations.

Ibrahim Murat Soganci, Antonio La Porta, and Bert Jan Offrein, "Flip-chip optical couplers with scalable I/O count for silicon photonics," Optics Express, vol. 21, no. 13, 16075-16085, 2013. [open access at publisher]

Other references

Properties of the Asahi Glass Corporation optical polymer currently used in our polymer ribbons.

S. Takenobu and Y. Kaida, “Single-Mode Polymer Optical Interconnects for Si Photonics with Heat Resistant and Low Loss at 1310/1550nm” in European Conference and Exhibition on Optical Communication, Amsterdam, Netherlands, 2012, paper P2.20. [link to publisher]

Optical design study of a single-polarization adiabatic coupler between an SU-8 polymer waveguide and a silicon waveguide. The parameter space is different from what was found required in our tolerances study (i.e. zero gap assumed here with single polarization) but the acceptable misalignment agrees well with our computations.

J. Shu, C. Qiu, X. Zhang, and Q. Xu “Efficient coupler between chip-level and board-level optical waveguides” Optics Letters Vol. 36, No. 18, pp. 3614-3616, 2011. [link to publisher]

Tymon Barwicz et al.