Thomas Brunschwiler  Thomas Brunschwiler photo         

contact information

Zurich Research Laboratory, Zurich, Switzerland
  +41dash44dash724dash86dash81

links

Professional Associations

Professional Associations:  IEEE

more information

More information:  Member of the Board of Governer of IEEE EPS


2019

Low-temperature dip-based all-copper interconnects formed by pressure-assisted sintering of copper nanoparticles
Luca Del Carro, Jonas Zurcher, Ute Drechsler, Ian Clark, Gustavo Ramos, Thomas Brunschwiler
IEEE Transactions on Components, Packaging and Manufacturing Technology, 1-1, 2019
Abstract   wetting, thermal copper pillar bump, soldering, sintering, shear strength, printed circuit board, metallurgy, engineering, electrical resistance and conductance, copper


2018

Fabrication of 2D and 3D inductors for DC-DC converters integrated on glass interposer
Vincent Lafage, Yann Beilliard, Arvind Sridhar, Thomas Brunschwiler, Dominique Drouin
2018 Pan Pacific Microelectronics Symposium (Pan Pacific)
Abstract   voltage regulator, silicon, microfabrication, materials science, interposer, inductor, inductance, electronic engineering, converters, architecture

Microfluidic Interposer for High Performance Fluidic Chip Cooling
Wolfram Steller, Frank Windrich, Douglas Bremner, Stephen Robertson, Raul Mrosko, Jurgen Keller, Thomas Brunschwiler, Gerd Schlottig, Hermann Oppermann, M. Jurgen Wolf, Klaus-Dieter Lang
2018 7th Electronic System-Integration Technology Conference (ESTC)
Abstract   system in package, supercomputer, low latency, junction temperature, interposer, international technology roadmap for semiconductors, fluidics, electrical engineering, computer science, chip

Thermo-mechanical reliability of sintered all-Cu electrical fine pitch interconnects under isothermal fatigue testing benchmarked against soldered and TLP-bonded SnAg3.5 joints
Akhil Kumar, Uwe Zschenderlein, M. Baum, T. Brunschwiler, Daniel N. Wright, Bernhard Wunderle
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Abstract   spring steel, soldering, sintering, intermetallic, flip chip, engineering, electronic engineering, electrical resistance and conductance, composite material, bending, adhesive

Eulerian multiphase conjugate model for embedded two-phase liquid cooled microprocessor
Pritish R. Parida, Mark Schultz, Ozgur Ozsun, Fanghao Yang, Michael Gaynes, Arvind Sridhar, Gerard McVicker, Thomas Brunschwiler, Timothy Chainer
2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)
Abstract   microprocessor, materials science, liquid dielectric, junction temperature, heat transfer, experimental data, eulerian path, electronic engineering, conjugate, chip

COPD Management by Symptom and Activity Tracking
Thomas Brunschwiler, Rui Hu, T. van Kessel, A. Lopez, J. Barroso
2018 IEEE 20th International Conference on e-Health Networking, Applications and Services (Healthcom), pp. 1-2
Abstract   visualization, usability, management system, enterprise architecture, desk, data visualization, data mining, data flow diagram, data aggregator, computer science

On the Evaporation of Colloidal Suspensions in Confined Pillar Arrays
Jonas Zurcher, Brian R. Burg, Luca Del Carro, Andre R. Studart, Thomas Brunschwiler
Transport in Porous Media 125(2), 173-192, 2018
Abstract   thermodynamics, surface tension, porous medium, nanoparticle, microelectronics, mathematics, hybrid material, evaporation, electronic packaging, composite material, colloid

Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels
Thomas Brunschwiler, Wolfram Steller, Hermann Oppermann, Jessica Kleff, Stephen Robertson, Raul Mrosko, Jurgen Keller, Gerd Schlottig
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Abstract   thermal resistance, thermal conductivity, stack, microchannel, interposer, integrated circuit, engineering, electronic engineering, coolant, central processing unit

2D Magnetic Inductors for DC-DC Converters on Glass Interposer
Vincent Lafage, Yann Beilliard, Arvind Sridhar, Thomas Brunschwiler, Dominique Drouin
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
Abstract   voltage regulator, silicon, materials science, interposer, inductor, inductance, electronic engineering, converters, composite material

Laser Sintering of Dip-Based All-Copper Interconnects
Luca Del Carro, Martin Kossatz, Lucas Schnackenberg, Matthias Fettke, Ian M. Clark, Thomas Brunschwiler
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), pp. 279-286
Abstract   soldering, sintering, silicon, selective laser sintering, pillar, materials science, electromigration, copper, composite material


