Sebastian Engelmann
contact information
Quantum Systems Component LeadThomas J. Watson Research Center, Yorktown Heights, NY USA +1
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Professional Associations
Professional Associations: American Vacuum Society | SPIE -- International Society of Optical Engineeringmore information
More information: Prof. Oehrlein, Univ. of Maryland, College Park | Prof. Shohet - Univ. of Wisconsin, Madison | Plasma-surface interactions for Photoresist Systems | Linked-in profile2021
Effect of surface temperature on GeSbTe damage formation during plasma processing
Luxherta Buzi, John Papalia, Hiroyuki Miyazoe, Huai-Yu Cheng, Marinus Hopstaken, Robert Bruce, Sebastian Engelmann
Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series11615, 38-43, SPIE, 2021
Luxherta Buzi, John Papalia, Hiroyuki Miyazoe, Huai-Yu Cheng, Marinus Hopstaken, Robert Bruce, Sebastian Engelmann
Society of Photo-Optical Instrumentation Engineers (SPIE) Conference Series11615, 38-43, SPIE, 2021
Etching with electron beam-generated plasmas: Selectivity versus ion energy in silicon-based films
S. G. Walton, D. R. Boris, S. G. Rosenberg, H. Miyazoe, E. A. Joseph, S. U. Engelmann
Journal of Vacuum Science and Technology 39(3), American Vacuum SocietyAVS, 2021
S. G. Walton, D. R. Boris, S. G. Rosenberg, H. Miyazoe, E. A. Joseph, S. U. Engelmann
Journal of Vacuum Science and Technology 39(3), American Vacuum SocietyAVS, 2021
Resistive Memory Process Optimization for High Resistance Switching Toward Scalable Analog Compute Technology for Deep Learning
Y. Kim, S.-C. Seo, S. Consiglio, P. Jamison, H. Higuchi, M. Rasch, E. Y. Wu, D. Kong, I. Saraf, C. Catano, R. Muralidhar, S. Nguyen, S. DeVries, O. Van der Straten, M. Sankarapandian, R. N. Pujari, A. Gasasira, S. M. Mcdermott, H. Miyazoe, D. Koty, Q. Yang, H. Yan, R. Clark, K. Tapily, S. Engelmann, R. R. Robison, C. Wajda, A. Mosden, T. Tsunomura, R. Soave, N. Saulnier, W. Haensch, G. Leusink, P. Biolsi, V. Narayanan, T. Ando
IEEE Electron Device Letters 42(5), 759-762, IEEE, 2021
Y. Kim, S.-C. Seo, S. Consiglio, P. Jamison, H. Higuchi, M. Rasch, E. Y. Wu, D. Kong, I. Saraf, C. Catano, R. Muralidhar, S. Nguyen, S. DeVries, O. Van der Straten, M. Sankarapandian, R. N. Pujari, A. Gasasira, S. M. Mcdermott, H. Miyazoe, D. Koty, Q. Yang, H. Yan, R. Clark, K. Tapily, S. Engelmann, R. R. Robison, C. Wajda, A. Mosden, T. Tsunomura, R. Soave, N. Saulnier, W. Haensch, G. Leusink, P. Biolsi, V. Narayanan, T. Ando
IEEE Electron Device Letters 42(5), 759-762, IEEE, 2021
Plasma processing for advanced microelectronics beyond CMOS
N. Marchack, L. Buzi, D. B. Farmer, H. Miyazoe, J. M. Papalia, H. Yan, G. Totir, S. U. Engelmann
Journal of Applied Physics 130(8), 080901, 2021
N. Marchack, L. Buzi, D. B. Farmer, H. Miyazoe, J. M. Papalia, H. Yan, G. Totir, S. U. Engelmann
Journal of Applied Physics 130(8), 080901, 2021
2020
Significance of plasma-photoresist interactions for atomic layer etching processes with extreme ultraviolet photoresist
Adam Pranda, Kang-Yi Lin, Sebastian Engelmann, Robert L. Bruce, Eric A. Joseph, Dominik Metzler, Gottlieb S. Oehrlein
Journal of Vacuum Science and Technology 38(5), 2020
Adam Pranda, Kang-Yi Lin, Sebastian Engelmann, Robert L. Bruce, Eric A. Joseph, Dominik Metzler, Gottlieb S. Oehrlein
Journal of Vacuum Science and Technology 38(5), 2020
Hydrocarbon layer formation and removal studies on SiN films etched in halogen/hydrofluorocarbon plasmas
Luxherta Buzi, John M. Papalia, Mahmoud M. Khojasteh, Hiroyuki Miyazoe, Marinus Hopstaken, Steve Molis, Robert L. Bruce, Sebastian U. Engelmann
SPIE Advanced Lithography 2019, 2020
Luxherta Buzi, John M. Papalia, Mahmoud M. Khojasteh, Hiroyuki Miyazoe, Marinus Hopstaken, Steve Molis, Robert L. Bruce, Sebastian U. Engelmann
SPIE Advanced Lithography 2019, 2020
Control of surface oxide formation in plasma-enhanced quasiatomic layer etching of tantalum nitride
Nathan Marchack, Jon-l Innocent-Dolor, Marinus Hopstaken, Sebastian Engelmann
Journal of Vacuum Science & Technology A 38(2), 022609, 2020
Nathan Marchack, Jon-l Innocent-Dolor, Marinus Hopstaken, Sebastian Engelmann
Journal of Vacuum Science & Technology A 38(2), 022609, 2020
Utilizing photosensitive polymers to evaluate UV radiation exposures in different plasma chamber configurations
Luxherta Buzi, Hiroyuki Miyazoe, Matthew. P. Sagianis, Nathan Marchack, John M. Papalia, Sebastian. U. Engelmann
Journal of Vacuum Science \& Technology A 38(3), 033006, 2020
Luxherta Buzi, Hiroyuki Miyazoe, Matthew. P. Sagianis, Nathan Marchack, John M. Papalia, Sebastian. U. Engelmann
Journal of Vacuum Science \& Technology A 38(3), 033006, 2020
Advances in Interfacing Optical Fibers to Nanophotonic Waveguides Via Mechanically Compliant Polymer Waveguides
Tymon Barwicz, Swetha Kamlapurkar, Sebastian Engelmann, Paul Fortier, Nicolas Boyer, Alexander Janta-Polczynski, Shotaro Takenobu, Kengo Watanabe, Richard Langlois, Yoichi Taira, Katsuki Suematsu, Hidetoshi Numata, Bo Peng
IEEE Journal of Selected Topics in Quantum Electronics 26(2), 1-12, 2020
Tymon Barwicz, Swetha Kamlapurkar, Sebastian Engelmann, Paul Fortier, Nicolas Boyer, Alexander Janta-Polczynski, Shotaro Takenobu, Kengo Watanabe, Richard Langlois, Yoichi Taira, Katsuki Suematsu, Hidetoshi Numata, Bo Peng
IEEE Journal of Selected Topics in Quantum Electronics 26(2), 1-12, 2020
Selective atomic layer etching of HfO2 over silicon by precursor and substrate-dependent selective deposition
Kang-Yi Lin, Chen Li, Sebastian Engelmann, Robert L. Bruce, Eric A. Joseph, Dominik Metzler, Gottlieb S. Oehrlein
Journal of Vacuum Science and Technology 38(3), 2020
Kang-Yi Lin, Chen Li, Sebastian Engelmann, Robert L. Bruce, Eric A. Joseph, Dominik Metzler, Gottlieb S. Oehrlein
Journal of Vacuum Science and Technology 38(3), 2020
2019
Special Section Guest Editorial: Challenges and Approaches to EUV-Based Patterning for High-Volume Manufacturing Applications
Sebastian Engelmann, Rich Wise, Roel Gronheid, Nelson Felix
Journal of Micro-nanolithography Mems and Moems 18(1), 2019
Sebastian Engelmann, Rich Wise, Roel Gronheid, Nelson Felix
Journal of Micro-nanolithography Mems and Moems 18(1), 2019
Integrated Metamaterial Interfaces for Self-Aligned Fiber-to-Chip Coupling in Volume Manufacturing
Tymon Barwicz, Bo Peng, Robert Leidy, Alexander Janta-Polczynski, Thomas Houghton, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Paul Fortier, Nicolas Boyer, William M. J. Green
IEEE Journal of Selected Topics in Quantum Electronics 25(3), 1-13, 2019
Tymon Barwicz, Bo Peng, Robert Leidy, Alexander Janta-Polczynski, Thomas Houghton, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Paul Fortier, Nicolas Boyer, William M. J. Green
IEEE Journal of Selected Topics in Quantum Electronics 25(3), 1-13, 2019
Silicon Photonic Gas Sensing
William M. J. Green, Eric J. Zhang, Chi Xiong, Yves Martin, Jason Orcutt, Martin Glodde, Laurent Schares, Tymon Barwicz, Chu C. Teng, Nathan Marchack, Elizabeth Duch, Swetha Kamlapurkar, Sebastian Engelmann, Nigel Hinds, Tom Picunko, Russell Wilson, Gerard Wysocki
Optical Fiber Communication Conference (OFC) 2019, pp. M2J.5, Optical Society of America
William M. J. Green, Eric J. Zhang, Chi Xiong, Yves Martin, Jason Orcutt, Martin Glodde, Laurent Schares, Tymon Barwicz, Chu C. Teng, Nathan Marchack, Elizabeth Duch, Swetha Kamlapurkar, Sebastian Engelmann, Nigel Hinds, Tom Picunko, Russell Wilson, Gerard Wysocki
Optical Fiber Communication Conference (OFC) 2019, pp. M2J.5, Optical Society of America
Utilizing surface modification in plasma-enhanced cyclic etching of tantalum nitride to surpass lithographic limits
Nathan Marchack, Keith Hernandez, Benjamin Walusiak, Jon-l Innocent-Dolor, Sebastian Engelmann
Plasma Processes and Polymers, e1900008, 2019
Nathan Marchack, Keith Hernandez, Benjamin Walusiak, Jon-l Innocent-Dolor, Sebastian Engelmann
Plasma Processes and Polymers, e1900008, 2019
2018
Compliant Polymer Interface Demonstration with Standard Plug-In Connection to Fiber Cables
Tymon Barwicz, Kengo Watanabe, Richard Langlois, Katsuki Suematsu, Nathalie Normand, Shotaro Takenobu, Alexander Janta-Polczynski, Bo Peng, Yoichi Taira, Hidetoshi Numata, Swetha Kamlapurkar, Sebastian Engelmann, Nicolas Boyer
2018 IEEE Photonics Conference (IPC)
Tymon Barwicz, Kengo Watanabe, Richard Langlois, Katsuki Suematsu, Nathalie Normand, Shotaro Takenobu, Alexander Janta-Polczynski, Bo Peng, Yoichi Taira, Hidetoshi Numata, Swetha Kamlapurkar, Sebastian Engelmann, Nicolas Boyer
2018 IEEE Photonics Conference (IPC)
Breaking the mold of photonic packaging
Tymon Barwicz, Ted W. Lichoulas, Yoichi Taira, Yves Martin, Shotaro Takenobu, Alexander Janta-Polczynski, Hidetoshi Numata, Eddie L. Kimbrell, Jae-Woong Nah, Bo Peng, Darrell Childers, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Elaine Cyr, Sebastian Engelmann, Paul Fortier, Nicolas Boyer
Integrated Optics: Devices, Materials, and Technologies XXII10535, 2018
