Keiji Matsumoto           

Publications(2014/9-2022/5)

Matsumoto as 1st author.

Hybrid bonding related activities

1. Conference name : 2022 IEEE 72snd Electronic Components and Technology Conference (ECTC)

Paper title : Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)

Authors : Keiji Matsumoto, Takahito Watanabe, Risa Miyazawa, Toyohiro Aoki, Takashi Hisada, Yuzo Nakamura, Yasuhisa Kayaba, Jun Kamada, Kazuo Kohmura

Thermal management related activities

1. Conference name : 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

Paper title : Thermal Analysis of DBHi (Direct Bonded Heterogeneous Integration) Si Bridge

Authors : Keiji Matsumoto; Marc Bergendahl; Kamal Sikka; Sayuri Kohara; Hiroyuki Mori; Takashi Hisada

PresentationChart

2. Conference name : 2016 IEEE 66st Electronic Components and Technology Conference (ECTC)

Paper title : Proposal of package structure requirements for effective cooling from the bottom side of chips (from the substrate side), aiming for a three-dimensional (3D) chip stack

Authors : Keiji Matsumoto; Hiroyuki Mori

3. Conference name : 2015 IEEE 65st Electronic Components and Technology Conference (ECTC)

Paper title : Dual-side cooling for a three-dimensional (3D) chip stack : Additional cooling from the laminate (substrate) side

Authors : Keiji Matsumoto; Hiroyuki Mori; Yasumitsu Orii

4. Conference name : 2014 International 3D Systems Integration Conference (3DIC)

Paper title : Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack,

Authors : Keiji Matsumoto; Hiroyuki Mori; Yasumitsu Orii

Chip-Package-Interaction(CPI) related activities

1. Conference name : 2017 ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (INTERPACK 2017)

Paper title : The mechanism of the low-k stress reduction in chip assembly by shorter solder bump height

Authors : Keiji Matsumoto;　Keishi Okamoto; Hiroyuki Mori

Healthcare related activities

1. Conference name : 2019 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC)

Paper title : An earbud-type wearable (A hearable) with vital parameter sensors for early detection and prevention of heat-stroke

Authors : Keiji Matsumoto; Yuksel Temiz; Hamidreza Taghavi; Elrick L. Cornelius; Hiroyuki Mori; Bruno Michel

Matsumoto as a non- 1^st author

Healthcare related activities

1. Conference name : 2017 IEEE/ACM International Conference on Connected Health: Applications, Systems and Engineering Technologies (CHASE)

Paper title : Internet of the body and cognitive hypervisor

Authors : R. Strässle; S. Gerke; T. Brunschwiler; Y. Temiz; J. Weiss; A. Sridhar; S. Paredes; E. Loertscher; N. Ebejer;B. Michel; H.-M. Lee; C. Alvarado; I. Faro; T. Van Kessel; Meghelli; M. A. Taubenblatt; S. Zafar; F. Libsch; K. Matsumoto

AI related activities (HyperTaste, Cogniscent)

1. Journal name : Analytical chemistry

Title : “Simultaneous quantification of multiple cations in aqueous mixtures using a portable integrated sensor array and automated machine learning pipeline”

Authors : Gianmarco Gabrieli, Rui Hu, Keiji Matsumoto, Yuksel Temiz, Sacha Bissig, Ralph Heller, Anto-nio Lòpez, Jorge Barroso, Kitahiro Kaneda, Yasumitsu Orii, Patrick W. Ruch

2. Conference name : IMCS (18th International Meeting on Chemical Sensors)
Paper title : Quantification of Multi-Ion Mixtures Using a Machine Learning Assisted Integrated Electronic Tongue Leveraging Mobile and Cloud Platforms
Authors :  Gianmarco Gabrieli (Zurich), Rui Hu (Zurich), Keiji Matsumoto, Yuksel Temiz (Zurich), Sacha Bissig (Zurich), Ralph Heller (Zurich), Anto-nio Lòpez (Zurich), Jorge Barroso (YKT), Kitahiro Kaneda (Nagase), Yasumitsu Orii (Nagase), Patrick W. Ruch (Zurich)

3. Conference name : 2019 IEEE International Symposium on Olfaction and Electronic Nose (ISOEN)

Paper title : A portable potentiometric electronic tongue leveraging smartphone and cloud platforms

Authors : Patrick W. Rucha, Rui Hua, Luca Capuaa, Yuksel Temiza, Stephan Paredesa, Antonio Lopez Marinb,Jorge Barroso Carmonab, Aaron Coxb, Eiji Nakamura, Keiji Matsumoto

4. Conference name : 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

Paper title : Study of Design Optimization Method for Ultra-Low Power Micro Gas Sensor,

Authors : Eiji Nakamura; Keiji Matsumoto; Andrea Fasoli; Luisa Bozano; Hiroyuki Mori