2017

Thermal performance of a silicon-interposer with embedded fluid channels enabling dual-side heat removal
Ozgur Ozsun, Stephan Paredes, Gerd Schlottig, Ute Drechsler, Ralph Heller, Thomas Brunschwiler
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), pp. 473-479
Abstract   thermal, pressure drop, laminar flow, junction temperature, interposer, engineering, electronic engineering, dissipation, convection, channel

Internet of the body and cognitive companion: Enabling high-quality monitoring of patients at home
R Straessle, Yuksel Temiz, S Gerke, J Weiss, Arvind Sridhar, Stephan Paredes, Thomas Brunschwiler, E Loertscher, N Ebejer, Bruno Michel, T van Kessel, I Faro, S Zafar, F Libsch, MA Taubenblatt, K Matsumoto
2017 IEEE 19th International Conference on e-Health Networking, Applications and Services (Healthcom)

Scalable packaging platform supporting high-performance 3D chip stacks
Thomas Brunschwiler, Gerd Schlottig, Arvind Sridhar, Antonio La Porta, Ozgur Ozsun, Jonas Zurcher, Rahel Strassle, Luca Del Carro, Pedro A. M. Bezerra
2017 Pan Pacific Microelectronics Symposium (Pan Pacific)
Abstract   three dimensional integrated circuit, system integration, server, scalability, integrated circuit, engineering, embedded system, electronic engineering, electrical efficiency, continuation, chip

CAir: Mobile-health intervention for COPD patients
T Brunschwiler, R Straessle, J Weiss, B Michel, T Van Kessel, Bong Jun Ko, David Wood, Yves Nordmann, Ulrich Muehlner
e-Health Networking, Applications and Services (Healthcom), 2017 IEEE 19th International Conference on

Morphology of Low-Temperature All-Copper Interconnects Formed by Dip Transfer
Luca Del Carro, Jonas Zuercher, Sebastian Gerke, Thomas Wildsmith, Gustavo Ramos, Thomas Brunschwiler
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), pp. 961-967
Abstract   thermal copper pillar bump, soldering, sintering, printed circuit board, porosity, pillar, nanoparticle, metallurgy, materials science, copper, composite material

Direct investigation of microparticle self-assembly to improve the robustness of neck formation in thermal underfills
Roman Stadler, Luca Del Carro, Jonas Zurcher, Gerd Schlottig, Andre R. Studart, Thomas Brunschwiler
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), pp. 167-173
Abstract   thermal conductivity, suspension, porosity, particle deposition, particle, nanoparticle, metallurgy, evaporation, engineering, composite material, capillary bridges

Internet of the body and cognitive hypervisor
R Straessle, S Gerke, T Brunschwiler, Yuksel Temiz, J Weiss, Arvind Sridhar, Stephan Paredes, E Loertscher, N Ebejer, Bruno Michel, H-M Lee, C Alvarado, I Faro, T Van Kessel, M Meghelli, MA Taubenblatt, S Zafar, F Libsch, K Matsumoto
2017 IEEE/ACM International Conference on Connected Health: Applications, Systems and Engineering Technologies (CHASE)

Thermal model for embedded two-phase liquid cooled microprocessor
Parida, Pritish R and Sridhar, Arvind and Vega, Augusto and Schultz, Mark D and Gaynes, Michael and Ozsun, Ozgur and McVicker, Gerard and Brunschwiler, Thomas and Buyuktosunoglu, Alper and Chainer, Timothy
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017 16th IEEE Intersociety Conference on, pp. 441--449
Abstract

Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices
Parida, Pritish R and Sridhar, Arvind and Schultz, Mark and Yang, Fanghao and Gaynes, Michael and Colgan, Evan and Dang, Bing and McVicker, Gerard and Brunschwiler, Thomas and Knickerbocker, John and others
Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2017 33rd, pp. 130--138
Abstract

Analysis and comparative evaluation of stacked-transistor half-bridge topologies implemented with 14 nm bulk CMOS technology
P. A. M. Bezerra, R. K. Aljameh, F. Krismer, J. W. Kolar, A. Sridhar, T. Brunschwiler, T. Toifl
2017 IEEE 18th Workshop on Control and Modeling for Power Electronics (COMPEL)
Abstract   voltage regulator, voltage, transistor, network topology, low voltage, logic gate, input output, engineering, electronic engineering, control engineering, cmos

Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
Thomas Brunschwiler, Gerd Schlottig, Arvind Sridhar, Pedro Bezerra, Patrick Ruch, Neil Ebejer, Hermann Oppermann, Jessika Kleff, Wolfram Steller, Mohamed Jatlaoui, Frederic Voiron, Zoran Pavlovic, Paul McCloskey, Douglas Bremner, P Parida, Florian Krismer
Electron Devices Meeting (IEDM), 2017 IEEE International


2016

Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
Thomas Brunschwiler, Jonas Zuercher, Severin Zimmermann, Brian R Burg, Gerd Schlottig, Xi Chen, Tuhin Sinha, Mario Baum, Christian Hofmann, Remi Pantou, Albert Achen, Uwe Zschenderlein, Sridhar G Kumar, Bernhard Wunderle, Marie Haupt, Florian Schindler-Sa
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), pp. 140-150, IEEE

Exploration of inductor-based hybrid integrated voltage regulator architectures
Arvind Sridhar, Thomas Brunschwiler, Thomas Toifl, Reto Christen, Jasmin Smajic
2016 6th Electronic System-Integration Technology Conference (ESTC), 1-6
Abstract   voltage regulator, voltage regulation, power management, power density, engineering, electronic engineering, electronic circuit, capacitor, cmos, buck converter

Intra-stack sealing of tier interconnects using the interconnect alloy
J. Kleff, G. Schlottig, R. Mrossko, W. Steller, H. Oppermann, J. Keller, T. Brunschwiler
2016 6th Electronic System-Integration Technology Conference (ESTC), 1-6
Abstract   thermocompression bonding, shear, materials science, intermetallic, interconnection, engineering drawing, electrical conductor, coolant, composite material, alloy

Dual-side heat removal by micro-channel cold plate and silicon-interposer with embedded fluid channels
Thomas Brunschwiler, Raul Mrossko, Jurgen Keller, Ozgur Ozsun, Gerd Schlottig
2016 6th Electronic System-Integration Technology Conference (ESTC), 1-6
Abstract   silicon, materials science, junction temperature, interposer, heat transfer, electronic engineering, electrical conductor, dissipation, coolant, convection

Stress Investigations in 3D-integrated Silicon Microstructures
M. Stiebing, E. Lörtscher, W. Steller, D. Vogel, M. J. Wolf, T. Brunschwiler, B. Wunderle
EuroSimE, 2016

Re-building the Underfill: Performance of percolating fillers at package scale
Uwe Zschenderlein, Mario Baum, Florian Schindler-Saekow, SridharGanesh Kumar, Gerd Schlottig, Wei-Shan Wang, Thomas Brunschwiler, Bernhard Wunderle
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp. 1-13
Abstract   thermal conductivity, thermal, soldering, natural convection, materials science, flip chip, fillet, delamination, computer cooling, composite material

Master curve synthesis by effective viscoelastic plastic material modeling
Florian Schindler-Saefkow, Remi Pantou, Gerd Schlottig, Sridhar Kumar, Thomas Brunschwiler, Juergen Keller, Bernhard Wunderle, Sven Rzepka
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp. 1-7
Abstract   viscoelasticity, materials science, harmonic, flip chip, finite element method, electronic engineering, creep, computation, complex geometry, ball

All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
Jonas Zuercher, Luca Del Carro, Gerd Schlottig, Daniel Nilsen Wright, Astrid-Sofie B. Vardoy, Maaike M Visser Taklo, Tobias Mills, Uwe Zschenderlein, Bernhard Wunderle, Thomas Brunschwiler
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), pp. 343-349, IEEE

Study of two-phase pressure drop and heat transfer in a micro-scale pin fin cavity: Part A
Arvind Sridhar, Ozgur Ozsun, Thomas Brunschwiler, Bruno Michel, Pritish Parida, Timothy Chainer
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 15th IEEE Intersociety Conference on, pp. 337-344, IEEE

Enhanced Percolating Thermal Underfills Achieved by Means of Nanoparticle Bridging Necks
Jonas Zurcher, Xi Chen, Brian R. Burg, Severin Zimmermann, Rahel Straessle, Andre R. Studart, Thomas Brunschwiler
IEEE Transactions on Components, Packaging and Manufacturing Technology 6(12), 1785-1795, 2016
Abstract   thermal conductivity, thermal, nanoparticle, metallurgy, flip chip, engineering, electrical conductor, conductivity, composite material, capillary action

Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability
Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler
Journal of Electronic Packaging 138(1), 2016
Abstract   topology, thermal resistance, thermal grease, structural engineering, pressure drop, network topology, integrated circuit, hydrostatic test, heat flux, engineering, electronic engineering, computer cooling

Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
Thomas Brunschwiler, Jonas Zurcher, Luca Del Carro, Gerd Schlottig, Brian Burg, Severin Zimmermann, Uwe Zschenderlein, Bernhard Wunderle, Florian Schindler-Saefkow, Rahel Stassle
Journal of Electronic Packaging 138(4), 2016
engineering, electronic engineering, chip

Benchmarking Study on the Thermal Management Landscape for Three-Dimensional Integrated Circuits: From Back-Side to Volumetric Heat Removal
Thomas Brunschwiler, Arvind Sridhar, Chin Lee Ong, Gerd Schlottig
Journal of Electronic Packaging 138(1), 2016
thermal management of electronic devices and systems, pressure drop, integrated circuit, heat flux, engineering, electronic engineering, dissipation, benchmarking


2015

Quantifying the thermal conductivity enhancement of percolating thermal underfills
Brian R Burg, Jonas Zuercher, Gerd Schlottig, Xi Chen, Thomas Brunschwiler
2015 European Microelectronics Packaging Conference (EMPC), pp. 1-4, IEEE

Benchmarking Study on the Thermal Management Landscape for 3D Ics: From Back-Side to Volumetric Heat Removal
T. Brunschwiler, A. Sridhar, C.L. Ong, G. Schlottig
In: Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems and 13th International Conference on Nanochannels, Microchannels, and Minichannels (InterPACK/ICNMM)

Advances in percolated thermal underfill (PTU) simulations for 3D-integration
S.G. Kumar, U. Zschenderlein, R. Pantou, T. Brunschwiler, G. Schlottig, F. Schindler-Saefkow, B. Wunderle
In: 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Embedded power insert enabling dual-side cooling of microprocessors
Thomas Brunschwiler, Dominic Gschwend, Stephan Paredes, Timo Tick, Keiji Matsumoto, Christoph Lehnberger, Jens Pohl, Uwe Zschenderlein, Stefano Oggioni
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), pp. 833-838
Abstract   thermal management of electronic devices and systems, materials science, electronic engineering, copper, composite material, cold plate, chip

Enhanced thermal underfills by bridging nanoparticle assemblies in percolating microparticle beds
Jonas Zuercher, Xi Chen, Brian R Burg, Severin Zimmermann, Guo Hong, Andre R Studart, Grzegorz Potasiewicz, Piotr Warszynski, Thomas Brunschwiler
Nanotechnology (IEEE-NANO) , 2015 IEEE 15th International Conference on , pp. 577-580

Lid-Integral Cold Plate Topology Integration, Performance, and Reliability
Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler
Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, 2015
Abstract   topology, thermal resistance, thermal grease, pressure drop, network topology, materials science, hydrostatic test, heat flux, finite element method, computer cooling

Steady-state low thermal resistance characterization apparatus: The bulk thermal tester
Brian R. Burg, Manuel Kolly, Nicolas Blasakis, Dominic Gschwend, Jonas Zuercher, Thomas Brunschwiler
Review of Scientific Instruments 86(12), 2015

Modeling and multi-objective optimization of 2.5D inductor-based Fully Integrated Voltage Regulators for microprocessor applications
Pedro A. M. Bezerra, Florian Krismer, Toke M. Andersen, Johann W. Kolar, Arvind Sridhar, Thomas Brunschwiler, Thomas Toifl, Mohamed Jatlaoui, Frederic Voiron, Zoran Pavlovic, Ningning Wang, Nicolas Cordero, Caroline Rabot, Cian O Mathuna
2015 IEEE 13th Brazilian Power Electronics Conference and 1st Southern Power Electronics Conference (COBEP/SPEC), pp. 1-6
Abstract   voltage regulator, switched mode power supply, power rating, power density, interposer, engineering, electronic engineering, control engineering, cmos, buck converter, boost converter

Thermal Design of a Hierarchical Radially Expanding Cavity for Two-Phase Cooling of Integrated Circuits
Arvind Sridhar, Chin Lee Ong, Stefan Paredes, Bruno Michel, Thomas Brunschwiler, Pritish Parida, Evan Colgan, Timothy Chainer, Catherine Gorle and Kenneth E. Goodson
ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels

Nanoparticle Assembly and Sintering Towards All-Copper Flip Chip Interconnects
J. Zürcher, K. Yu, G. Schlottig, M. Baum, M.M. Visser Taklo, B. Wunderle, P. Warszynski, T. Brunschwiler
In: 65th Electronic Components and Technology Conference (ECTC), pp. 1115-1121, 2015

A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: an experimental study
Chander Shekhar Sharma, Gerd Schlottig, Thomas Brunschwiler, Manish K. Tiwari, Bruno Michel, Dimos Poulikakos
International Journal of Heat and Mass Transfer88, 684-694, 2015

