What’s Next in Semiconductors
is powering full-stack AI
The way the world computes is shifting. Over the last decade, demand for AI applications has grown exponentially. Pipelines are getting more complex, and the world needs new hardware to train and serve AI at the scale enterprise demands. At IBM Research, we’re building the hardware and the tools to serve cutting-edge AI. We’re pushing the limits of semiconductor design, packaging, and connectivity, with innovations like sub-2 nm node chips, co-packaged optics, the AIU family of chips, and 3D nanosheet transistor technology. We’re building tomorrow’s AI supercomputers from the ground up.
Our work
- Technical noteYue Zhu, Radu Stoica, Animesh Trivedi, Jonathan Terner, Frank Schmuck, Jeremy Cohn, Christof Schmitt, Anthony Hsu, Guy Margalit, Vasily Tarasov, Swaminathan Sundararaman, Talia Gershon, and Vincent Hsu
It takes a village to make open infrastructure for AI a reality
NewsPeter HessExpanding AI model training and inference for the open-source community
NewsPeter HessBuilding the IBM Spyre Accelerator
ReleasePeter HessIBM researchers win prestigious European grants
NewsPeter Hess and Mike MurphyHow the IBM Research AI Hardware Center is building tomorrow’s processors
Deep DivePeter Hess- See more of our work on Semiconductors
AI Hardware Center
The IBM Research AI Hardware Center is a global research collaboration hub dedicated to creating the next generation of systems and chips for AI workloads, as well as expanding joint research efforts across technology, architecture, and algorithms.
Publication collections
Materials Research Society (MRS) Fall Meeting
30 NovDAC 2025
10
ACM/IEEE Design Automation Conference
22 JunACM/IEEE Annual International Symposium on Computer Architecture
21 JunIEEE Symposium on VLSI Technology and Circuits
08 Jun