Thomas Brunschwiler  Thomas Brunschwiler photo         

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Zurich Research Laboratory, Zurich, Switzerland
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Professional Associations

Professional Associations:  IEEE

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More information:  Member of the Board of Governer of IEEE EPS


2018

Cooling device with nested chambers for computer hardware
Thomas Brunschwiler, Ingmar Meijer, Bruno Michel, Stephan Paredes, Gerd Schlottig
Patent US 15/176842

CIRCUITIZED SUBSTRATE WITH ELECTRONIC COMPONENTS MOUNTED ON TRANSVERSAL PORTION THEREOF
Thomas J. Brunschwiler, Sebastian Gerke, Stefano Sergio Oggioni
transversal, substrate, materials science, electronic engineering, electronic component

Dense Assembly of Laterally Soldered, Overmolded Chip Packages
Thomas J. Brunschwiler, Andreas Christian Doering, Ronald Peter Luijten, Stefano Sergio Oggioni, Patricia Maria Sagmeister, Martin Leo Schmatz
materials science, composite material, chip


2017

POROUS UNDERFILL ENABLING REWORK
Michael Gaynes, Jeffrey Gelorme, Thomas Brunschwiler, Brian Burg, Gerd Schlottig, Jonas Zuercher
thermal conductivity, rework, porosity, materials science, forensic engineering, flip chip, electrical conductor, composite material
Abstract


2016

Adaptive optical interconnection of components of an electro-optical circuit
Brunschwiler, Thomas J and La Porta, Antonio and Offrein, Bert J and Weiss, Jonas R
US Patent 9,389,362

BRIDGING ARRANGEMENT, MICROELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING A BRIDGING ARRANGEMENT
Thomas J. Brunschwiler, Brian Burg, Richard Dixon, Helge Kristiansen, Piotr Warszynski, Jonas Zuercher
structural engineering, nanotechnology, microelectronics, engineering, energy landscape, bridging
Abstract

CHIP PACKAGE FOR TWO-PHASE COOLING AND ASSEMBLY PROCESS THEREOF
Thomas J. Brunschwiler, Timothy Joseph Chainer, Evan George Colgan, Michael Anthony Gaynes, Jeffrey Donald Gelorme, Gerard McVicker, Ozgur Ozsun, Pritish Ranjan Parida, Mark Delorman Schultz, Bucknell C. Webb
materials science, electronic engineering, chip
Abstract

Releasable, threadless conduit connector for liquid manifold
Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Gerd Schlottig
manifold, engineering drawing, engineering, electrical conduit, computer hardware, channel, cable gland
Abstract

FLIP-CHIP ELECTRONIC DEVICE WITH CARRIER HAVING HEAT DISSIPATION ELEMENTS FREE OF SOLDER MASK
Stefano Oggioni, Thomas J Brunschwiler, Gerd Schlottig
soldering, solder mask, materials science, integrated circuit, flip chip, electronics, electronic engineering, electrical conductor, chip carrier, chip
Abstract

METHOD FOR ELECTRICAL COUPLING AND ELECTRIC COUPLING ARRANGEMENT
Thomas J. Brunschwiler, Richard Dixon, Maaike M. Visser Taklo, Bernhard Wunderle, Kerry Yu, Jonas Zuercher
suspension, sintering, pillar, nanoparticle, metallic bonding, materials science, electronic engineering, coupling, coupling, composite material
Abstract


2015

Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section
Thomas J. Brunschwiler, Dominic Gschwend, Keiji Matsumoto, Stefano S. Oggioni, Gerd Schlottig, Timo J. Tick, Jonas Zuercher
substrate, perpendicular, materials science, electronic engineering, electronic circuit
Abstract

PRINTED CIRCUIT BOARD WITH EDGE SOLDERING FOR HIGH-DENSITY PACKAGES AND ASSEMBLIES
Thomas Brunschwiler, Andreas Doering, Ronald P. Luijten, Stefano S. Oggioni, Joerg-Eric Sagmeister, Patricia Sagmeister, Martin Schmatz
soldering, printed circuit board, lateral surface, engineering, electronic engineering
Abstract

COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL
Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida, Gerd Schlottig, Mark D. Schultz, Joel A. Silberman
interposer, integrated circuit, inlet, geology, electronic engineering, channel, cold plate
Abstract

SUBSTRATE DEVICE AND ELECTRIC CIRCUIT ARRANGEMENT
Thomas J. Brunschwiler, Dominic Gschwend, Keiji Matsumoto, Stefano S. Oggioni, Gerd Schlottig, Timo J. Tick, Jonas Zuercher
substrate, perpendicular, engineering, electronic engineering, electronic circuit
Abstract



2014

METHOD FOR MANUFACTURING A FILLED CAVITY BETWEEN A FIRST AND A SECOND SURFACE
Thomas J. Brunschwiler, Stephan Paredes, Gerd Schlottig, Heiko Wolf
necking, materials science, engineering drawing, composite material
Abstract

Integrated helical multi-layer inductor structures
Thomas J Brunschwiler, Michele Castriotta, Rachel Gordin, Stefano Sergio Oggioni, Gerd Schlottig
materials science, inductor, electronic engineering, electrical conductor, dielectric, chip, cable gland
Abstract


2013

Manufacturing a filling of a gap in semiconductor devices
Thomas Brunschwiler, Javier V Goicochea, Heiko Wolf
US Patent 8,586,411

Manufacturing an underfill in a semiconductor chip package
Thomas J Brunschwiler, Javier V Goicochea, Stefano S Oggioni, Gerd Schlottig
US Patent App. 13/943,998