Tymon Barwicz, Ted W. Lichoulas, Yoichi Taira, Yves Martin, Shotaro Takenobu, Alexander Janta-Polczynski, Hidetoshi Numata, Eddie L. Kimbrell, Jae-Woong Nah, Bo Peng, Darrell Childers, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Elaine Cyr, Sebastian Engelmann, Paul Fortier, Nicolas Boyer
Integrated Optics: Devices, Materials, and Technologies XXII10535, 2018
Towards co-packaging of photonics and microelectronics in existing manufacturing facilities
Alexander Janta-Polczynski, Elaine Cyr, Jerome Bougie, Alain Drouin, Richard Langlois, Darrell Childers, Shotaro Takenobu, Yoichi Taira, Ted W. Lichoulas, Swetha Kamlapurkar, Sebastian Engelmann, Paul Fortier, Nicolas Boyer, Tymon Barwicz
Optical Interconnects XVIII10538, 2018
Alexander Janta-Polczynski, Elaine Cyr, Jerome Bougie, Alain Drouin, Richard Langlois, Darrell Childers, Shotaro Takenobu, Yoichi Taira, Ted W. Lichoulas, Swetha Kamlapurkar, Sebastian Engelmann, Paul Fortier, Nicolas Boyer, Tymon Barwicz
Optical Interconnects XVIII10538, 2018
Automated, high-throughput photonic packaging
Tymon Barwicz, Ted W. Lichoulas, Yoichi Taira, Yves Martin, Shotaro Takenobu, Alexander Janta-Polczynski, Hidetoshi Numata, Eddie L. Kimbrell, Jae-Woong Nah, Bo Peng, Darrell Childers, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Elaine Cyr, Sebastian Engelmann, Paul Fortier, Nicolas Boyer
Optical Fiber Technology44, 24-35, 2018
Tymon Barwicz, Ted W. Lichoulas, Yoichi Taira, Yves Martin, Shotaro Takenobu, Alexander Janta-Polczynski, Hidetoshi Numata, Eddie L. Kimbrell, Jae-Woong Nah, Bo Peng, Darrell Childers, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Elaine Cyr, Sebastian Engelmann, Paul Fortier, Nicolas Boyer
Optical Fiber Technology44, 24-35, 2018
Experimental realization of deep-subwavelength confinement in dielectric optical resonators
Shuren Hu, Marwan Khater, Rafael Salas-Montiel, Ernst Kratschmer, Sebastian Engelmann, William M. J. Green, Sharon M. Weiss
Science Advances 4(8), 2018
Shuren Hu, Marwan Khater, Rafael Salas-Montiel, Ernst Kratschmer, Sebastian Engelmann, William M. J. Green, Sharon M. Weiss
Science Advances 4(8), 2018
Achieving ultrahigh etching selectivity of SiO2 over Si3N4 and Si in atomic layer etching by exploiting chemistry of complex hydrofluorocarbon precursors
Kang-Yi Lin, Chen Li, Sebastian Engelmann, Robert L. Bruce, Eric A. Joseph, Dominik Metzler, Gottlieb S. Oehrlein
Journal of Vacuum Science and Technology 36(4), 2018
Kang-Yi Lin, Chen Li, Sebastian Engelmann, Robert L. Bruce, Eric A. Joseph, Dominik Metzler, Gottlieb S. Oehrlein
Journal of Vacuum Science and Technology 36(4), 2018
Advanced Etch Technology for Nanopatterning VII
Engelmann, Sebastian U and Wise, Richard S
Proc. of SPIE Vol, pp. 1058901--1, 2018
Engelmann, Sebastian U and Wise, Richard S
Proc. of SPIE Vol, pp. 1058901--1, 2018
Localization and quantification of trace-gas fugitive emissions using a portable optical spectrometer
Eric J. Zhang, Chu. C. Teng, Theodore G. van Kessel, Levente Klein, Ramachandran Muralidhar, Chi Xiong, Yves Martin, Jason S. Orcutt, Marwan Khater, Laurent Schares, Tymon Barwicz, Nathan Marchack, Swetha Kamlapurkar, Sebastian U. Engelmann, Gerard Wysock
Chemical, Biological, Radiological, Nuclear, and Explosives (CBRNE) Sensing XIX, pp. 106290Y, International Society for Optics and Photonics, 2018
Eric J. Zhang, Chu. C. Teng, Theodore G. van Kessel, Levente Klein, Ramachandran Muralidhar, Chi Xiong, Yves Martin, Jason S. Orcutt, Marwan Khater, Laurent Schares, Tymon Barwicz, Nathan Marchack, Swetha Kamlapurkar, Sebastian U. Engelmann, Gerard Wysock
Chemical, Biological, Radiological, Nuclear, and Explosives (CBRNE) Sensing XIX, pp. 106290Y, International Society for Optics and Photonics, 2018
2017
Experimental Realization of Deep Subwavelength Confinement in Dielectric Optical Resonators
S. Hu, M. Khater, R. Salas-Montiel, E. Kratschmer, S. Engelmann, W. M. J. Green, S. M. Weiss
arXiv preprint arXiv:1707.04672, 2017
S. Hu, M. Khater, R. Salas-Montiel, E. Kratschmer, S. Engelmann, W. M. J. Green, S. M. Weiss
arXiv preprint arXiv:1707.04672, 2017
Electron beam generated plasmas: Characteristics and etching of silicon nitride
Walton, SG and Boris, DR and Hern{\'a}ndez, SC and Lock, EH and Petrova, Tz B and Petrov, GM and Jagtiani, AV and Engelmann, SU and Miyazoe, H and Joseph, EA
Microelectronic Engineering168, 89--96, Elsevier, 2017
Walton, SG and Boris, DR and Hern{\'a}ndez, SC and Lock, EH and Petrova, Tz B and Petrov, GM and Jagtiani, AV and Engelmann, SU and Miyazoe, H and Joseph, EA
Microelectronic Engineering168, 89--96, Elsevier, 2017
Reducing LER in Si and SiN through plasma etch chemistry optimization for photonic waveguide applications
Nathan Marchack, Marwan Khater, Jason Orcutt, Josephine Chang, Steven Holmes, Tymon Barwicz, Swetha Kamlapurkar, William Green, Sebastian Engelmann
Proc. SPIE10149, 101490F-101490F-10, 2017
Nathan Marchack, Marwan Khater, Jason Orcutt, Josephine Chang, Steven Holmes, Tymon Barwicz, Swetha Kamlapurkar, William Green, Sebastian Engelmann
Proc. SPIE10149, 101490F-101490F-10, 2017
High Performance and Record Subthreshold Swing Demonstration in Scaled RMG SiGe FinFETs with High-Ge-Content Channels Formed by 3D Condensation and a Novel Gate Stack Process
P. Hashemi, T. Ando, S. Koswatta, E. Cartier, J. A. Ott, C.-H. Lee*, K.-L. Lee, J. Bruley, M. F. Lofaro, K. K. Chan, S. U. Engelmann, E. Leobandung, V. Narayanan and R. T. Mo
VLSI Tech. Symp., 2017
P. Hashemi, T. Ando, S. Koswatta, E. Cartier, J. A. Ott, C.-H. Lee*, K.-L. Lee, J. Bruley, M. F. Lofaro, K. K. Chan, S. U. Engelmann, E. Leobandung, V. Narayanan and R. T. Mo
VLSI Tech. Symp., 2017
Methane trace-gas sensing enabled by silicon photonic integration
William Green, Chi Xiong, Marwan Khater, Yves Martin, Eric Zhang, Chu Teng, Jason Orcutt, Laurent Schares, Tymon Barwicz, Nathan Marchack, Steven Holmes, Swetha Kamlapurkar, Sebastian Engelmann, Gerard Wysocki
European Materials Research Society Spring Meeting, P.17.1, 2017
William Green, Chi Xiong, Marwan Khater, Yves Martin, Eric Zhang, Chu Teng, Jason Orcutt, Laurent Schares, Tymon Barwicz, Nathan Marchack, Steven Holmes, Swetha Kamlapurkar, Sebastian Engelmann, Gerard Wysocki
European Materials Research Society Spring Meeting, P.17.1, 2017
Etching with Low Te Plasmas
Walton, Scott G and Boris, David R and Hernandez, Sandra Catalina and Rosenberg, Samantha G and Miyazoe, Hiroyuki and Jagtiani, Ashish V and Engelmann, Sebastian U and Joseph, Eric A
Meeting Abstracts, pp. 1085--1085, 2017
Walton, Scott G and Boris, David R and Hernandez, Sandra Catalina and Rosenberg, Samantha G and Miyazoe, Hiroyuki and Jagtiani, Ashish V and Engelmann, Sebastian U and Joseph, Eric A
Meeting Abstracts, pp. 1085--1085, 2017
Advanced Etch Technology for Nanopatterning VI
Engelmann, Sebastian and Wise, Richard S
Proc. of SPIE Vol, pp. 1014901--1, 2017
Engelmann, Sebastian and Wise, Richard S
Proc. of SPIE Vol, pp. 1014901--1, 2017
Nitride etching with hydrofluorocarbons. I. Selective etching of nitride over silicon and oxide materials by gas discharge optimization and selective deposition of fluorocarbon polymer
Engelmann, Sebastian U and Bruce, Robert L and Joseph, Eric A and Fuller, Nicholas CM and Graham, William S and Sikorski, Edmund M and Kohjasteh, Mahmoud and Zhu, Yu and Nakamura, Masahiro and Ito, Azumi and others
Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena 35(5), 051803, AVS, 2017
Engelmann, Sebastian U and Bruce, Robert L and Joseph, Eric A and Fuller, Nicholas CM and Graham, William S and Sikorski, Edmund M and Kohjasteh, Mahmoud and Zhu, Yu and Nakamura, Masahiro and Ito, Azumi and others
Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena 35(5), 051803, AVS, 2017
Novel, High-Throughput, Fiber-to-Chip Assembly Employing Only Off-the-Shelf Components
Boyer, Nicolas and Janta-Polczynski, Alexander and Morissette, Jean-Fran{\c{c}}ois and Martel, Stephan and Lichoulas, Ted W and Kamlapurkar, Swetha and Engelmann, Sebastian and Fortier, Paul and Barwicz, Tymon
Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, pp. 1632--1639
Boyer, Nicolas and Janta-Polczynski, Alexander and Morissette, Jean-Fran{\c{c}}ois and Martel, Stephan and Lichoulas, Ted W and Kamlapurkar, Swetha and Engelmann, Sebastian and Fortier, Paul and Barwicz, Tymon
Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th, pp. 1632--1639
Highly selective dry etching of polystyrene-poly (methyl methacrylate) block copolymer by gas pulsing carbon monoxide-based plasmas
Miyazoe, Hiroyuki and Jagtiani, Ashish V and Tsai, Hsin-Yu and Engelmann, Sebastian U and Joseph, Eric A
Journal of Physics D: Applied Physics 50(20), 204001, IOP Publishing, 2017
Miyazoe, Hiroyuki and Jagtiani, Ashish V and Tsai, Hsin-Yu and Engelmann, Sebastian U and Joseph, Eric A
Journal of Physics D: Applied Physics 50(20), 204001, IOP Publishing, 2017
Bowtie Photonic Crystal with Deep Subwavelength Mode Confinement in a Dielectric Material
Hu, Shuren and Khater, Marwan and Salas-Montiel, Rafael and Kratschmer, Ernst and Engelmann, Sebastian and Green, William and Weiss, Sharon M
CLEO: QELS\_Fundamental Science, pp. FTh3H--2, 2017
