Hiroyuki (Hiro) Miyazoe
contact information
Research Staff Member - Plasma processingsThomas J. Watson Research Center, Yorktown Heights, NY USA +1
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Professional Associations
Professional Associations: American Vacuum Society | The Japan Society of Applied Physicsmore information
More information: Linkedin Profile | Terashma Group - the University of Tokyo | Laboratory for Mechanics of Materials and Nanostructures - EMPA2019
Sidewall image transfer on magnetic tunnel junction stack for magnetoresistive random-access memory patterning
Hiroyuki Miyazoe, Nathan P. Marchack, HsinYu Tsai, Eugene J. O'Sullivan, Karthik Yogendra
US Patent App. 15/841,872
Hiroyuki Miyazoe, Nathan P. Marchack, HsinYu Tsai, Eugene J. O'Sullivan, Karthik Yogendra
US Patent App. 15/841,872
2018
Patterned sidewall smoothing using a pre-smoothed inverted tone pattern
Lai Kafai, Mallela Hari, Miyazoe Hiroyuki, Vega Reinaldo A, Venigalla Rajasekhar
surface finish, substrate, smoothing, optoelectronics, materials science
Abstract
Lai Kafai, Mallela Hari, Miyazoe Hiroyuki, Vega Reinaldo A, Venigalla Rajasekhar
surface finish, substrate, smoothing, optoelectronics, materials science
Abstract
SUBTRACTIVE PATTERNING OF BACK END OF LINE COMPATIBLE MIXED IONIC ELECTRONIC CONDUCTOR MATERIALS
Gloria Wing Yun Fraczak, Hiroyuki Miyazoe, Kumar Virwani
optoelectronics, metal, materials science, ionic bonding, electron, electrode, dielectric, conductor, blanket, back end of line
Abstract
Gloria Wing Yun Fraczak, Hiroyuki Miyazoe, Kumar Virwani
optoelectronics, metal, materials science, ionic bonding, electron, electrode, dielectric, conductor, blanket, back end of line
Abstract
Crossbar resistive memory array with highly conductive copper/copper alloy electrodes and silver/silver alloys electrodes
Takashi Ando, Marwan H. Khater, Seyoung Kim, Hiroyuki Miyazoe
resistive random access memory, materials science, electrode, electrical conductor, crossbar switch, copper, composite material, alloy
Takashi Ando, Marwan H. Khater, Seyoung Kim, Hiroyuki Miyazoe
resistive random access memory, materials science, electrode, electrical conductor, crossbar switch, copper, composite material, alloy
TAPERED METAL NITRIDE STRUCTURE
Martin M. Frank, Hiroyuki Miyazoe, Vijay Narayanan
nitride, metal, materials science, composite material
Martin M. Frank, Hiroyuki Miyazoe, Vijay Narayanan
nitride, metal, materials science, composite material
Multivalent oxide cap for analog switching resistive memory
Ando, Takashi and Khater, Marwan H and Kim, Seyoung and Miyazoe, Hiroyuki
US Patent 9,887,351
Abstract
Ando, Takashi and Khater, Marwan H and Kim, Seyoung and Miyazoe, Hiroyuki
US Patent 9,887,351
Abstract
Selective dry etch for directed self assembly of block copolymers
Engelmann, Sebastian U and Jagtiani, Ashish V and Miyazoe, Hiroyuki and Tsai, Hsinyu
US Patent 9,941,121
Engelmann, Sebastian U and Jagtiani, Ashish V and Miyazoe, Hiroyuki and Tsai, Hsinyu
US Patent 9,941,121
2017
ENGINEERED ETCHED INTERFACES FOR HIGH PERFORMANCE JUNCTIONS
Robert L. Bruce, Hiroyuki Miyazoe, John Rozen
Robert L. Bruce, Hiroyuki Miyazoe, John Rozen
Method of manufacturing an ultra low dielectric layer