Thermo-mechanical related activities

1. Conference name : ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, (INTERPACK 2015)

Paper title : THERMAL STRESS SIMULATION FOR 3D SIP WITH TSV STRUCTURE UNDER

UNSTEADY THERMAL LOADS

Authors : Takahiro Kinoshita, Takashi Kawakami, Tomoya Sugiura, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii

Thermal management related activities

1. Conference name : 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

Paper title : Integrated Stacked Silicon Microcoolers

Authors : Marc Bergendahl; Aakrati Jain; Dishit Parekh; Iqbal Saraf; Ravi Bonam; Kamal Sikka; Dario Goldfarb; Hongqing Zhang; Ed Cropp; Risa Miyazawa; Keiji Matsumoto; Takashi Hisada; Hiroyuki Mori

2. Conference name : 2015 IEEE 65st Electronic Components and Technology Conference (ECTC)

Paper title : Embedded Power Insert Enabling Dual-Side Cooling of Microprocessors

Authors : Thomas Brunschwiler; Dominic Gschwend; Stephan Paredes; Timo Tick; Keiji Matsumoto; Christoph Lehnberger; Jens Pohl; Uwe Zschenderlein; Stefano Oggioni;

3. Conference name : CIPS 2014; 8th International Conference on Integrated Power Electronics Systems

Paper title : Laminate with thermal-power insert for efficient front-side heat removal and power delivery

Authors : Dominic Gschwend; Timo Tick; Stefano Oggioni; Stephan Paredes; Keiji Matsumoto; Manish K. Tiwari; Dimos Poulikakos; Thomas Brunschwiler

4. Conference name : 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Paper title : Enhanced centrifugal percolating thermal underfills based on neck formation by capillary bridging,

Authors : Javier V. Goicochea; Thomas Brunschwiler; Jonas Zürcher; Heiko Wolf; Keiji Matsumoto; Bruno Michel

Other packaging related activities

1. Conference name : 2016 Pan Pacific Microelectronics Symposium (Pan Pacific)

Paper title : Advanced interconnect technologies in the era of cognitive computing,

Authors : Yasumitsu Orii; Akihiro Horibe; Keiji Matsumoto; Toyohiro Aoki; Kuniaki Sueoka; Sayuri Kohara; Keishi Okamo; Shintaro Yamamichi; Kohji Hosokawa; Hiroyuki Mori

Battery related activities

1. Conference name : MES (Micro Electronics Symposium) 2021 
Paper title : Dependence of Battery Characteristics on Electrolyte Concentration for Non-rechargeable Zinc-air Battery with Citric Acid
Authors : Takahito Watanabe, Keiji Matsumoto, Hiroyuki Mori, Takashi Hisada
Status : MES 2021 is held as a virtual conference. Full paper is submitted and the presentation is recorded. Q&A session is held on live.

Publications(2011-2014/8)

1. Semi-Therm 2014 (Semiconductor Thermal Measurement and Management Symposium 2014)

Title : High thermal conductivity underfill for the thermal management of three-dimensional (3D) chip stacks

Authors : Keiji Matsumoto, Hiroyuki Mori, Yasumitsu Orii, Hideki Kiritani(Mitsubishi Chemical Corporation (MCC)), Yasuhiro Kawase(MCC), Makoto Ikemoto(MCC), Masanori Yamazaki(MCC), Masaya Sugiyama(MCC), Fumikazu Mizutani(MCC)

2. 3D-IC 2013 (IEEE International 3D Systems Integration Conference) (accepted as poster presentation, but declined presentation, because the overseas trip for poster presentation is not allowed)

      Title : Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack

Authors : Keiji Matsumoto, Soichiro Ibaraki(ASET), Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi(ASET), Hiroyuki Mori, Yasumitsu Orii, Fumiaki Yamada, Kohei Fujihara(Denso), Junichi Takamatsu(Denso), Koji Kondo(Denso)

3. Semi-Therm 2013

Title : Thermal design guidelines for a three-dimensional (3D) chip stack, including cooling solutions.

Authors : Keiji Matsumoto, Soichiro Ibaraki(ASET), Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi(ASET) Yasumitsu Orii and Fumiaki Yamada

4. Semi-Therm 2012

Title : Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack, including the transient measurements

Authors : Keiji Matsumoto, Soichiro Ibaraki(ASET), Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi(ASET) Yasumitsu Orii and Fumiaki Yamada

5. Semi-Therm 2011

Title : Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack

Authors : Keiji Matsumoto, Soichiro Ibaraki(ASET), Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi (ASET), Yasumitsu Orii and Fumiaki Yamada

6. EMAP 2011 (13th International Conference on Electronics Materials and Packaging)

Title : Experimental thermal resistance evaluation of a three-dimensional (3D) chip stack, focusing on TSV (Through-Silicon-Via)

Authors : Keiji Matsumoto, Soichiro Ibaraki(ASET), Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi(ASET) Yasumitsu Orii and Fumiaki Yamada

7. Journal of JIEP (Japan Institute of Electronics Packaging) 2012

      Title : Structure analysis and thermal analysis for future packaging

      Authors : Keiji Matsumoto, Sayuri Kohara, Keishi Okamoto, Yasumitsu Orii

      (This is also published in “Surface Mount Technology” of Korea.)