Hu, Shuren and Khater, Marwan and Salas-Montiel, Rafael and Kratschmer, Ernst and Engelmann, Sebastian and Green, William and Weiss, Sharon M
CLEO: QELS\_Fundamental Science, pp. FTh3H--2, 2017
High-throughput photonic packaging
Barwicz, Tymon and Lichoulas, Ted W and Taira, Yoichi and Martin, Yves and Takenobu, Shotaro and Janta-Polczynski, Alexander and Numata, Hidetoshi and Kimbrell, Eddie L and Nah, Jae-Woong and Peng, Bo and others
Optical Fiber Communications Conference and Exhibition (OFC), 2017, pp. 1--3
Barwicz, Tymon and Lichoulas, Ted W and Taira, Yoichi and Martin, Yves and Takenobu, Shotaro and Janta-Polczynski, Alexander and Numata, Hidetoshi and Kimbrell, Eddie L and Nah, Jae-Woong and Peng, Bo and others
Optical Fiber Communications Conference and Exhibition (OFC), 2017, pp. 1--3
Effects of ultraviolet and vacuum ultraviolet synchrotron radiation on organic underlayers to modulate line-edge roughness of fine-pitch poly-silicon patterns
Miyazoe, Hiroyuki and Engelmann, Sebastian U and Guillorn, Michael A and Pei, Dongfei and Li, Weiyi and Lauer, Jason L and Leon Shohet, J and Fuller, Nicholas CM
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 35(5), 05C306, AVS, 2017
Miyazoe, Hiroyuki and Engelmann, Sebastian U and Guillorn, Michael A and Pei, Dongfei and Li, Weiyi and Lauer, Jason L and Leon Shohet, J and Fuller, Nicholas CM
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 35(5), 05C306, AVS, 2017
High performance PMOS with strained high-Ge-content SiGe fins for advanced logic applications
Hashemi, Pouya and Ando, Takashi and Balakrishnan, Karthik and Koswatta, Siyuranga and Lee, Kam-Leung and Ott, John A and Chan, Kevin and Bruley, John and Engelmann, Sebastian U and Narayanan, Vijay and others
VLSI Technology, Systems and Application (VLSI-TSA), 2017 International Symposium on, pp. 1--2
Hashemi, Pouya and Ando, Takashi and Balakrishnan, Karthik and Koswatta, Siyuranga and Lee, Kam-Leung and Ott, John A and Chan, Kevin and Bruley, John and Engelmann, Sebastian U and Narayanan, Vijay and others
VLSI Technology, Systems and Application (VLSI-TSA), 2017 International Symposium on, pp. 1--2
A silicon metamaterial chip-to-chip coupler for photonic flip-chip applications
Barwicz, Tymon and Kamlapurkar, Swetha and Martin, Yves and Bruce, Robert L and Engelmann, Sebastian
Optical Fiber Communication Conference, pp. Th2A--39, 2017
Barwicz, Tymon and Kamlapurkar, Swetha and Martin, Yves and Bruce, Robert L and Engelmann, Sebastian
Optical Fiber Communication Conference, pp. Th2A--39, 2017
Cyclic Cl2/H2 quasi-atomic layer etching approach for TiN and TaN patterning using organic masks
Nathan Marchack, John M. Papalia, Sebastian Engelmann, Eric A. Joseph
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 35(5), 05C314, 2017
Nathan Marchack, John M. Papalia, Sebastian Engelmann, Eric A. Joseph
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 35(5), 05C314, 2017
Directed self-assembly patterning strategies for phase change memory applications
Bruce, Robert L and Fraczak, Gloria and Papalia, John M and Tsai, HsinYu and BrightSky, Matt and Miyazoe, Hiroyuki and Zhu, Yu and Engelmann, Sebastian U and Lung, Hsiang-Lan and Masuda, Takeshi and others
SPIE Advanced Lithography, pp. 101490J--101490J, 2017
Bruce, Robert L and Fraczak, Gloria and Papalia, John M and Tsai, HsinYu and BrightSky, Matt and Miyazoe, Hiroyuki and Zhu, Yu and Engelmann, Sebastian U and Lung, Hsiang-Lan and Masuda, Takeshi and others
SPIE Advanced Lithography, pp. 101490J--101490J, 2017
Characterizing fluorocarbon assisted atomic layer etching of Si using cyclic Ar/C4F8 and Ar/CHF3 plasma
Metzler, Dominik and Li, Chen and Engelmann, Sebastian and Bruce, Robert L and Joseph, Eric A and Oehrlein, Gottlieb S
The Journal of Chemical Physics 146(5), 052801, AIP Publishing, 2017
Metzler, Dominik and Li, Chen and Engelmann, Sebastian and Bruce, Robert L and Joseph, Eric A and Oehrlein, Gottlieb S
The Journal of Chemical Physics 146(5), 052801, AIP Publishing, 2017
2016
Ge-on-insulator lateral bipolar transistors
J.-B. Yau, J. Yoon, J. Cai, T. H. Ning, K. K. Chan, S. U. Engelmann, D.-G. Park, R. T. Mo, G. Shahidi
2016 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), pp. 130-133
J.-B. Yau, J. Yoon, J. Cai, T. H. Ning, K. K. Chan, S. U. Engelmann, D.-G. Park, R. T. Mo, G. Shahidi
2016 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), pp. 130-133
Demonstration of self-aligned flip-chip photonic assembly with 1.1dB loss and > 120nm bandwidth
Tymon Barwicz, Yves Martin, Jae Woong Nah, Swetha Kamlapurkar, Robert L. Bruce, Sebastian Engelmann, Yurii A. Vlasov
Frontiers in Optics, FiO 2016
photonics, materials science, flip chip, electronic engineering, bandwidth
Tymon Barwicz, Yves Martin, Jae Woong Nah, Swetha Kamlapurkar, Robert L. Bruce, Sebastian Engelmann, Yurii A. Vlasov
Frontiers in Optics, FiO 2016
photonics, materials science, flip chip, electronic engineering, bandwidth
Advanced Etch Technology for Nanopatterning V
Qinghuang Lin; Sebastian U. Engelmann
SPIE Advanced Lithography Conference, SPIE, 2016
Qinghuang Lin; Sebastian U. Engelmann
SPIE Advanced Lithography Conference, SPIE, 2016
Applications for Surface Engineering Using Atomic Layer Etching-Invited Paper
Papalia, John and Marchack, Nathan and Bruce, Robert and Miyazoe, Hiroyuki and Engelmann, Sebastian and Joseph, Eric A
Solid State Phenomena, pp. 41--48, 2016
Papalia, John and Marchack, Nathan and Bruce, Robert and Miyazoe, Hiroyuki and Engelmann, Sebastian and Joseph, Eric A
Solid State Phenomena, pp. 41--48, 2016
Evaluation of ALE processes for patterning
Papalia, JM and Marchack, N and Bruce, RL and Miyazoe, H and Engelmann, SU and Joseph, EA
SPIE Advanced Lithography, pp. 97820H--97820H, 2016
Papalia, JM and Marchack, N and Bruce, RL and Miyazoe, H and Engelmann, SU and Joseph, EA
SPIE Advanced Lithography, pp. 97820H--97820H, 2016
Prospects of High-Ge-Content Strained SiGe for Advanced FinFET Generations
Hashemi, Pouya and Balakrishnan, Karthik and Ando, Takashi and Bruley, John and Ott, John A and Engelmann, Sebastian and Chan, Kevin and Lee, Kam-Leung and Park, Dae-Gyu and Mo, Renee T and others
ECS Transactions 75(8), 39--50, The Electrochemical Society, 2016
Hashemi, Pouya and Balakrishnan, Karthik and Ando, Takashi and Bruley, John and Ott, John A and Engelmann, Sebastian and Chan, Kevin and Lee, Kam-Leung and Park, Dae-Gyu and Mo, Renee T and others
ECS Transactions 75(8), 39--50, The Electrochemical Society, 2016
A compliant polymer interface with 1.4 dB loss between standard fibers and nanophotonic waveguides
Barwicz, Tymon and Janta-Polczynski, Alexander and Takenobu, Shotaro and Morissette, Jean-Francois and Peng, Bo and Taira, Yoichi and Numata, Hidetoshi and Kamlapurkar, Swetha and Engelmann, Sebastian and Fortier, Paul and others
Frontiers in Optics, pp. FTu1D--2, 2016
Barwicz, Tymon and Janta-Polczynski, Alexander and Takenobu, Shotaro and Morissette, Jean-Francois and Peng, Bo and Taira, Yoichi and Numata, Hidetoshi and Kamlapurkar, Swetha and Engelmann, Sebastian and Fortier, Paul and others
Frontiers in Optics, pp. FTu1D--2, 2016
Sub-micron bondline-shape control in automated assembly of photonic devices
Boyer, Nicolas and Janta-Polczynski, Alexander and Morissette, Jean-Francois and Kamlapurkar, Swetha and Engelmann, Sebastian and Taira, Yoichi and Takenobu, Shotaro and Numata, Hidetoshi and Fortier, Paul and Barwicz, Tymon
Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th, pp. 2257--2263
Boyer, Nicolas and Janta-Polczynski, Alexander and Morissette, Jean-Francois and Kamlapurkar, Swetha and Engelmann, Sebastian and Taira, Yoichi and Takenobu, Shotaro and Numata, Hidetoshi and Fortier, Paul and Barwicz, Tymon
Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th, pp. 2257--2263
A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities
Barwicz, Tymon and Taira, Yoichi and Lichoulas, Ted W and Boyer, Nicolas and Martin, Yves and Numata, Hidetoshi and Nah, Jae-Woong and Takenobu, Shotaro and Janta-Polczynski, Alexander and Kimbrell, Eddie L and others
IEEE Journal of Selected Topics in Quantum Electronics 22(6), 455--466, IEEE, 2016
Barwicz, Tymon and Taira, Yoichi and Lichoulas, Ted W and Boyer, Nicolas and Martin, Yves and Numata, Hidetoshi and Nah, Jae-Woong and Takenobu, Shotaro and Janta-Polczynski, Alexander and Kimbrell, Eddie L and others
IEEE Journal of Selected Topics in Quantum Electronics 22(6), 455--466, IEEE, 2016
Demonstration of record SiGe transconductance and short-channel current drive in High-Ge-Content SiGe PMOS FinFETs with improved junction and scaled EOT
Hashemi, Pouya and Lee, Kam-Leung and Ando, Takashi and Balakrishnan, Karthik and Ott, John A and Koswatta, Syuranga and Engelmann, Sebastian U and Park, Dae-Gyu and Narayanan, Vijay and Mo, Renee T and others
VLSI Technology, 2016 IEEE Symposium on, pp. 1--2
Hashemi, Pouya and Lee, Kam-Leung and Ando, Takashi and Balakrishnan, Karthik and Ott, John A and Koswatta, Syuranga and Engelmann, Sebastian U and Park, Dae-Gyu and Narayanan, Vijay and Mo, Renee T and others
