PaperEffects of failure criteria on the lifetime distribution of dual-damascene Cu line/via on WR.F. Liu, C.-K. Hu, et al.Journal of Applied Physics
Conference paperSystematic study of workfunction engineering and scavenging effect using NiSi alloy FUSI metal gates with advanced gate stacksY.-H. Kim, C. Cabral Jr., et al.IEDM 2005
Conference paperImpact of Cu microstructure on electromigration reliabilityC.-K. Hu, L. Gignac, et al.IITC 2007
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