Li-wen Hung 
contact information
Research Staff MemberThomas J. Watson Research Center, Yorktown Heights, NY USA +1
9149453060
9149453060 links
2016
Low temperature adhesive resins for wafer bonding
R.D. Allen, P.S. Andry, J.D. Gelorme, L.W. Hung, J.U. Knickerbocker, C.K. Tsang
US Patent 9,324,601
R.D. Allen, P.S. Andry, J.D. Gelorme, L.W. Hung, J.U. Knickerbocker, C.K. Tsang
US Patent 9,324,601
2015
Integrated structure with bidirectional vertical actuation
M.J. Daneman, M. Lim, L.W. Hung, S. Lloyd
US Patent 9,035,428
M.J. Daneman, M. Lim, L.W. Hung, S. Lloyd
US Patent 9,035,428
2014
Mems device and process for rf and low resistance applications
M.J. Daneman, M. Lim, X. Li, L.W. Hung
US Patent App. 13/687,304
M.J. Daneman, M. Lim, X. Li, L.W. Hung
US Patent App. 13/687,304
2012
Etchant-free methods of producing a gap between two layers, and devices produced thereby
L.W. Hung, C.T.C. Nguyen
WO Patent App. PCT/US2011/022,282
L.W. Hung, C.T.C. Nguyen
WO Patent App. PCT/US2011/022,282