VLSI Technology, 2016 IEEE Symposium on, pp. 1--2
Demonstration of Self-Aligned Flip-Chip Photonic Assembly with 1.1 dB Loss and> 120nm Bandwidth
Barwicz, Tymon and Martin, Yves and Nah, Jae-Woong and Kamlapurkar, Swetha and Bruce, Robert L and Engelmann, Sebastian and Vlasov, Yurii A
Frontiers in Optics, pp. FF5F--3, 2016
Barwicz, Tymon and Martin, Yves and Nah, Jae-Woong and Kamlapurkar, Swetha and Bruce, Robert L and Engelmann, Sebastian and Vlasov, Yurii A
Frontiers in Optics, pp. FF5F--3, 2016
Toward high-yield 3D self-alignment of flip-chip assemblies via solder surface tension
Martin, Yves and Nah, Jae-Woong and Kamlapurkar, Swetha and Engelmann, Sebastian and Barwicz, Tymon
Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th, pp. 588--594
Martin, Yves and Nah, Jae-Woong and Kamlapurkar, Swetha and Engelmann, Sebastian and Barwicz, Tymon
Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th, pp. 588--594
Evaluation of ALE processes for patterning
J. M. Papalia ; N. Marchack ; R. L. Bruce ; H. Miyazoe ; S. U. Engelmann ; E. A. Joseph
Advanced Etch Technology for Nanopatterning V, 2016
J. M. Papalia ; N. Marchack ; R. L. Bruce ; H. Miyazoe ; S. U. Engelmann ; E. A. Joseph
Advanced Etch Technology for Nanopatterning V, 2016
Fluorocarbon assisted atomic layer etching of SiO2 and Si using cyclic Ar/C4F8 and Ar/CHF3 plasma
Dominik Metzler, Chen Li, Sebastian Engelmann, Robert L Bruce, Eric A Joseph, Gottlieb S Oehrlein,
Journal of Vacuum Science & Technology A 34(1), 01B101, AVS: Science & Technology of Materials, Interfaces, and Processing, 2016
Dominik Metzler, Chen Li, Sebastian Engelmann, Robert L Bruce, Eric A Joseph, Gottlieb S Oehrlein,
Journal of Vacuum Science & Technology A 34(1), 01B101, AVS: Science & Technology of Materials, Interfaces, and Processing, 2016
He plasma pretreatment of organic masking materials for performance improvement during pattern transfer by plasma etching
Dominik Metzler, Florian Weilnboeck, Sebastian Engelmann, Robert L Bruce, and Gottlieb S Oehrlein
Journal of Vacuum Science & Technology B 34(4), 041604, AVS: Science & Technology of Materials, Interfaces, and Processing, 2016
Dominik Metzler, Florian Weilnboeck, Sebastian Engelmann, Robert L Bruce, and Gottlieb S Oehrlein
Journal of Vacuum Science & Technology B 34(4), 041604, AVS: Science & Technology of Materials, Interfaces, and Processing, 2016
A Metamaterial Converter Centered at 1490nm for Interfacing Standard Fibers to Nanophotonic Waveguides
Tymon Barwicz, Nicolas Boyer, Alexander Janta-Polczynski, Jean-Francois Morissette, Yan Thibodeau, Luc Patry, Ted W Lichoulas, Eddie L Kimbrell, Stephan Martel, Swetha Kamlapurkar and others
Optical Fiber Communication Conference, pp. M2I--3, 2016
Tymon Barwicz, Nicolas Boyer, Alexander Janta-Polczynski, Jean-Francois Morissette, Yan Thibodeau, Luc Patry, Ted W Lichoulas, Eddie L Kimbrell, Stephan Martel, Swetha Kamlapurkar and others
Optical Fiber Communication Conference, pp. M2I--3, 2016
Application of cyclic fluorocarbon/argon discharges to device patterning
Dominik Metzler, Kishore Uppireddi, Robert L Bruce, Hiroyuki Miyazoe, Yu Zhu, William Price, Ed S Sikorski, Chen Li, Sebastian U Engelmann, Eric A Joseph and others
Journal of Vacuum Science & Technology A 34(1), 01B102, AVS: Science & Technology of Materials, Interfaces, and Processing, 2016
Dominik Metzler, Kishore Uppireddi, Robert L Bruce, Hiroyuki Miyazoe, Yu Zhu, William Price, Ed S Sikorski, Chen Li, Sebastian U Engelmann, Eric A Joseph and others
Journal of Vacuum Science & Technology A 34(1), 01B102, AVS: Science & Technology of Materials, Interfaces, and Processing, 2016
Initial evaluation and comparison of plasma damage to atomic layer carbon materials using conventional and low Te plasma sources
Ashish V Jagtiani, Hiroyuki Miyazoe, Josephine Chang, Damon B Farmer, Michael Engel, Deborah Neumayer, Shu-Jen Han, Sebastian U Engelmann, David R Boris, Sandra C Hernandez and others
Journal of Vacuum Science & Technology A 34(1), 01B103, AVS: Science & Technology of Materials, Interfaces, and Processing, 2016
Ashish V Jagtiani, Hiroyuki Miyazoe, Josephine Chang, Damon B Farmer, Michael Engel, Deborah Neumayer, Shu-Jen Han, Sebastian U Engelmann, David R Boris, Sandra C Hernandez and others
Journal of Vacuum Science & Technology A 34(1), 01B103, AVS: Science & Technology of Materials, Interfaces, and Processing, 2016
2015
An integrated silicon photonics technology for O-band datacom
Feilchenfeld, NB and Anderson, FG and Barwicz, T and Chilstedt, S and Ding, Y and Ellis-Monaghan, J and Gill, DM and Hedges, C and Hofrichter, J and Horst, F and others
2015 IEEE International Electron Devices Meeting (IEDM), pp. 25--7
Feilchenfeld, NB and Anderson, FG and Barwicz, T and Chilstedt, S and Ding, Y and Ellis-Monaghan, J and Gill, DM and Hedges, C and Hofrichter, J and Horst, F and others
2015 IEEE International Electron Devices Meeting (IEDM), pp. 25--7
Formation of nanometer-thick delaminated amorphous carbon layer by two-step plasma processing of methacrylate-based polymer
Metzler, Dominik and Weilnboeck, Florian and Hernandez, Sandra C and Walton, Scott G and Bruce, Robert L and Engelmann, Sebastian and Salamanca-Riba, Lourdes and Oehrlein, Gottlieb S
Journal of Vacuum Science & Technology B 33(5), 051601, AVS: Science & Technology of Materials, Interfaces, and Processing, 2015
Metzler, Dominik and Weilnboeck, Florian and Hernandez, Sandra C and Walton, Scott G and Bruce, Robert L and Engelmann, Sebastian and Salamanca-Riba, Lourdes and Oehrlein, Gottlieb S
Journal of Vacuum Science & Technology B 33(5), 051601, AVS: Science & Technology of Materials, Interfaces, and Processing, 2015
Automated, self-aligned assembly of 12 fibers per nanophotonic chip with standard microelectronics assembly tooling
Barwicz, Tymon and Boyer, Nicolas and Harel, Stephane and Lichoulas, Ted W and Kimbrell, Eddie L and Janta-Polczynski, Alexander and Kamlapurkar, Swetha and Engelmann, Sebastian and Vlasov, Yurii A and Fortier, Paul
Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th, pp. 775--782
Barwicz, Tymon and Boyer, Nicolas and Harel, Stephane and Lichoulas, Ted W and Kimbrell, Eddie L and Janta-Polczynski, Alexander and Kamlapurkar, Swetha and Engelmann, Sebastian and Vlasov, Yurii A and Fortier, Paul
Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th, pp. 775--782
Flip chip assembly with sub-micron 3D re-alignment via solder surface tension
Nah, Jae-Woong and Martin, Yves and Kamlapurkar, Swetha and Engelmann, Sebastian and Bruce, Robert L and Barwicz, Tymon
Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th, pp. 35--40
Nah, Jae-Woong and Martin, Yves and Kamlapurkar, Swetha and Engelmann, Sebastian and Bruce, Robert L and Barwicz, Tymon
Electronic Components and Technology Conference (ECTC), 2015 IEEE 65th, pp. 35--40
Enabling large-scale deployment of photonics through cost-efficient and scalable packaging
Barwicz, Tymon and Taira, Yoichi and Lichoulas, Ted W and Boyer, Nicolas and Numata, Hidetoshi and Martin, Yves and Nah, Jae-Woong and Takenobu, Shotaro and Janta-Polczynski, Alexander and Kimbrell, Eddie L and others
Group IV Photonics (GFP), 2015 IEEE 12th International Conference on, pp. 155--156
Barwicz, Tymon and Taira, Yoichi and Lichoulas, Ted W and Boyer, Nicolas and Numata, Hidetoshi and Martin, Yves and Nah, Jae-Woong and Takenobu, Shotaro and Janta-Polczynski, Alexander and Kimbrell, Eddie L and others
Group IV Photonics (GFP), 2015 IEEE 12th International Conference on, pp. 155--156
Challenges of Tailoring Surface Chemistry and Plasma/Surface Interactions to Advance Atomic Layer Etching
S. U. Engelmann, R. L. Bruce, M. Nakamura, D. Metzler, S. G. Walton, E. A. Joseph
Ecs Journal of Solid State Science and Technology 4(6), N5054-N5060, 2015
S. U. Engelmann, R. L. Bruce, M. Nakamura, D. Metzler, S. G. Walton, E. A. Joseph
Ecs Journal of Solid State Science and Technology 4(6), N5054-N5060, 2015
Photonic Packaging in High-Throughput Microelectronic Assembly Lines for Cost-Efficiency and Scalability
T Barwicz, Y Taira, TW Licholaus, N Boyer, H Numata, Y Martin, J Nah, S Takenobu, A Janta-Polczynski, E Kimbrell, R Leidy, M Khater, S Kumlurpurkar, S Engelmann, YA Vlasov, P Fortier
Optical Fiber Communication Conference, 2015
T Barwicz, Y Taira, TW Licholaus, N Boyer, H Numata, Y Martin, J Nah, S Takenobu, A Janta-Polczynski, E Kimbrell, R Leidy, M Khater, S Kumlurpurkar, S Engelmann, YA Vlasov, P Fortier
Optical Fiber Communication Conference, 2015
Advanced Etch Technology for Nanopatterning IV
Q Lin, SU Engelmann, Y Zhang
Proc. SPIE 9428, Advanced Etch Technology for Nanopatterning IV, 2015
Q Lin, SU Engelmann, Y Zhang
Proc. SPIE 9428, Advanced Etch Technology for Nanopatterning IV, 2015
Optical demonstration of a compliant polymer interface between standard fibers and nanophotonic waveguides
T. Barwicz, Y. Taira, S. Takenobu, N. Boyer, A. Janta-Polczynski, Y. Thibodeau, S. Kamlapurkar, S. Engelmann, H. Numata, R.L. Bruce, S. Laflamme, P. Fortier, Y.A. Vlasov