Energy efficient hotspot-targeted embedded liquid cooling of electronics
Chander Shekhar Sharma, Manish K. Tiwaria, Severin Zimmermann, Thomas Brunschwiler, Gerd Schlottig, Bruno Michel, Dimos Poulikakos
Applied Energy138, 414-422, 2015


2014

Thermal Power Plane enabling Dual-Side Electrical Interconnects for High-Performance Chip Stacks: Concept
Thomas Brunschwiler, Timo Tick, Ralph Heller, Gerd Schlottig, Hubert Harrer, Harry Barowski, Tim Niggemeier, Jochen Supper, and Stefano Oggioni
ESTC conference, 2014

Thermal characterization of percolating thermal underfills: Bulk and cavity
Brian R Burg, Manuel Koilly, Kaiyuan Yu, Jonas Zuercher, Gerd Schlottig, Thomas Brunschwiler
Thermal Investigations of ICs and Systems (THERMINIC), 2014 20th International Workshop on, pp. 1-6

Thermal Power Plane enabling Dual-Side Electrical Interconnects for High-Performance Chip Stacks: Implementation
Timo Tick, Stefano Oggioni, Michele Castriotta, Gerd Schlottig, Dominic Gschwend, Vijay Khanna, Shidong Li, Ralph Heller, and Thomas Brunschwiler
ESTC conference, 2014

Characterization of particle beds in percolating thermal underfills based on centrifugation
Severin Zimmermann, Thomas Brunschwiler, Brian R Burg, Jonas Zuercher, Guo Hong, Dimos Poulikakos, Mario Baum, Christian Hofmann
3D Systems Integration Conference (3DIC), 2014 IEEE International, 1-7

Computational Modeling of Hot-Spot Identification and Control in 3-D Stacked Chips with Integrated Cooling
Fabio Alfieri, Sacha Gianini, Manish K. Tiwari, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos
Numerical Heat Transfer Part A-applications 65(3), 201-215, 2014
Abstract   reynolds number, pressure drop, mathematics, heat transfer, forced convection, electronics, electronic engineering, classical mechanics, chip

(Invited) Wafer-Level Integration of Embedded Cooling Approaches
Stephan Paredes, Yassir Madhour, Gerd Schlottig, Chin Lee Ong, Thomas Brunschwiler
ECS Transactions 64(5), 253-265, The Electrochemical Society, 2014

Invited: Wafer-Level Integration of Embedded Cooling Approaches
Stephan Paredes, Yassir Madhour, Gerd Schlottig, Chin Lee Ong, Thomas Brunschwiler
Meeting Abstracts, pp. 1738--1738, 2014

Thermo-mechanical properties of underfills at partial and full filler percolation-sub-layering the underfill
Gerd Schlottig, Marie Haupt, Severin Zimmermann, Jonas Zuercher, Thomas Brunschwiler
Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2014 15th international conference on, pp. 1-7

Study of the compound of properties of percolating and neck-based thermal underfills
Thomas Brunschwiler, Florian Schindler-Saefkow, Rachel Gordin, Marie Haupt, Gerd Schlottig
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on, pp. 227--234

Laminate with Thermal-Power Insert for Efficient Front-Side Heat Removal and Power Delivery
Dominic Gschwend, Timo Tick, Stefano Oggioni, Stephan Paredes, Keiji Matsumoto, Manish K Tiwari, Dimos Poulikakos, Thomas Brunschwiler
Integrated Power Systems (CIPS), 2014 8th International Conference on, pp. 1--6

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging
Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V Goicochea, Jonas Zuercher, Heiko Wolf
Journal of Electronic Packaging 136(4), 041012, American Society of Mechanical Engineers, 2014


2013

Sequentially formed underfills: Thermo-mechanical properties of underfills at full filler percolation
Gerd Schlottig, Florian Schindler-Saefkow, Jonas Zuercher, Bruno Michel, Thomas Brunschwiler
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th, pp. 560--564

Computational modeling of vortex shedding in water cooling of 3D integrated electronics
Fabio Alfieri, Manish K Tiwari, Adrian Renfer, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos
International Journal of Heat and Fluid Flow44, 745-755, Elsevier, 2013

STEAM: a fast compact thermal model for two-phase cooling of integrated circuits
Arvind Sridhar, Yassir Madhour, David Atienza, Thomas Brunschwiler, John Thome
Proceedings of the International Conference on Computer-Aided Design, pp. 256--263, 2013