Robert L. Bruce, Geraud J. Dubois, Gregory Fritz, Teddie P. Magbitang, Hiroyuki Miyazoe, Willi Volksen
thermal treatment, silicon, radiation, porosity, metal, materials science, dielectric, composite material
Abstract
Robert L. Bruce, Geraud J. Dubois, Gregory Fritz, Teddie P. Magbitang, Hiroyuki Miyazoe, Willi Volksen
thermal treatment, silicon, radiation, porosity, metal, materials science, dielectric, composite material
Abstract
ARTICLES INCLUDING ULTRA LOW DIELECTRIC LAYERS
Robert L. Bruce, Geraud J. Dubois, Gregory Fritz, Teddie P. Magbitang, Hiroyuki Miyazoe, Willi Volksen
porosity, metal, materials science, dielectric, composite material
Abstract
Robert L. Bruce, Geraud J. Dubois, Gregory Fritz, Teddie P. Magbitang, Hiroyuki Miyazoe, Willi Volksen
porosity, metal, materials science, dielectric, composite material
Abstract
Optimal device structures for back-end-of-line compatible mixed ionic electronic conductors materials
Fraczak, Gloria Wing Yun and Miyazoe, Hiroyuki and Virwani, Kumar
US Patent 9,773,978
Abstract
Fraczak, Gloria Wing Yun and Miyazoe, Hiroyuki and Virwani, Kumar
US Patent 9,773,978
Abstract
Selective sputtering with light mass ions to sharpen sidewall of subtractively patterned conductive metal layer
Joseph, Eric A and Miyazoe, Hiroyuki
US Patent 9,799,519
Abstract
Joseph, Eric A and Miyazoe, Hiroyuki
US Patent 9,799,519
Abstract
High aspect ratio patterning of hard mask materials by organic soft masks
Brink, Markus and Engelmann, Sebastian U and Joseph, Eric A and Miyazoe, Hiroyuki
US Patent 9,728,421
Brink, Markus and Engelmann, Sebastian U and Joseph, Eric A and Miyazoe, Hiroyuki
US Patent 9,728,421
Scaled cross bar array with undercut electrode
Ando, Takashi and Khater, Marwan H and Kim, Seyoung and Miyazoe, Hiroyuki
US Patent 9,601,546
Abstract
Ando, Takashi and Khater, Marwan H and Kim, Seyoung and Miyazoe, Hiroyuki
US Patent 9,601,546
Abstract
ULTRA LOW DIELECTRIC LAYER
Bruce, Robert L and Dubois, Geraud J and Fritz, Gregory and Magbitang, Teddie P and Miyazoe, Hiroyuki and Volksen, Willi
US Patent 20,170,092,534
Abstract
Bruce, Robert L and Dubois, Geraud J and Fritz, Gregory and Magbitang, Teddie P and Miyazoe, Hiroyuki and Volksen, Willi
US Patent 20,170,092,534
Abstract
2016
Hybrid subtractive etch/metal fill process for fabricating interconnects
Bruce, Robert L and Fritz, Gregory M and Joseph, Eric A and Miyazoe, Hiroyuki
US Patent App. 15/157,891
Abstract
Bruce, Robert L and Fritz, Gregory M and Joseph, Eric A and Miyazoe, Hiroyuki
US Patent App. 15/157,891
Abstract
Hybrid subtractive etch/metal fill process for fabricating interconnects
Bruce, Robert L and Fritz, Gregory M and Joseph, Eric A and Miyazoe, Hiroyuki
US Patent App. 15/157,906
Abstract
Bruce, Robert L and Fritz, Gregory M and Joseph, Eric A and Miyazoe, Hiroyuki
US Patent App. 15/157,906
Abstract
Stacked graphene field-effect transistor
Franklin, Aaron D and Miyazoe, Hiroyuki and Oida, Satoshi and Smith, Joshua T
US Patent 9,508,801
Abstract
Franklin, Aaron D and Miyazoe, Hiroyuki and Oida, Satoshi and Smith, Joshua T
US Patent 9,508,801
Abstract
Electrode pair fabrication using directed self assembly of diblock copolymers
Chang, Josephine B and Guillorn, Michael A and Miyazoe, Hiroyuki and Pyzyna, Adam M and Tsai, Hsinyu
US Patent 9,349,640