2015 Optical Fiber Communications Conference and Exhibition (OFC). Proceedings, 3 pp.
T. Barwicz, Y. Taira, S. Takenobu, N. Boyer, A. Janta-Polczynski, Y. Thibodeau, S. Kamlapurkar, S. Engelmann, H. Numata, R.L. Bruce, S. Laflamme, P. Fortier, Y.A. Vlasov
2015 Optical Fiber Communications Conference and Exhibition (OFC). Proceedings, 3 pp.
An O-band Metamaterial Converter Interfacing Standard Optical Fibers to Silicon Nanophotonic Waveguides
Tymon Barwicz, Alexander Janta-Polczynski, Marwan Khater, Yan Thibodeau, Robert Leidy, Jeffrey Maling, Stephan Martel, Sebastian Engelmann, Jason S Orcutt, Paul Fortier, William Green
Optical Fiber Communication Conference, pp. Th3F--3, 2015
Tymon Barwicz, Alexander Janta-Polczynski, Marwan Khater, Yan Thibodeau, Robert Leidy, Jeffrey Maling, Stephan Martel, Sebastian Engelmann, Jason S Orcutt, Paul Fortier, William Green
Optical Fiber Communication Conference, pp. Th3F--3, 2015
2014
Strained Si 1- x Ge x-on-insulator PMOS FinFETs with excellent sub-threshold leakage, extremely-high short-channel performance and source injection velocity for 10nm node and beyond
Hashemi, Pouya and Balakrishnan, Karthik and Majumdar, Amlan and Khakifirooz, Ali and Kim, Wanki and Baraskar, Ashish and Yang, Li A and Chan, Kevin and Engelmann, Sebastian U and Ott, John A and others
VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014 Symposium on, pp. 1--2
Hashemi, Pouya and Balakrishnan, Karthik and Majumdar, Amlan and Khakifirooz, Ali and Kim, Wanki and Baraskar, Ashish and Yang, Li A and Chan, Kevin and Engelmann, Sebastian U and Ott, John A and others
VLSI Technology (VLSI-Technology): Digest of Technical Papers, 2014 Symposium on, pp. 1--2
First demonstration of high-Ge-content strained-Si 1- x Ge x (x= 0.5) on insulator PMOS FinFETs with high hole mobility and aggressively scaled fin dimensions and gate lengths for high-performance applications
Hashemi, Pouya and Balakrishnan, Karthik and Engelmann, Sebastian U and Ott, John A and Khakifirooz, Ali and Baraskar, Ashish and Hopstaken, Marinus and Newbury, Joseph S and Chan, Kevin K and Leobandung, Effendi and others
Electron Devices Meeting (IEDM), 2014 IEEE International, pp. 16--1
Hashemi, Pouya and Balakrishnan, Karthik and Engelmann, Sebastian U and Ott, John A and Khakifirooz, Ali and Baraskar, Ashish and Hopstaken, Marinus and Newbury, Joseph S and Chan, Kevin K and Leobandung, Effendi and others
Electron Devices Meeting (IEDM), 2014 IEEE International, pp. 16--1
Dopant-Segregation Technique for Leakage Reduction and Performance Improvement in Trigate Transistors Without Raised Source/Drain Epitaxy
F Liu, Z Zhang, MH Khater, Y Zhu, SO Koswatta, J Chang, J Gonsalves, W Price, SU Engelmann, MA Guillorn
Electron Device Letters, IEEE , 2014
F Liu, Z Zhang, MH Khater, Y Zhu, SO Koswatta, J Chang, J Gonsalves, W Price, SU Engelmann, MA Guillorn
Electron Device Letters, IEEE , 2014
First demonstration of high-Ge-content strained-Si 1ÿ" x Ge x (x= 0.5) on insulator PMOS FinFETs with high hole mobility and aggressively scaled fin dimensions and ...
P Hashemi, K Balakrishnan, SU Engelmann, JA Ott, A Khakifrooz, A Baraskar, M Hopstaken, JS Newbury, KK Chan, E Leobandung, RT Mo, DG Park
Electron Devices Meeting (IEDM),, 2014
P Hashemi, K Balakrishnan, SU Engelmann, JA Ott, A Khakifrooz, A Baraskar, M Hopstaken, JS Newbury, KK Chan, E Leobandung, RT Mo, DG Park
Electron Devices Meeting (IEDM),, 2014
Contamination mitigation of hydrogen silsesquioxane resist processed with Na+-containing developer for nanoscale CMOS device patterning
M Brink, I Lauer, SU Engelmann, A Majumdar, SA Cohen, E Kratschmer, MA Guillorn
J. Vac. Sci. Technol. B 32, 2014
M Brink, I Lauer, SU Engelmann, A Majumdar, SA Cohen, E Kratschmer, MA Guillorn
J. Vac. Sci. Technol. B 32, 2014
Strained SiGe on Insulator FinFETs: a P-FET Candidate for 10nm Node
P Hashemi, K Balakrishnan, A Majumdar, S Engelmann, M Hopstaken, W Kim, JA Ott, E Leobandung, DG Park
ECS Trans., 2014
P Hashemi, K Balakrishnan, A Majumdar, S Engelmann, M Hopstaken, W Kim, JA Ott, E Leobandung, DG Park
ECS Trans., 2014
Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips
T Barwicz, Y Taira, H Numata, N Boyer, S Harel, S Kumlurpurkar, S Takenobu, S Laflamme, S Engelmann, Y Vlasov, P Fortier
Electronic Components and Technology Conference (ECTC), IEEE , 2014
T Barwicz, Y Taira, H Numata, N Boyer, S Harel, S Kumlurpurkar, S Takenobu, S Laflamme, S Engelmann, Y Vlasov, P Fortier
Electronic Components and Technology Conference (ECTC), IEEE , 2014
Fluorocarbon assisted atomic layer etching of SiO2 using cyclic Ar/C4F8 plasma
Dominik Metzler, Robert L. Bruce, Sebastian Engelmann, Eric A. Joseph, Gottlieb S. Oehrlein
Journal of Vacuum Science & Technology a 32(2), 2014
Dominik Metzler, Robert L. Bruce, Sebastian Engelmann, Eric A. Joseph, Gottlieb S. Oehrlein
Journal of Vacuum Science & Technology a 32(2), 2014
Electrical characterization of FinFETs with fins formed by directed self assembly at 29 nm fin pitch using a self-aligned fin customization scheme
H Tsai, H Miyazoe, JB Chang, J Pitera, CC Liu, M Brink, I Lauer, J Cheng, S Engelmann, J Rozen, JJ Bucchignano, DP Klaus, S Dawes, L Gignac, C Breslin, EA Joseph, DP Sanders, ME Colburn, MA Guillorn
Electron Devices Meeting (IEDM), 2014 IEEE International
H Tsai, H Miyazoe, JB Chang, J Pitera, CC Liu, M Brink, I Lauer, J Cheng, S Engelmann, J Rozen, JJ Bucchignano, DP Klaus, S Dawes, L Gignac, C Breslin, EA Joseph, DP Sanders, ME Colburn, MA Guillorn
Electron Devices Meeting (IEDM), 2014 IEEE International
Strained Si 1ÿ" x Ge x-on-insulator PMOS FinFETs with excellent sub-threshold leakage, extremely-high short-channel performance and source injection velocity for ...