Chip stack structures that implement two-phase cooling with radial flow
Thomas J Brunschwiler, Evan G Colgan, John U Knickerbocker, Bruno Michael, Chin Lee Ong, Cornelia K Tsang
US Patent App. 14/015,063

Thermal power plane for integrated circuits
Harry Barowski, Thomas Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper
US Patent 8,427,833

Optimized semiconductor packaging in a three-dimensional stack
Harry Barowski, Thomas Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper
US Patent 8,476,112

Disassemblable electronic assembly with leak-inhibiting coolant capillaries
Thomas J Brunschwiler, Evan G Colgan, Michael J Ellsworth Jr, Werner Escher, Ingmar Meijer, Stephen Paredes, Gerd Schlottig, Jeffrey A Zitz
US Patent App. 13/743,642

Integrated circuit stack
Thomas J Brunschwiler, Ryan J Linderman, Bruno Michel, Hugo E Rothuizen
US Patent 8,363,402


2012

Heat Sink Integrated Power Delivery and Distribution for Integrated Circuits
H. Barowski, T. Brunschwiler, H. Harrer, A. Huber, B. Michel, T. Niggemeier, S. Paredes, J. Supper
US Patent 20,120,106,074

Manufacturing a filling of a gap region
Thomas J Brunschwiler, Javier V Goicochea, Heiko Wolf
US Patent App. 13/602,388

Optimizing Heat Transfer in 3-D Chip-Stacks
Thomas Brunschwiler, Eren Kursun, Gary W Maier
US Patent App. 13/494,047

Bridging arrangement and method for manufacturing a bridging arrangement
Thomas J Brunschwiler, Javier V Goicochea, Cyrill Kuemin, Walter H Riess, Heiko Wolf
US Patent App. 13/438,254

Integrated device with defined heat flow
Thomas Brunschwiler, Jens Hofrichter
US Patent App. 13/352,151

Electronic assembly with detachable coolant manifold and coolant-cooled electronic module
Thomas J Brunschwiler, Evan G Colgan, Michael J Ellsworth Jr, Werner Escher, G Ingmar Meijer, Stephan Paredes, Gerd Schlottig, Martin Witzig, Jeffrey A Zitz
US Patent App. 13/616,337

Adsorption heat exchanger devices
Thomas J Brunschwiler, Javier V Goicochea, Bruno Michel, Patrick Ruch
US Patent App. 14/128,822



2011

Integrated circuit package connected to a data transmission medium
Harry Barowski, Thomas Brunschwiler, Roger F Dangel, Hubert Harrer, Andreas Huber, Norbert M Meier, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper, others
US Patent App. 13/312,327

Transferring heat through an optical layer of integrated circuitry
Harry Barowski, Thomas Brunschwiler, Roger F Dangel, Hubert Harrer, Andreas Huber, Norbert M Meier, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper, others
US Patent App. 13/010,184

Integrated circuit package connected to an optical data transmission medium using a coolant
Harry Barowski, Thomas Brunschwiler, Roger F Dangel, Hubert Harrer, Andreas Huber, Norbert M Meier, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper, others
US Patent App. 13/312,583



COOLING SYSTEM FOR AN ELECTRONIC COMPONENT SYSTEM CABINET
T. Brunschwiler, R.J. Linderman, H.E. Rothuizen, R. Waelchli
EP Patent 2,326,903




2009

INTEGRATED CIRCUIT STACK AND ITS THERMAL MANAGEMENT
T.J. BRUNSCHWILER, R.J. LINDERMAN, B. MICHEL, H.E. ROTHUIZEN
WO Patent WO/2009/037,648

Semiconductor chip assembly with flexible metal cantilevers
Thomas J Brunschwiler, Urs Kloter, Ryan J Linderman, Bruno Michel, Hugo E Rothuizen
US Patent 7,532,475


PATTERNED STRUCTURE FOR A THERMAL INTERFACE
B. Michel, T.J. Brunschwiler, H.E. Rothuizen, U. Kloter
US Patent App. 12/538,797



2008

COOLANT PUMPING SYSTEM FOR MOBILE ELECTRONIC SYSTEMS
M. Bruno, T. Brunschwiler, U. Kloter, R.J. Linderman, E. Ruetsche
US Patent App. 12/194,973

METHOD AND DEVICE FOR COOLING A HEAT GENERATING COMPONENT
T.J. Brunschwiler, U. Koter, R.J. Linderman, B. Michel, H.E. Rothuizen, R. Waelchli
US Patent App. 12/676,398


2007


Thermal interface with a patterned structure
T.J. Brunschwiler, U. Kloter, R.J. Linderman, B. Michel, H.E. Rothuizen
US Patent 7,282,799

Stress release thermal interfaces
Bruno Michel, Thomas J Brunschwiler, Ryan J Linderman, Hugo E Rothuizen, Urs Kloter
US Patent 20,070,230,133


2006

SURFACE ADAPTING CAP WITH INTEGRAL ADAPTING MATERIAL FOR SINGLE AND MULTI CHIP MODULE ASSEMBLY
Thomas J Brunschwiler, Bruno Michel, Ryan Joseph Linderman, Urs Kloter, Hugo E Rothuizen
thermal, semiconductor device, optoelectronics, multi chip module, materials science, liquidus, image warping, hydrostatic pressure, electronic engineering, electrical conductor, chip
Abstract

Heat spreader
T.J. Brunschwiler, U. Kloter, R.J. Linderman, B. Michel, H.E. Rothuizen
US Patent App. 11/476,516

Cooling device
T.J. Brunschwiler, U. Kloter, R.J. Linderman, B. Michel, H.E. Rothuizen
US Patent App. 11/598,497