Chang, Josephine B and Guillorn, Michael A and Miyazoe, Hiroyuki and Pyzyna, Adam M and Tsai, Hsinyu
US Patent 9,349,640
Self-limited crack etch to prevent device shorting
Bryce, Brian A and Chang, Josephine B and Miyazoe, Hiroyuki
US Patent 9,318,692
Bryce, Brian A and Chang, Josephine B and Miyazoe, Hiroyuki
US Patent 9,318,692
Dielectric tone inversion materials
Glodde, Martin and Huang, Wu-song and Miyazoe, Hiroyuki and Sooriyakumaran, Ratnam and Tsai, Hsinyu
US Patent 9,337,033
Glodde, Martin and Huang, Wu-song and Miyazoe, Hiroyuki and Sooriyakumaran, Ratnam and Tsai, Hsinyu
US Patent 9,337,033
Electrode pair fabrication using directed self assembly of diblock copolymers
Chang, Josephine B and Guillorn, Michael A and Miyazoe, Hiroyuki and Pyzyna, Adam M and Tsai, Hsinyu
US Patent 9,306,164
Chang, Josephine B and Guillorn, Michael A and Miyazoe, Hiroyuki and Pyzyna, Adam M and Tsai, Hsinyu
US Patent 9,306,164
Dielectric tone inversion materials
Glodde, Martin and Huang, Wu-Song and Miyazoe, Hiroyuki and Sooriyakumaran, Ratnam and Tsai, Hsinyu
US Patent 9,281,212
Glodde, Martin and Huang, Wu-Song and Miyazoe, Hiroyuki and Sooriyakumaran, Ratnam and Tsai, Hsinyu
US Patent 9,281,212
2015
Interconnects based on subtractive etching of silver
Baker-O'Neal, Brett C and Joseph, Eric A and Miyazoe, Hiroyuki
US Patent App. 14/615,077
Abstract
Baker-O'Neal, Brett C and Joseph, Eric A and Miyazoe, Hiroyuki
US Patent App. 14/615,077
Abstract
Magnetic Tunnel Junction Patterning Using Low Atomic Weight Ion Sputtering
Annunziata, Anthony J and Kilaru, Rohit and Marchack, Nathan P and Miyazoe, Hiroyuki
US Patent App. 14/742,382
Abstract
Annunziata, Anthony J and Kilaru, Rohit and Marchack, Nathan P and Miyazoe, Hiroyuki
US Patent App. 14/742,382
Abstract
THIN FILM INTERCONNECTS WITH LARGE GRAINS
Bruce, Robert L and Cabral Jr, Cyril and Fritz, Gregory M and Joseph, Eric A and Lofaro, Michael F and Miyazoe, Hiroyuki and Rodbell, Kenneth P and Shahidi, Ghavam G
US Patent 20,150,348,832
Bruce, Robert L and Cabral Jr, Cyril and Fritz, Gregory M and Joseph, Eric A and Lofaro, Michael F and Miyazoe, Hiroyuki and Rodbell, Kenneth P and Shahidi, Ghavam G
US Patent 20,150,348,832
Sidewall image transfer for heavy metal patterning in integrated circuits
Brink, Markus and Guillorn, Michael A and Hoinkis, Mark D and Joseph, Eric A and Miyazoe, Hiroyuki and To, Bang N
US Patent 9,171,796
Brink, Markus and Guillorn, Michael A and Hoinkis, Mark D and Joseph, Eric A and Miyazoe, Hiroyuki and To, Bang N
US Patent 9,171,796
SELECTIVE SPUTTERING FOR PATTERN TRANSFER
Mark Hoinkis, Hiroyuki Miyazoe, Eric Joseph
US Patent 20,150,014,152
Mark Hoinkis, Hiroyuki Miyazoe, Eric Joseph
US Patent 20,150,014,152
2014
Niederenergie-Atzverfahren fur eine stickstoffhaltige dielektrische Schicht
Brink Markus, Bruce Robert L, Engelmann Sebastian U, Fuller Nicholas C M, Miyazoe Hiroyuki, Nakamura Masahiro
polymer chemistry, chemistry
Abstract
Brink Markus, Bruce Robert L, Engelmann Sebastian U, Fuller Nicholas C M, Miyazoe Hiroyuki, Nakamura Masahiro
polymer chemistry, chemistry
Abstract
Strukturierung mit hoher Wiedergabetreue unter Verwendung eines Fluorkohlenwasserstoff enthaltenden Polymers
Brink Markus, Engelmann Sebastian U, Fuller Nicholas C M, Guillorn Michael A, Nakamura Masahiro, Miyazoe Hiroyuki