P Hashemi, K Balakrishnan, A Majumdar, A Khakifrooz, W Kim, A Baraskar, LA Yang, K Chan, SU Engelmann, JA Ott, DA Antoniadis, E Leobandung, DG Park
VLSI Technology (VLSI-Technology): Digest of Technical Papers, Symposium on , 2014
P Hashemi, K Balakrishnan, A Majumdar, A Khakifrooz, W Kim, A Baraskar, LA Yang, K Chan, SU Engelmann, JA Ott, DA Antoniadis, E Leobandung, DG Park
VLSI Technology (VLSI-Technology): Digest of Technical Papers, Symposium on , 2014
Two-dimensional pattern formation using graphoepitaxy of PS-b-PMMA block copolymers for advanced FinFET device and circuit fabrication
H Tsai, JW Pitera, H Miyazoe, S Bangsaruntip, SU Engelmann, CC Liu, JY Cheng, JJ Bucchignano, DP Klaus, EA Joseph, DP Sanders, ME Colburn, MA Guillorn
ACS Nano, 2014
H Tsai, JW Pitera, H Miyazoe, S Bangsaruntip, SU Engelmann, CC Liu, JY Cheng, JJ Bucchignano, DP Klaus, EA Joseph, DP Sanders, ME Colburn, MA Guillorn
ACS Nano, 2014
2013
High-performance Si 1- x Ge x channel on insulator trigate PFETs featuring an implant-free process and aggressively-scaled fin and gate dimensions
Hashemi, Pouya and Kobayashi, Masato and Majumdar, Angshul and Yang, Li A and Baraskar, Ashish and Balakrishnan, K and Kim, Wonhee and Chan, Kap Luk and Engelmann, Sebastian U and Ott, John A and others
VLSI Circuits (VLSIC), 2013 Symposium on, pp. T18--T19
Hashemi, Pouya and Kobayashi, Masato and Majumdar, Angshul and Yang, Li A and Baraskar, Ashish and Balakrishnan, K and Kim, Wonhee and Chan, Kap Luk and Engelmann, Sebastian U and Ott, John A and others
VLSI Circuits (VLSIC), 2013 Symposium on, pp. T18--T19
Investigation of plasma etch damage to porous oxycarbosilane ultra low-k dielectric
R. L. Bruce, S. Engelmann, S. Purushothaman, W. Volksen, T. J. Frot, T. Magbitang, G. Dubois, M. Darnon
Journal of Physics D-Applied Physics 46(26), 2013
R. L. Bruce, S. Engelmann, S. Purushothaman, W. Volksen, T. J. Frot, T. Magbitang, G. Dubois, M. Darnon
Journal of Physics D-Applied Physics 46(26), 2013
Subtractive W contact and local interconnect co-integration (CLIC)
F Liu, B Fletcher, EA Joseph, Y Zhu, J Gonsalves, W Price, GM Fritz, SU Engelmann, A Pyzyna, Z Zhang, C Cabral, MA Guillorn
Interconnect Technology Conference (IITC), 2013
F Liu, B Fletcher, EA Joseph, Y Zhu, J Gonsalves, W Price, GM Fritz, SU Engelmann, A Pyzyna, Z Zhang, C Cabral, MA Guillorn
Interconnect Technology Conference (IITC), 2013
Ultra Low Contact Resistivities for CMOS Beyond 10-nm Node
Z Zhang, SO Koswatta, SW Bedell, A Baraskar, M Guillorn, SU Engelmann, Y Zhu, J Gonsalves, A Pyzyna, M Hopstaken, C Witt, L Yang, F Liu, J Newbury, W Song, C Cabral, M Lofaro, AS Ozcan, M Raymond, C Lavoie, JW Sleight, KP Rodbell, PM Solomon
Electron Device Letters, IEEE , 2013
Z Zhang, SO Koswatta, SW Bedell, A Baraskar, M Guillorn, SU Engelmann, Y Zhu, J Gonsalves, A Pyzyna, M Hopstaken, C Witt, L Yang, F Liu, J Newbury, W Song, C Cabral, M Lofaro, AS Ozcan, M Raymond, C Lavoie, JW Sleight, KP Rodbell, PM Solomon
Electron Device Letters, IEEE , 2013
Advanced Plasma Etch for the 10nm node and Beyond
E. A. Joseph, S. U. Engelmann, H. Miyazoe, R. L. Bruce, M. Nakamura, T. Suzuki, M. Hoinkis, Y Zhang, GS Oehrlein, Q Lin
Advanced Etch Technology For Nanopatterning Ii8685, 2013
E. A. Joseph, S. U. Engelmann, H. Miyazoe, R. L. Bruce, M. Nakamura, T. Suzuki, M. Hoinkis, Y Zhang, GS Oehrlein, Q Lin
Advanced Etch Technology For Nanopatterning Ii8685, 2013
Improved frequency response in a SiGe npn device through improved dopant activation
J Adkisson, M Khater, J Gambino, P Cheng, V Jain, R Camillo-Castillo, C Lavoie, A Sutton, O Gluschenkov, QZ Liu, T McDevitt, S Engelmann, J Pekarik, DL Harame
ECS Trans., 2013
J Adkisson, M Khater, J Gambino, P Cheng, V Jain, R Camillo-Castillo, C Lavoie, A Sutton, O Gluschenkov, QZ Liu, T McDevitt, S Engelmann, J Pekarik, DL Harame
ECS Trans., 2013
Pattern transfer of directed self-assembly patterns for CMOS device applications
H Tsai, H Miyazoe, S Engelmann, CC Liu, L Gignac, J Bucchignano, D Klaus, C Breslin, E Joseph, J Cheng, D Sanders, M Guillorn
J. Micro/Nanolith. MEMS MOEMS., 2013
H Tsai, H Miyazoe, S Engelmann, CC Liu, L Gignac, J Bucchignano, D Klaus, C Breslin, E Joseph, J Cheng, D Sanders, M Guillorn
J. Micro/Nanolith. MEMS MOEMS., 2013
SiGe HBTs in 90nm BiCMOS technology demonstrating 300GHz/420GHz f T/f MAX through reduced R b and C cb parasitics
RA Camillo-Castillo, QZ Liu, JW Adkisson, MH Khater, PB Gray, V Jain, RK Leidy, JJ Pekarik, JP Gambino, B Zetterlund, C Willets, C Parrish, SU Engelmann, AM Pyzyna, P Cheng, DL Harame
Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), IEEE , 2013
RA Camillo-Castillo, QZ Liu, JW Adkisson, MH Khater, PB Gray, V Jain, RK Leidy, JJ Pekarik, JP Gambino, B Zetterlund, C Willets, C Parrish, SU Engelmann, AM Pyzyna, P Cheng, DL Harame
Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), IEEE , 2013
Density scaling with gate-all-around silicon nanowire MOSFETs for the 10 nm node and beyond
S Bangsaruntip, K Balakrishnan, SL Cheng, J Chang, M Brink, I Lauer, RL Bruce, SU Engelmann, A Pyzyna, GM Cohen, LM Gignac, CM Breslin, JS Newbury, DP Klaus, A Majumdar, JW Sleight, MA Guillorn
Electron Devices Meeting (IEDM), IEEE International , 2013
S Bangsaruntip, K Balakrishnan, SL Cheng, J Chang, M Brink, I Lauer, RL Bruce, SU Engelmann, A Pyzyna, GM Cohen, LM Gignac, CM Breslin, JS Newbury, DP Klaus, A Majumdar, JW Sleight, MA Guillorn
Electron Devices Meeting (IEDM), IEEE International , 2013
High-performance Si 1ÿ" x Ge x channel on insulator trigate PFETs featuring an implant-free process and aggressively-scaled fin and gate dimensions
P Hashemi, M Kobayashi, A Majumdar, LA Yang, A Baraskar, K Balakrishnan, W Kim, K Chan, SU Engelmann, JA Ott, SW Bedell, CE Murray, S Liang, RH Dennard, JW Sleight, E Leobandung, DG Park
VLSI Circuits (VLSIC), 2013 Symposium on
P Hashemi, M Kobayashi, A Majumdar, LA Yang, A Baraskar, K Balakrishnan, W Kim, K Chan, SU Engelmann, JA Ott, SW Bedell, CE Murray, S Liang, RH Dennard, JW Sleight, E Leobandung, DG Park
VLSI Circuits (VLSIC), 2013 Symposium on
Pattern Transfer of Directed Self-Assembly (DSA) Patterns for CMOS Device Applications
H Tsai, H Miyazoe, S Engelmann, S Bangsaruntip, I Lauer, J Bucchignano, D Klaus, LM Gignac, E Joseph, J Cheng, D Sanders, M Guillorn
Proc. SPIE 8685, Advanced Etch Technology for Nanopatterning II, 86850L, 2013
H Tsai, H Miyazoe, S Engelmann, S Bangsaruntip, I Lauer, J Bucchignano, D Klaus, LM Gignac, E Joseph, J Cheng, D Sanders, M Guillorn
Proc. SPIE 8685, Advanced Etch Technology for Nanopatterning II, 86850L, 2013
2012
The effects of plasma exposure on low-k dielectric materials
JL Shohet, H Ren, MT Nichols, H Sinha, W Lu, K Mavrakakis, Q Lin, NM Russell, M Tomoyasu, GA Antonelli, SU Engelmann, NCM Fuller, V Ryan, Y Nishi
Proc. SPIE 8328, Advanced Etch Technology for Nanopatterning,, 2012
JL Shohet, H Ren, MT Nichols, H Sinha, W Lu, K Mavrakakis, Q Lin, NM Russell, M Tomoyasu, GA Antonelli, SU Engelmann, NCM Fuller, V Ryan, Y Nishi
Proc. SPIE 8328, Advanced Etch Technology for Nanopatterning,, 2012
The effects of vacuum ultraviolet radiation on low-k dielectric films
H Sinha, H Ren, MT Nichols, JL Lauer, JL Shohet, M Tomoyasu, NM Russell, G Jiang, GA Antonelli, NCM Fuller, S Engelmann, Q Lin, V Ryan, Y Nishi
Journal of Applied Physics 112, 2012
H Sinha, H Ren, MT Nichols, JL Lauer, JL Shohet, M Tomoyasu, NM Russell, G Jiang, GA Antonelli, NCM Fuller, S Engelmann, Q Lin, V Ryan, Y Nishi
Journal of Applied Physics 112, 2012
Patterning of CMOS Device Structures for 40-80nm Pitches and Beyond
S. U. Engelmann, R. Martin, R. L. Bruce, H. Miyazoe, N. C. M. Fuller, W. S. Graham, E. M. Sikorski, M. Glodde, M. Brink, H. Tsai, J. Bucchignano, D. Klaus, E. Kratschmer, M. A. Guillorn, Y Zhang, G Oehrlein, Q Lin
Advanced Etch Technology For Nanopatterning8328, 2012