Hybrid porous media and fluid domain modeling strategy to optimize a novel staggered fin heat sink design
Ningkang Li, Gerd Schlottig, Marco De-Fazio, Chander Shekhar Sharma, Manish Tiwari, Roberto Brioschi, Dimos Poulikakos, Thomas Brunschwiler
Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on, pp. 224--230

Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks
Adrian Renfer, Manish K Tiwari, Rashmita Tiwari, Fabio Alfieri, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos
International Journal of Heat and Mass Transfer65, 33-43, Elsevier, 2013

Roadmap towards ultimately-efficient zeta-scale datacenters
P. Ruch, T. Brunschwiler, S. Paredes, G. I. Meijer, B. Michel
Conference on Design, Automation and Test in Europe, pp. 1339--1344, 2013

Investigation of novel solder patterns for power delivery and heat removal support
Thomas Brunschwiler, Yassir Madhour, Timo Tick, Gerd Schlottig, Stefano Oggioni
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, pp. 417--424

3D-ICE: A compact thermal model for early-stage design of liquid-cooled ics
Arvind Sridhar, Alessandro Vincenzi, David Atienza, Thomas Brunschwiler
2013 - ieeexplore.ieee.org, IEEE

Integration of intra chip stack fluidic cooling using thin-layer solder bonding
Yassir Madhour, Michael Zervas, Gerd Schlottig, Thomas Brunschwiler, Yusuf Leblebici, John Richard Thome, Bruno Michel
3D Systems Integration Conference (3DIC), 2013 IEEE International, pp. 1--8

Sequentially formed underfills: Thermo-mechanical properties of underfills at full filler percolation
Gerd Schlottig, Florian Schindler-Saefkow, Jonas Zurcher, Bruno Michel, Thomas Brunschwiler
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th, pp. 560-564

Vortex shedding from confined micropin arrays
Adrian Renfer, Manish K Tiwari, Ferdinand Meyer, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos
Microfluidics and Nanofluidics 15(2), 231-242, Springer, 2013


2012

Formulation of percolating thermal underfills using hierarchical self-assembly of micro- and nanoparticles by centrifugal forces and capillary bridging
Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zurcher, Heiko Wolf
Journal of microelectronics and electronic packaging 2012(1), 749-759
Abstract   thermal conductivity, self assembly, particle size, particle, nanoparticle, materials science, evaporation, composite material, capillary bridges, capillary action

Cloud Computing
Olivier Brian, Thomas Brunschwiler, Heinz Dill, Hanspeter Christ, Babak Falsafi, Markus Fischer, Stella Gatziu Grivas, Claudio Giovanoli, Roger Eric Gisi, Reto Gutmann, others
White Paper SATW, 2012

Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
T Brunschwiler, S Paredes, U Drechsler, B Michel, B Wunderle, H Reichl
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on, pp. 574--587

On the significance of developing boundary layers in integrated water cooled 3D chip stacks
Fabio Alfieri, Manish K Tiwari, Igor Zinovik, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos
International Journal of Heat and Mass Transfer 55(19), 5222--5232, Elsevier, 2012

Formulation of percolating thermal underfills using hierarchical self-assembly of micro-and nanoparticles by centrifugal forces and capillary bridging
Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V Goicochea, Jonas Zuercher, Heiko Wolf
J. Microelectron. Electron. Packag 9(4), 149--159, 2012

Directed Self-Assembly of Nanoparticles for Novel Electrical Interconnects
Yu Liu, Gerd Schlottig, Heiko Wolf, Georgios A. Sotiriou, and Thomas Brunschwiler
ICEPT conference, pp. 1--7, 2012

Enhanced centrifugal percolating thermal underfills based on neck formation by capillary bridging
Javier V Goicochea, Thomas Brunschwiler, Jonas Zuercher, Heiko Wolf, Keiji Matsumoto, Bruno Michel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on, pp. 1234--1241

Waste heat recovery in supercomputers and 3D integrated liquid cooled electronics
M. K. Tiwari, S. Zimmermann, C. S. Sharma, F. Alfieri, A. Renfer, T. Brunschwiler, G. I. Meijer, B. Michel, D. Poulikakos
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 545--551, 2012

A multivariate parameter analysis of copper pillars eases the design of denser interconnects
Gerd Schlottig, Thomas Brunschwiler, Javier Goicochea, Werner Escher, Bruno Michel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on, pp. 1--6

Patterned die-to-die thin film bonding for 3D chip stacks with integrated microfluidic cooling
Yassir Madhour, Thomas Brunschwiler, Mario El Kazzi, John Richard Thome, Bruno Michel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on, pp. 68--73