polymer chemistry, chemistry
Abstract
Brink Markus, Engelmann Sebastian U, Fuller Nicholas C M, Guillorn Michael A, Nakamura Masahiro, Miyazoe Hiroyuki
polymer chemistry, chemistry
Abstract
FABRICATING A SMALL-SCALE RADIATION DETECTOR
Michael S Gordon, Christopher V Jahnes, Eric A Joseph, Hiroyuki Miyazoe, Kenneth P Rodbell, Arun Sharma, Sri M Sri-jayantha
US Patent 20,140,329,351
Michael S Gordon, Christopher V Jahnes, Eric A Joseph, Hiroyuki Miyazoe, Kenneth P Rodbell, Arun Sharma, Sri M Sri-jayantha
US Patent 20,140,329,351
COPPER RESIDUE CHAMBER CLEAN
Mark Hoinkis, Chun Yan, Hiroyuki Miyazoe, Eric Joseph
US Patent 20,140,345,645
Mark Hoinkis, Chun Yan, Hiroyuki Miyazoe, Eric Joseph
US Patent 20,140,345,645
Sputter and surface modification etch processing for metal patterning in integrated circuits
Cyril Cabral, Benjamin L Fletcher, Nicholas CM Fuller, Eric A Joseph, Hiroyuki Miyazoe
US Patent 8,633,117
Cyril Cabral, Benjamin L Fletcher, Nicholas CM Fuller, Eric A Joseph, Hiroyuki Miyazoe
US Patent 8,633,117
2013
Low-Temperature Sidewall Image Transfer Process Using ALD Metals, Metal Oxides and Metal Nitrides
Brink, Markus and Guillorn, Michael A and Engelmann, Sebastian U and Miyazoe, Hiroyuki and Pyzyna, Adam M and Sleight, Jeffrey W
US Patent App. 13/916,109
Brink, Markus and Guillorn, Michael A and Engelmann, Sebastian U and Miyazoe, Hiroyuki and Pyzyna, Adam M and Sleight, Jeffrey W
US Patent App. 13/916,109
Subtractive plasma etching of a blanket layer of metal or metal alloy
Nicholas CM Fuller, Eric A Joseph, Hiroyuki Miyazoe, Mark Hoinkis, Chun Yan
US Patent App. 13/838,763
Nicholas CM Fuller, Eric A Joseph, Hiroyuki Miyazoe, Mark Hoinkis, Chun Yan
US Patent App. 13/838,763
Self-Aligned Pitch Split For Unidirectional Metal Wiring
Josephine B Chang, Michael A Guillorn, Eric A Joseph, Hiroyuki Miyazoe
US Patent App. 13/793,859
Josephine B Chang, Michael A Guillorn, Eric A Joseph, Hiroyuki Miyazoe
US Patent App. 13/793,859
Sputter etch processing for heavy metal patterning in integrated circuits
Mark D Hoinkis, Eric A Joseph, Hiroyuki Miyazoe, Chun Yan
US Patent App. 13/836,739
Mark D Hoinkis, Eric A Joseph, Hiroyuki Miyazoe, Chun Yan
US Patent App. 13/836,739
2012
Tone inversion of self-assembled self-aligned structures
Michael A Guillorn, Steven J Holmes, Chi-chun Liu, Hiroyuki Miyazoe, Hsinyu Tsai
US Patent App. 13/587,088
Michael A Guillorn, Steven J Holmes, Chi-chun Liu, Hiroyuki Miyazoe, Hsinyu Tsai
US Patent App. 13/587,088
2011
METHOD OF SYNTHESIZING DIAMONDOIDS, AND DIAMONDOID
Kazuo TERASHIMA, STAUSS Sven Nico, Hiroyuki MIYAZOE, Takehiko SASAKI, Hirokazu KIKUCHI, Koya SAITO, Tomoki SHIZUNO, others
WO Patent 2,011,099,351
Kazuo TERASHIMA, STAUSS Sven Nico, Hiroyuki MIYAZOE, Takehiko SASAKI, Hirokazu KIKUCHI, Koya SAITO, Tomoki SHIZUNO, others
WO Patent 2,011,099,351
Low energy etch process for nitrogen-containing dielectric layer
M Brink, RL Bruce, SU Engelmann, NCM Fuller, H Miyazoe, M Nakamura
M Brink, RL Bruce, SU Engelmann, NCM Fuller, H Miyazoe, M Nakamura
High fidelity patterning employing a fluorohydrocarbon-containing polymer
M Brink, SU Engelmann, NCM Fuller, MA Guillorn, H Miyazoe, M Nakamura
M Brink, SU Engelmann, NCM Fuller, MA Guillorn, H Miyazoe, M Nakamura