Joana Maria  Joana Maria photo         

contact information

Research Scientist, Applied Data Science Group
Thomas J. Watson Research Center, Yorktown Heights, NY USA


Professional Associations

Professional Associations:  IEEE   |  Society of Women Engineers


Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
Bing Dang, Joana Maria, Qianwen Chen, Jae-Woong Nah, Paul Andry, Cornelia Tsang, Katsuyuki Sakuma, Christy Tyberg, Raphael Robertazzi, Michael Scheuermann, others
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), pp. 1372--1377


NiFe-based Ball-limiting-metallurgy (BLM) for microbumps at 50$\mu$m pitch in 3D chip stacks
Bing Dang, Steven Wright, Joana Maria, Cornelia Tsang, Paul Andry, Lovell Wiggins, John Knickerbocker
2013 IEEE 63rd Electronic Components and Technology Conference, pp. 1595--1599


Micro-interconnection reliability: Thermal, electrical and mechanical stress
SL Wright, CK Tsang, J Maria, B Dang, R Polastre, P Andry, J Knickerbocker
2012 IEEE 62nd Electronic Components and Technology Conference, pp. 1278--1286

Measurement of microbump thermal resistance in 3D chip stacks
EG Colgan, P Andry, B Dang, JH Magerlein, J Maria, RJ Polastre, J Wakil
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE, pp. 1--7

2.5 D and 3D technology challenges and test vehicle demonstrations
JU Knickerbocker, PS Andry, E Colgan, B Dang, T Dickson, X Gu, C Haymes, C Jahnes, Y Liu, J Maria, others
2012 IEEE 62nd Electronic Components and Technology Conference, pp. 1068--1076


3D chip stacking with 50 $\mu$m pitch lead-free micro-C4 interconnections
J Maria, B Dang, SL Wright, CK Tsang, P Andry, R Polastre, Y Liu, L Wiggins, JU Knickerbocker
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), pp. 268--273

Soft embossing of nanoscale optical and plasmonic structures in glass
Jimin Yao, An-Phong Le, Matthew V Schulmerich, Joana Maria, Tae-Woo Lee, Stephen K Gray, Rohit Bhargava, John A Rogers, Ralph G Nuzzo
Acs Nano 5(7), 5763--5774, ACS Publications, 2011


CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
Bing Dang, Paul Andry, Cornelia Tsang, Joana Maria, Robert Polastre, Robert Trzcinski, Aparna Prabhakar, John Knickerbocker
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), pp. 1393--1398


Nanopost plasmonic crystals
TT Truong, J Maria, J Yao, ME Stewart, TW Lee, SK Gray, RG Nuzzo, J A Rogers
Nanotechnology 20(43), 434011, IOP Publishing, 2009

Optimization of 3D plasmonic crystal structures for refractive index sensing
Joana Maria, Tu T Truong, Jimin Yao, Tae-Woo Lee, Ralph G Nuzzo, Sven Leyffer, Stephen K Gray, John A Rogers
The Journal of Physical Chemistry C 113(24), 10493--10499, ACS Publications, 2009

Multispectral thin film biosensing and quantitative imaging using 3D plasmonic crystals
Matthew E Stewart, Jimin Yao, Joana Maria, Stephen K Gray, John A Rogers, Ralph G Nuzzo
Analytical chemistry 81(15), 5980--5989, ACS Publications, 2009


Seeing molecules by eye: Surface plasmon resonance imaging at visible wavelengths with high spatial resolution and submonolayer sensitivity
Jimin Yao, Matthew E Stewart, Joana Maria, Tae-Woo Lee, Stephen K Gray, John A Rogers, Ralph G Nuzzo
Angewandte Chemie International Edition 47(27), 5013--5017, Wiley Online Library, 2008

Nanostructured plasmonic sensors
Matthew E Stewart, Christopher R Anderton, Lucas B Thompson, Joana Maria, Stephen K Gray, John A Rogers, Ralph G Nuzzo
Chemical reviews 108(2), 494--521, ACS Publications, 2008

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
Katsuyuki Sakuma, Paul S Andry, Cornelia K Tsang, Steven L Wright, Bing Dang, Chirag S Patel, Bucknell C Webb, J Maria, Edmund J Sprogis, SK Kang, others
IBM Journal of Research and Development 52(6), 611--622, IBM, 2008


Soft lithography using acryloxy perfluoropolyether composite stamps
Tu T Truong, Rongsheng Lin, Seokwoo Jeon, Hee Hyun Lee, Joana Maria, Anshu Gaur, Feng Hua, Ines Meinel, John A Rogers
Langmuir 23(5), 2898--2905, ACS Publications, 2007

3D chip stacking technology with low-volume lead-free interconnections
K Sakuma, PS Andry, B Dang, J Maria, CK Tsang, C Patel, SL Wright, B Webb, E Sprogis, SK Kang, others
2007 Proceedings 57th Electronic Components and Technology Conference, pp. 627--632


Experimental and computational studies of phase shift lithography with binary elastomeric masks
Joana Maria, Viktor Malyarchuk, Jeff White, John A Rogers
Journal of Vacuum Science \& Technology B 24(2), 828--835, AVS: Science \& Technology of Materials, Interfaces, and Processing, 2006


Soft-Contact Optical Lithography Using Transparent Elastomeric Stamps and Application to Nanopatterned Organic Light-Emitting Devices
T-W Lee, Seokwoo Jeon, Joana Maria, Jana Zaumseil, Julia WP Hsu, John A Rogers
Advanced functional materials 15(9), 1435--1439, Wiley Online Library, 2005


Nanopatterning with conformable phase masks
Joana Maria, Seokwoo Jeon, John A Rogers
Journal of Photochemistry and Photobiology A: Chemistry 166(1), 149--154, Elsevier, 2004

Three-Dimensional Nanofabrication with Rubber Stamps and Conformable Photomasks
Seokwoo Jeon, Etienne Menard, J-U Park, Joana Maria, Matthew Meitl, Jana Zaumseil, John A Rogers
Advanced Materials 16(15), 1369--1373, Wiley Online Library, 2004