S. U. Engelmann, R. Martin, R. L. Bruce, H. Miyazoe, N. C. M. Fuller, W. S. Graham, E. M. Sikorski, M. Glodde, M. Brink, H. Tsai, J. Bucchignano, D. Klaus, E. Kratschmer, M. A. Guillorn, Y Zhang, G Oehrlein, Q Lin
Advanced Etch Technology For Nanopatterning8328, 2012
Sub-30 nm pitch line-space patterning of semiconductor and dielectric materials using directed self-assembly
H Tsai, H Miyazoe, S Engelmann, B To, E Sikorski, J Bucchignano, D Klaus, CC Liu, J Cheng, D Sanders, N Fuller, M Guillorn
J. Vac. Sci. Technol. B 30, 2012
H Tsai, H Miyazoe, S Engelmann, B To, E Sikorski, J Bucchignano, D Klaus, CC Liu, J Cheng, D Sanders, N Fuller, M Guillorn
J. Vac. Sci. Technol. B 30, 2012
2011
Systematic studies on reactive ion etch-induced deformations of organic underlayers
M Glodde, S Engelmann, M Guillorn, S Kanakasabapathy, E Mclellan, CS Koay, Y Yin, M Sankarapandian, JC Arnold, K Petrillo, M Brink, H Miyazoe, E Anuja de Silva, H Yusuff, K Yoon, Y Wei, C Wu, P Rao Varasani
Proc. SPIE 7972, Advances in Resist Materials and Processing Technology XXVIII, 2011
M Glodde, S Engelmann, M Guillorn, S Kanakasabapathy, E Mclellan, CS Koay, Y Yin, M Sankarapandian, JC Arnold, K Petrillo, M Brink, H Miyazoe, E Anuja de Silva, H Yusuff, K Yoon, Y Wei, C Wu, P Rao Varasani
Proc. SPIE 7972, Advances in Resist Materials and Processing Technology XXVIII, 2011
Characterization and mechanism of He plasma pretreatment of nanoscale polymer masks for improved pattern transfer fidelity
F. Weilnboeck, D. Metzler, N. Kumar, G. S. Oehrlein, R. L. Bruce, S. Engelmann, N. Fuller
Applied Physics Letters 99(26), 2011
F. Weilnboeck, D. Metzler, N. Kumar, G. S. Oehrlein, R. L. Bruce, S. Engelmann, N. Fuller
Applied Physics Letters 99(26), 2011
A 0.021 $\mu$m 2 trigate SRAM cell with aggressively scaled gate and contact pitch
MA Guillorn, J Chang, A Pyzyna, S Engelmann, M Glodde, E Joseph, R Bruce, JA Ott, A Majumdar, F Liu, others
VLSI Technology (VLSIT), 2011 Symposium on, pp. 64--65
MA Guillorn, J Chang, A Pyzyna, S Engelmann, M Glodde, E Joseph, R Bruce, JA Ott, A Majumdar, F Liu, others
VLSI Technology (VLSIT), 2011 Symposium on, pp. 64--65
Scaling of SOI FinFETs down to Fin Width of 4 nm for the 10nm technology node
JB Chang, M. Guillorn, PM Solomon, CH Lin, SU Engelmann, A. Pyzyna, JA Ott, WE Haensch
VLSI Technology (VLSIT), 2011 Symposium on, pp. 12--13
JB Chang, M. Guillorn, PM Solomon, CH Lin, SU Engelmann, A. Pyzyna, JA Ott, WE Haensch
VLSI Technology (VLSIT), 2011 Symposium on, pp. 12--13
2010
Fabrication of dual damascene BEOL structures using a multilevel multiple exposure (MLME) scheme, part 2: RIE-based pattern transfer and completion of dual damascene process yielding an electrically functional via chain
Harrer, Stefan and Arnold, John C and Goldfarb, Dario L and Holmes, Steven J and Chen, Rex and Tang, Cherry and Slezak, Mark and Fender, Nicolette and Della Guardia, Ronald A and Joseph, Eric A and others
SPIE Advanced Lithography, pp. 763919--763919, 2010
Harrer, Stefan and Arnold, John C and Goldfarb, Dario L and Holmes, Steven J and Chen, Rex and Tang, Cherry and Slezak, Mark and Fender, Nicolette and Della Guardia, Ronald A and Joseph, Eric A and others
SPIE Advanced Lithography, pp. 763919--763919, 2010
Fabrication of dual damascene BEOL structures using a multilevel multiple exposure (MLME) scheme, part 1: lithographic patterning
DL Goldfarb, S Harrer, JC Arnold, SJ Holmes, R Chen, C Tang, N Fender, M Slezak, RA Della Guardia, EA Joseph, SU Engelmann, RP Varanasi, ME Colburn
Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 2010
DL Goldfarb, S Harrer, JC Arnold, SJ Holmes, R Chen, C Tang, N Fender, M Slezak, RA Della Guardia, EA Joseph, SU Engelmann, RP Varanasi, ME Colburn
Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 2010
High Performance and Highly Uniform Metal Hi-K Gate-All-Around Silicon Nanowire MOSFETs
JW Sleight, S Bangsaruntip, G Cohen, A Majumdar, Y Zhang, S Engelmann, N Fuller, L Gignac, S Mittal, J Newbury, T Barwicz, MM Frank, M Guillorn
ECS Trans., 2010
JW Sleight, S Bangsaruntip, G Cohen, A Majumdar, Y Zhang, S Engelmann, N Fuller, L Gignac, S Mittal, J Newbury, T Barwicz, MM Frank, M Guillorn
ECS Trans., 2010
Reflectance and substrate currents of dielectric layers under vacuum ultraviolet irradiation
H Sinha, DB Straight, JL Lauer, NC Fuller, SU Engelmann, Y Zhang, GA Antonelli, M Severson, Y Nishi, JL Shohet
J. Vac. Sci. Technol. A 28, 2010
H Sinha, DB Straight, JL Lauer, NC Fuller, SU Engelmann, Y Zhang, GA Antonelli, M Severson, Y Nishi, JL Shohet
J. Vac. Sci. Technol. A 28, 2010
Gate-all-around silicon nanowire MOSFETs and circuits
JW Sleight, S Bangsaruntip, A Majumdar, GM Cohen, Y Zhang, SU Engelmann, NCM Fuller, LM Gignac, S Mittal, JS Newbury, MM Frank, J Chang, M Guillorn
Device Research Conference (DRC),, 2010
JW Sleight, S Bangsaruntip, A Majumdar, GM Cohen, Y Zhang, SU Engelmann, NCM Fuller, LM Gignac, S Mittal, JS Newbury, MM Frank, J Chang, M Guillorn
Device Research Conference (DRC),, 2010
Gate-all-around silicon nanowire 25-stage CMOS ring oscillators with diameter down to 3 nm
S Bangsaruntip, A Majumdar, GM Cohen, SU Engelmann, Y Zhang, M Guillorn, LM Gignac, S Mittal, WS Graham, EA Joseph, DP Klaus, J Chang, EA Cartier, JW Sleight
VLSI Technology (VLSIT), 2010 Symposium on
S Bangsaruntip, A Majumdar, GM Cohen, SU Engelmann, Y Zhang, M Guillorn, LM Gignac, S Mittal, WS Graham, EA Joseph, DP Klaus, J Chang, EA Cartier, JW Sleight
VLSI Technology (VLSIT), 2010 Symposium on
Photoresist modifications by plasma vacuum ultraviolet radiation: The role of polymer structure and plasma chemistry
F Weilnboeck, RL Bruce, S Engelmann, GS Oehrlein, D Nest, T Y Chung, D Graves, M Li, D Wang, C Andes, others
Journal of Vacuum Science \& Technology B: Microelectronics and Nanometer Structures28, 993, 2010
F Weilnboeck, RL Bruce, S Engelmann, GS Oehrlein, D Nest, T Y Chung, D Graves, M Li, D Wang, C Andes, others
Journal of Vacuum Science \& Technology B: Microelectronics and Nanometer Structures28, 993, 2010
Nanowire and nanotube devices
JW Sleight, S Bangsaruntip, A Majumdar, GM Cohen, Y Zhang, SU Engelmann, T Current
Device Research Conference (DRC), 2010, pp. 267--268
JW Sleight, S Bangsaruntip, A Majumdar, GM Cohen, Y Zhang, SU Engelmann, T Current
Device Research Conference (DRC), 2010, pp. 267--268
Gate-all-around silicon nanowire MOSFETs and circuits
JW Sleight, S Bangsaruntip, A Majumdar, GM Cohen, Y Zhang, SU Engelmann, NCM Fuller, LM Gignac, S Mittal, JS Newbury, others
Device Research Conference (DRC), 2010, pp. 269--272
JW Sleight, S Bangsaruntip, A Majumdar, GM Cohen, Y Zhang, SU Engelmann, NCM Fuller, LM Gignac, S Mittal, JS Newbury, others
Device Research Conference (DRC), 2010, pp. 269--272
Measurement of the Indices of Refraction and Extinction Coefficients of Thin-Film Dielectric Materials in the VUV Range
DB Straight, JL Lauer, H Sinha, SU Engelmann, Y Zhang, NC Fuller, JL Shohet
Journal of Vacuum Science and Technology A, 2010
DB Straight, JL Lauer, H Sinha, SU Engelmann, Y Zhang, NC Fuller, JL Shohet
Journal of Vacuum Science and Technology A, 2010
2009
Understanding the roughening and degradation of 193 nm photoresist during plasma processing: synergistic roles of vacuum ultraviolet radiation and ion bombardment
Nest, Dustin and Chung, Ting-Ying and Graves, David B and Engelmann, Sebastian and Bruce, Robert L and Weilnboeck, Florian and Oehrlein, Gottlieb S and Wang, Deyan and Andes, Cecily and Hudson, Eric A
Plasma processes and polymers 6(10), 649--657, Wiley Online Library, 2009
Nest, Dustin and Chung, Ting-Ying and Graves, David B and Engelmann, Sebastian and Bruce, Robert L and Weilnboeck, Florian and Oehrlein, Gottlieb S and Wang, Deyan and Andes, Cecily and Hudson, Eric A
Plasma processes and polymers 6(10), 649--657, Wiley Online Library, 2009
Dependence of photoresist surface modifications during plasma-based pattern transfer on choice of feedgas composition: Comparison of C4F8-and CF4-based ...
