Qianwen (Wendy) Chen  Qianwen  (Wendy) Chen photo         

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Heterogeneous Integration Technology - AI Hardware Center
Thomas J. Watson Research Center, Yorktown Heights, NY USA



Heterogeneous Integration Technology Demonstrations for Future Healthcare, IoT, and AI Computing Solutions
John Knickerbocker, R. Budd, B. Dang, Q. Chen, E. Colgan, L.W. Hung, S. Kumar, K. W. Lee, M. Lu, J.W. Nah, R. Narayanan, K. Sakuma, V. Siu, B. Wen

High-Speed Precision Handling Technology of Micro-Chip for Fan-Out Wafer Level Packaging (FOWLP) Application
Qianwen Chen, Li-wen Hung, Evan Colgan, Bo Wen, Bing Dang, Russell Budd, Jae-woong Nah, John Knickerbocker

Column Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip Stacks
Mark Schultz, Cyril Cabral, Cornelia Tsang, Joana Maria, Paul Andry, Qianwen Chen, Timothy Chainer


Feasibility Study of Si Handler Debonding by Laser Release
B. Dang, T. Wassick, Y. Liu, Q. Chen, P. Andry, L. W. Hung, H. Zhang, J. Gelorme, J. Knickerbocker
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
B. Dang, E. Colgan, F. Yang, M. Schultz, Y. Liu, Q. Chen, J. W. Nah, R. Polastre, M. Gaynes, G. McVicker, P. Parida, C. Tsang, J. Knickerbocker, T. Chainer
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)


Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
Dang, Bing and Maria, Joana and Chen, Qianwen and Nah, Jae-Woong and Andry, Paul and Tsang, Cornelia and Sakuma, Katsuyuki and Tyberg, Christy and Robertazzi, Raphael and Scheuermann, Michael and others
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th