8. 51^st National Heat Transfer Symposium of Japan 2014

       Title : Challenges of thermal management for three-dimensional (3D) packaging

Authors : Keiji Matsumoto,

9. Mate 2013 (Symposium on micro-interconnection and packaging technology)

Title : Evaluation of the thermal resistance of a three-dimensional (3D) chip stack and appropriate cooling solutions

Authors : Keiji Matsumoto, Soichiro Ibaraki(ASET), Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi(ASET) Yasumitsu Orii and Fumiaki Yamada

10. Mate 2012

Title : Thermal characterization of a three-dimensional (3D) chip stack, focusing on TSV(Through-Silicon-Via)

Authors : Keiji Matsumoto, Soichiro Ibaraki(ASET), Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi(ASET) Yasumitsu Orii and Fumiaki Yamada

11. Mate 2011

Title : Thermal characterization of a three-dimensional (3D) chip stack based on experiments and simulation

Authors : Keiji Matsumoto, Soichiro Ibaraki(ASET), Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi(ASET) Yasumitsu Orii and Fumiaki Yamada

12. Symposium of thermal management 2013

      Title : Thermal characterization and management of a three-dimensional (3D) packaging

Authors : Keiji Matsumoto, Soichiro Ibaraki(ASET), Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi(ASET) Yasumitsu Orii and Fumiaki Yamada

13. Technical division(RC259) of the Japan Society of Mechanical Engineering 2013

Title : Thermal characterization of a three-dimensional (3D) packaging

Authors : Keiji Matsumoto, Soichiro Ibaraki(ASET), Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi(ASET) Yasumitsu Orii and Fumiaki Yamada

14.  Cybernet seminar on Warp Simulation Tool (2013/2/22)

      Title : Laminate warp prediction method

Authors : Keiji Matsumoto, Keishi Okamoto, Yasumitsu Orii, Hiroyuki Mori, Hien Dang, Sri Sri-Jayantah

15. Technical seminar held by “Electric Journal” (2013/6/13)

      Title : Thermal resistance and appropriate cooling solutions for 3D chip stack

Authors : Keiji Matsumoto, Soichiro Ibaraki(ASET), Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi(ASET), Hiroyuki Mori, Yasumitsu Orii, Fumiaki Yamada, Kohei Fujihara(Denso), Junichi Takamatsu(Denso), Koji Kondo(Denso)

16. Thermal management division of JIEP (Japan Institute of Electronics Packaging) (2013/7/11)

Title : Thermal resistance evaluation of a three-dimensional (3D) chip stack and also, of cooling solutions.

Authors : Keiji Matsumoto , Soichiro Ibaraki(ASET), Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi(ASET), Yasumitsu Orii and Fumiaki Yamada, Kohei Fujihara(Denso), Junichi Takamatsu(Denso), Koji Kondo(Denso)

17. Thermal design forum (2013/7/22)

      Title : Thermal resistance and appropriate cooling solutions for 3D chip stack

Authors : Keiji Matsumoto, Soichiro Ibaraki(ASET), Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi(ASET), Hiroyuki Mori, Yasumitsu Orii, Fumiaki Yamada, Kohei Fujihara(Denso), Junichi Takamatsu(Denso), Koji Kondo(Denso)

Co-authors (An extract version)

1. Best paper award at ICEP(International Conference on Electronics Packaging) 2013

Title : Cooling strategy and structure of 3D integrated image sensor for auto-mobile application

Authors : F. Yamada, K. Matsumoto, T. Hatakeyama(Toyama Pref. Univ.), M. Ishizuka(Toyama Pref. Univ.), K. Otsuka (Meisei Univ.),K. Kondo(Denso), H. Kobayashi (ASET), K. Sueoka, A. Horibe, S. Kohara, H. Mori, and Y. Orii,

2. IMAPS 2014 (47th International Microelectronics Assembly and Packaging Society)

Title : Pre-applied Inter Chip Fill for 3D-IC Joining

Authors : Yasuhiro Kawase (MCC), Makoto Ikemoto (MCC), Masaya Sugiyama (MCC), Hideki Kiritani (MCC), Fumikazu Mizutani (MCC), Keiji Matsumoto, Hiroyuki Mori, Yasumitsu Orii

3. IMAPS 2013

Title : High Thermal Conductive Inter Chip Fill for 3D-IC through Pre-applied Joining Process

Authors : Yasuhiro Kawase (MCC), Makoto Ikemoto (MCC), Masanori Yamazaki (MCC), Masaya Sugiyama (MCC), Hideki Kiritani (MCC), Fumikazu Mizutani (MCC)

Keiji Matsumoto, Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii

4.  3D IC 2012

      Title : Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration

Authors : Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Katsuyuki Sakuma, Keiji Matsumoto, Fumiaki Yamada, Takahiro Kinoshita and Takashi Kawakami (Toyama Prefectural Univ.)