Centrifugal Formulation of Percolating Thermal Underfills for Flip-Chip Applications
Jonas Zuercher, Javier V Goicochea, Keiji Matsumoto, Bruno Michel, Thomas Brunschwiler
Integrated Power Electronics Systems (CIPS), 2012 7th International Conference on, pp. 1-6


2011

Energy-Efficient Multiobjective Thermal Control for Liquid-Cooled 3-D Stacked Architectures
M M Sabry, A K Coskun, D Atienza, T S Rosing, T Brunschwiler
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on 30(12), 1883--1896, IEEE, 2011

Surface-tension-driven multi-chip self-alignment techniques for heterogeneous 3D integration
F Sun, Y Leblebici, T Brunschwiler
Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st, pp. 1153--1159

Experimental investigation into vortex structure and pressure drop across microcavities in 3D integrated electronics
Adrian Renfer, Manish K Tiwari, Thomas Brunschwiler, Bruno Michel, Dimos Poulikakos
Experiments in fluids 51(3), 731--741, Springer, 2011

On the cooling of electronics with nanofluids
W Escher, T Brunschwiler, N Shalkevich, A Shalkevich, T Burgi, B Michel, D Poulikakos
Journal of heat transfer 133(5), 051401, American Society of Mechanical Engineers, 2011

Toward five-dimensional scaling: How density improves efficiency in future computers
P Ruch, T Brunschwiler, W Escher, S Paredes, B Michel
IBM Journal of Research and Development 55(5), 15:1--13, IBM, 2011

Towards thermally-aware design of 3D MPSoCs with inter-tier cooling
Mohamed M Sabry, Arvind Sridhar, David Atienza, Yuksel Temiz, Yusuf Leblebici, Sylwia Szczukiewicz, Navid Borhani, John Richard Thome, Thomas Brunschwiler, Bruno Michel
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2011, pp. 1-6

Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
T Brunschwiler, S Paredes, U Drechsler, B Michel, B Wunderle, H Reichl
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2011 27th Annual IEEE, pp. 116--124


2010

Direct waste heat utilization from liquid-cooled supercomputers
T. Brunschwiler, G. I. Meijer, S. Paredes, W. Escher, B. Michel
International Heat Transfer Conference, pp. 429--440, 2010

3D integrated water cooling of a composite multilayer stack of chips
Fabio Alfieri, Manish K Tiwari, Igor Zinovik, Dimos Poulikakos, Thomas Brunschwiler, Bruno Michel
Journal of Heat Transfer 132(12), 121402, American Society of Mechanical Engineers, 2010

Experimental investigation of an ultrathin manifold microchannel heat sink for liquid-cooled chips
W Escher, T Brunschwiler, B Michel, D Poulikakos
Journal of Heat Transfer 132(8), 081402, American Society of Mechanical Engineers, 2010

Pin-shape assessment for interlayer-cooled chip stacks with periodic boundary condition modeling
G Toral, R Bender, Y Leblebici, T Brunschwiler
Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on, pp. 1--10

Zero-emission datacenters and 3D chip stacking
T. Brunschwiler, G. I. Meijer, S. Paredes, W. Escher, B. Michel
International Conference on Thermal Issues in Emerging Technologies Theory and Applications, pp. 3--3, 2010

Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling design
R Wälchli, T Brunschwiler, B Michel, D Poulikakos
International Journal of Heat and Mass Transfer 53(5), 1004-1014, Elsevier, 2010

Heat-removal performance scaling of interlayer cooled chip stacks
T. Brunschwiler, S. Paredes, U. Drechsler, B. Michel, W. Cesar, Y. Leblebici, B. Wunderle, H. Reichl
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1, 2010

Self-contained, oscillating flow liquid cooling system for thin form factor high performance electronics
R Wälchli, T Brunschwiler, B Michel, D Poulikakos
Journal of Heat Transfer 132(5), 051401, American Society of Mechanical Engineers, 2010

Compact Transient Thermal Model for 3D ICs with Liquid Cooling via Enhanced Heat Transfer Cavity Geometries
A S A V M Ruggiero, T Brunschwiler, D Atienza
Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on, pp. 1--6

Energy-efficient variable-flow liquid cooling in 3D stacked architectures
Ayse Kivilcim Coskun, David Atienza, Tajana Simunic Rosing, Thomas Brunschwiler, Bruno Michel
Design, Automation & Test in Europe Conference & Exhibition, pp. 111-116, 2010

3d-ice: Fast compact transient thermal modeling for 3d ics with inter-tier liquid cooling
A Sridhar, A Vincenzi, M Ruggiero, T Brunschwiler, D Atienza
Proceedings of the International Conference on Computer-Aided Design, pp. 463--470, 2010