S Engelmann, RL Bruce, F Weilnboeck, M Sumiya, T Kwon, R Phaneuf, GS Oehrlein, C Andes, D Graves, D Nest, EA Hudson
J. Vac. Sci. Technol. B 27, 2009
S Engelmann, RL Bruce, F Weilnboeck, M Sumiya, T Kwon, R Phaneuf, GS Oehrlein, C Andes, D Graves, D Nest, EA Hudson
J. Vac. Sci. Technol. B 27, 2009
Hydrogen silsesquioxane-based hybrid electron beam and optical lithography for high density circuit prototyping
M Guillorn, J Chang, N Fuller, J Patel, M Darnon, A Pyzyna, E Joseph, S Engelmann, J Ott, J Newbury, D Klaus, J Bucchignano, P Joshi, C Scerbo, E Kratschmer, W Graham, B To, J Parisi, Y Zhang, W Haensch
J. Vac. Sci. Technol. B 27, 2009
M Guillorn, J Chang, N Fuller, J Patel, M Darnon, A Pyzyna, E Joseph, S Engelmann, J Ott, J Newbury, D Klaus, J Bucchignano, P Joshi, C Scerbo, E Kratschmer, W Graham, B To, J Parisi, Y Zhang, W Haensch
J. Vac. Sci. Technol. B 27, 2009
Trigate 6T SRAM scaling to 0.06 µm 2
M Guillorn, J Chang, A Pyzyna, S Engelmann, E Joseph, B Fletcher, C Cabral, C Lin, A Bryant, M Darnon, J Ott, C Lavoie, M Frank, L Gignac, J Newbury, C Wang, D Klaus, E Kratschmer, J Bucchignano, B To, W Graham, I Lauer, E Sikorski, S Carter, V Narayanan,
Electron Devices Meeting (IEDM), IEEE International , 2009
M Guillorn, J Chang, A Pyzyna, S Engelmann, E Joseph, B Fletcher, C Cabral, C Lin, A Bryant, M Darnon, J Ott, C Lavoie, M Frank, L Gignac, J Newbury, C Wang, D Klaus, E Kratschmer, J Bucchignano, B To, W Graham, I Lauer, E Sikorski, S Carter, V Narayanan,
Electron Devices Meeting (IEDM), IEEE International , 2009
High performance and highly uniform gate-all-around silicon nanowire MOSFETs with wire size dependent scaling
S. Bangsaruntip, G. M. Cohen, A. Majumdar, Y. Zhang, S. U. Engelmann, N. C. M. Fuller, L. M. Gignac, S. Mittal, J. S. Newbury, M. Guillorn, T. Barwicz, L. Sekaric, M. M. Frank, and J. W. Sleight
IEDM Technical Digest, pp. 297-300, 2009
S. Bangsaruntip, G. M. Cohen, A. Majumdar, Y. Zhang, S. U. Engelmann, N. C. M. Fuller, L. M. Gignac, S. Mittal, J. S. Newbury, M. Guillorn, T. Barwicz, L. Sekaric, M. M. Frank, and J. W. Sleight
IEDM Technical Digest, pp. 297-300, 2009
Plasma-surface interactions of advanced photoresists with C4F8/Ar discharges: Plasma parameter dependencies
S Engelmann, RL Bruce, M Sumiya, T Kwon, R Phaneuf, GS Oehrlein, C Andes, D Graves, D Nest, EA Hudson
Journal of Vacuum Science \& Technology B: Microelectronics and Nanometer Structures 27(1), 92--106, AVS, 2009
S Engelmann, RL Bruce, M Sumiya, T Kwon, R Phaneuf, GS Oehrlein, C Andes, D Graves, D Nest, EA Hudson
Journal of Vacuum Science \& Technology B: Microelectronics and Nanometer Structures 27(1), 92--106, AVS, 2009
Understanding the Roughening and Degradation of 193 nm Photoresist during Plasma Processing: Synergistic Roles of Vacuum Ultraviolet Radiation and Ion Bombardment
Dustin Nest, Ting-Ying Chung, David B. Graves, Sebastian Engelmann, Robert L. Bruce, Florian Weilnboeck, Gottlieb S. Oehrlein, Deyan Wang, Cecily Andes, Eric A. Hudson
Plasma Processes and Polymers 6(10), 649-657, 2009
Dustin Nest, Ting-Ying Chung, David B. Graves, Sebastian Engelmann, Robert L. Bruce, Florian Weilnboeck, Gottlieb S. Oehrlein, Deyan Wang, Cecily Andes, Eric A. Hudson
Plasma Processes and Polymers 6(10), 649-657, 2009
Study of ion and vacuum ultraviolet-induced effects on styrene-and ester-based polymers exposed to argon plasma
RL Bruce, S Engelmann, T Lin, T Kwon, RJ Phaneuf, GS Oehrlein, BK Long, CG Willson, JJ Vegh, D Nest, others
Journal of Vacuum Science \& Technology B: Microelectronics and Nanometer Structures27, 1142, 2009
RL Bruce, S Engelmann, T Lin, T Kwon, RJ Phaneuf, GS Oehrlein, BK Long, CG Willson, JJ Vegh, D Nest, others
Journal of Vacuum Science \& Technology B: Microelectronics and Nanometer Structures27, 1142, 2009
Dependence of Polymer Surface Roughening Rate on Deposited Energy Density During Plasma Processing
Sebastian Engelmann, Robert L. Bruce, Florian Weilnboeck, Gottlieb S. Oehrlein, Dustin Nest, David B. Graves, Cecily Andes, Eric A. Hudson
Plasma Processes and Polymers 6(8), 484-489, 2009
Sebastian Engelmann, Robert L. Bruce, Florian Weilnboeck, Gottlieb S. Oehrlein, Dustin Nest, David B. Graves, Cecily Andes, Eric A. Hudson
Plasma Processes and Polymers 6(8), 484-489, 2009
Real-time studies of surface roughness development and reticulation mechanism of advanced photoresist materials during plasma processing
A. R. Pal, R. L. Bruce, F. Weilnboeck, S. Engelmann, T. Lin, M. -S. Kuo, R. Phaneuf, G. S. Oehrlein
Journal of Applied Physics 105(1), 2009
A. R. Pal, R. L. Bruce, F. Weilnboeck, S. Engelmann, T. Lin, M. -S. Kuo, R. Phaneuf, G. S. Oehrlein
Journal of Applied Physics 105(1), 2009
2008
Molecular dynamics simulations of near-surface modification of polystyrene: Bombardment with Ar+ and Ar+/radical chemistries
JJ Vegh, D Nest, DB Graves, R Bruce, S Engelmann, T Kwon, RJ Phaneuf, GS Oehrlein, BK Long, CG Willson
J. Appl. Phys. 104, 2008
JJ Vegh, D Nest, DB Graves, R Bruce, S Engelmann, T Kwon, RJ Phaneuf, GS Oehrlein, BK Long, CG Willson
J. Appl. Phys. 104, 2008
Synergistic effects of vacuum ultraviolet radiation, ion bombardment, and heating in 193 nm photoresist roughening and degradation
D. Nest, D. B. Graves, S. Engelmann, R. L. Bruce, F. Weilnboeck, G. S. Oehrlein, C. Andes, E. A. Hudson
Applied Physics Letters 92(15), 2008
D. Nest, D. B. Graves, S. Engelmann, R. L. Bruce, F. Weilnboeck, G. S. Oehrlein, C. Andes, E. A. Hudson
Applied Physics Letters 92(15), 2008
Study of 193 nm photoresist degradation during short time fluorocarbon plasma exposures. II. Plasma parameter trends for photoresist degradation
M. Sumiya, R. Bruce, S. Engelmann, F. Weilnboeck, G. S. Oehrlein
Journal of Vacuum Science & Technology B 26(5), 1647-1653, 2008
M. Sumiya, R. Bruce, S. Engelmann, F. Weilnboeck, G. S. Oehrlein
Journal of Vacuum Science & Technology B 26(5), 1647-1653, 2008
Plasma-surface interactions of model polymers for advanced photoresist systems
S U Engelmann
2008 - adsabs.harvard.edu
S U Engelmann
2008 - adsabs.harvard.edu
Study of 193 nm photoresist degradation during short time fluorocarbon plasma exposure. I. Studies of modified layer formation
M. Sumiya, R. Bruce, S. Engelmann, F. Weilnboeck, G. S. Oehrlein
Journal of Vacuum Science & Technology B 26(5), 1637-1646, 2008
M. Sumiya, R. Bruce, S. Engelmann, F. Weilnboeck, G. S. Oehrlein
Journal of Vacuum Science & Technology B 26(5), 1637-1646, 2008
Study of 193 nm photoresist degradation during short time fluorocarbon plasma exposure III. Effect of fluorocarbon film and initial surface condition on photoresist degradation
M. Sumiya, R. Bruce, S. Engelmann, F. Weilnboeck, G. S. Oehrlein
Journal of Vacuum Science & Technology B 26(6), 1978-1986, 2008
M. Sumiya, R. Bruce, S. Engelmann, F. Weilnboeck, G. S. Oehrlein
Journal of Vacuum Science & Technology B 26(6), 1978-1986, 2008
2007
Plasma-surface interactions of model polymers for advanced photoresists using C4F8/ Ar discharges and energetic ion beams
S Engelmann, RL Bruce, T Kwon, R Phaneuf, GS Oehrlein, YC Bae, C Andes, D Graves, D Nest, EA Hudson, others
Journal of Vacuum Science \& Technology B: Microelectronics and Nanometer Structures25, 1353, 2007
S Engelmann, RL Bruce, T Kwon, R Phaneuf, GS Oehrlein, YC Bae, C Andes, D Graves, D Nest, EA Hudson, others
Journal of Vacuum Science \& Technology B: Microelectronics and Nanometer Structures25, 1353, 2007
Near-surface modification of polystyrene by Ar: Molecular dynamics simulations and experimental validation
JJ Vegh, D Nest, DB Graves, R Bruce, S Engelmann, T Kwon, RJ Phaneuf, GS Oehrlein, BK Long, CG Willson
Applied Physics Letters91, 233113, 2007
JJ Vegh, D Nest, DB Graves, R Bruce, S Engelmann, T Kwon, RJ Phaneuf, GS Oehrlein, BK Long, CG Willson
Applied Physics Letters91, 233113, 2007
2006
Studies of plasma surface interactions during short time plasma etching of 193 and 248 nm photoresist materials
X Hua, S Engelmann, GS Oehrlein, P Jiang, P Lazzeri, E Iacob, M Anderle
Journal of Vacuum Science \& Technology B: Microelectronics and Nanometer Structures24, 1850, 2006
X Hua, S Engelmann, GS Oehrlein, P Jiang, P Lazzeri, E Iacob, M Anderle
Journal of Vacuum Science \& Technology B: Microelectronics and Nanometer Structures24, 1850, 2006
Projects and Groups
- 3D Semiconductor & Packaging Technology for Systems
- AI meets IoT
- Atomic Layer Etching
- Cognitive Technologies
- Fab and Characterization Capabilies
- Interconnect dielectrics
- Lithography Materials
- Logic Technologies
- Memory Technologies
- Nanoscale Fabrication
- Science & Technology
- Silicon Nanophotonic Packaging
- STM/AFM