Huai Huang  Huai Huang photo         

contact information

S / C Quality / Reliability Eng Prof
IBM AI Hardware center, Albany NY
  +1dash518dash292dash7478

links


more information

More information:  Google scholar profile


2018

Skip-vias bypassing a metallization level at minimum pitch
Benjamin D Briggs, Lawrence A Clevenger, Bartlet H DeProspo, Huai Huang, Christopher J Penny, Michael RIZZOLO
US Patent 9,911,651

Structure and fabrication method for enhanced mechanical strength crack stop
Benjamin D Briggs, Lawrence A Clevenger, Bartlet H DeProspo, Huai Huang, Christopher J Penny, Michael Rizzolo
US Patent 9,899,338

Self-aligned airgaps with conductive lines and vias
Benjamin D Briggs, Lawrence A Clevenger, Bartlet H DeProspo, Huai Huang, Christopher J Penny, Michael Rizzolo
US Patent 9,899,256

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device
Benjamin David Briggs, Lawrence A Clevenger, Bartlet H DeProspo, Huai Huang, Christopher J Penny, Michael RIZZOLO
US Patent App. 15/199,321


2017

Forming deep airgaps without flop over
Benjamin D Briggs, Lawrence A Clevenger, Bartlet H Deprospo, Huai Huang, Christopher J Penny, Michael Rizzolo
US Patent 9,837,305

High-density mim capacitors
Benjamin D Briggs, Lawrence A Clevenger, Bartlet H DeProspo, Huai Huang, Christopher J Penny, Michael Rizzolo
US Patent App. 15/639,585

Structure and fabrication method for enhanced mechanical strength crack stop
Benjamin D Briggs, Lawrence A Clevenger, Bartlet H Deprospo, Huai Huang, Christopher J Penny, Michael Rizzolo
US Patent 9,824,982

Heterogeneous metallization using solid diffusion removal of metal interconnects
Benjamin D Briggs, Lawrence A Clevenger, Bartlet H DeProspo, Huai Huang, Christopher J Penny, Michael Rizzolo
US Patent 9,793,206

High-density mim capacitors
Benjamin D Briggs, Lawrence A Clevenger, Bartlet H DeProspo, Huai Huang, Christopher J Penny, Michael Rizzolo
US Patent App. 15/091,043

Forming chamferless vias using thermally decomposable porefiller
Benjamin D Briggs, Lawrence A Clevenger, Bartlet H DeProspo, Huai Huang, Christopher J Penny, Michael R Rizzolo
US Patent 9,685,366