2009

Antenna coupled far-infrared/THz detector in CMOS
T. Morf, J. Weiss, L. Kull, H. Rothuizen, T. Toifl, M. Kossel, C. Menolfi, G. von Bueren, T. Brunschwiler, M. Schmatz
Electronics Letters 45(25), 1321-1323, IET, 2009

Validation of the Porous-medium Approach to Model Interlayer-cooled 3D-chip Stacks
Thomas Brunschwiler, Stephan Paredes, Ute Drechsler, Bruno Michel, W Cesar, G Toral, Yuksel Temiz, Yusuf Leblebici
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on, pp. 1--10

Hotspot-adapted cold plates to maximize system efficiency
Thomas Brunschwiler, Hugo Rothuizen, Stephan Paredes, B Michel, Evan Colgan, Pepe Bezama
Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on, pp. 150--156


Toward zero-emission data centers through direct reuse of thermal energy
Thomas Brunschwiler, Brian Smith, E Ruetsche, Bruno Michel
IBM Journal of Research and Development 53(3), 11, IBM, 2009

Interlayer cooling potential in vertically integrated packages
T. Brunschwiler, B. Michel, H. Rothuizen, U. Kloter, B. Wunderle, H. Oppermann, H. Reichl
Microsystem Technologies 15(1), 57-74, Springer, 2009


2008

Thermal management of vertically integrated packages
Thomas Brunschwiler, Bruno Michel
Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits, 635--649, Wiley Online Library, 2008

Design of thermal interfaces with embedded microchannels to control bond line formation
Brian Smith, Hugo Rothuizen, Ryan Linderman, Thomas Brunschwiler, Bruno Michel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on, pp. 410--418

Radially oscillating flow hybrid cooling system for low profile electronics applications
R Walchli, R Linderman, T Brunschwiler, U Kloter, H Rothuizen, N Bieri, D Poulikakos, B Michel
Semiconductor Thermal Measurement and Management Symposium, 2008. Semi-Therm 2008. Twenty-fourth Annual IEEE, pp. 142--148

Forced convective interlayer cooling in vertically integrated packages
Thomas Brunschwiler, B Michel, Hugo Rothuizen, U Kloter, B Wunderle, H Oppermann, H Reichl
Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on, pp. 1114--1125


2007

Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance
T. Brunschwiler, U. Kloter, R.J. Linderman, H. Rothuizen, B. Michel
Components and Packaging Technologies, IEEE Transactions on 30(2), 226--234, IEEE, 2007

Utility of transient testing to characterize thermal interface materials
B Smith, T Brunschwiler, B Michel
Thermal Investigation of ICs and Systems, 2007, pp. 6--11

High-performance thermal interface technology overview
R Linderman, T Brunschwiler, B Smith, B Michel
Thermal Investigation of ICs and Systems, 2007, pp. 129--134

Hierarchical nested surface channels for reduced particle stacking and low-resistance thermal interfaces
RJ Linderman, T Brunschwiler, U Kloter, H Toy, B Michel
Semiconductor Thermal Measurement and Management Symposium, 2007, pp. 87--94


2006

Microchip cooling module based on FC72 slot jet arrays without cross-flow
M. Fabbri, A. Wetter, B. Mayer, T. Brunschwiler, B. Michel, H. Rothuizen, R. Linderman, U. Kloter
Semiconductor Thermal Measurement and Management Symposium, 2006 IEEE Twenty-Second Annual IEEE, pp. 54--58

Direct Liquid Jet-Impingment Cooling With Micron-Sized Nozzle Array and Distributed Return Architecture
Thomas Brunschwiler, Hugo Rothuizen, Matteo Fabbri, Urs Kloter, Bruno Michel, RJ Bezama, Govindarajan Natarajan
Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM'06. The Tenth Intersociety Conference on, pp. 196--203


2005

Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance [IC cooling applications]
T. Brunschwiler, U. Kloter, R. Linderman, H. Rothuizen, B. Michel
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE, pp. 31--38


2004

Polarization-independent thermooptic phase shifters in silicon-oxynitride waveguides
B.J. Offrein, D. Jubin, T. Koster, T. Brunschwiler, F. Horst, D. Wiesmann, G. I. Meijer, M. Sousa Petit, D. Webb, R. Germann
Photonics Technology Letters 16, 1483, 2004

Hysteretic electroluminescence in organic light-emitting diodes for spin injection
G. Salis, SF Alvarado, M. Tschudy, T. Brunschwiler, R. Allenspach
Physical Review B 70(8), 085203, APS, 2004