Xikun Hu, Wenlin Liu, et al.
IEEE J-STARS
The new high temperature superconductors open up possible applications in magnets, power transmission, computer interconnections, Josephson devices and instrumentation, among many others. This paper presents a case study of one of these applications — the use of superconducting interconnects in 77 K CMOS semiconducting chips and packages. Significant leverage vis-a-vis normal metal interconnects at 77 K appears primarily in the packaging (rather than on-chip) and only at high performance (high frequency). As in other applications, this encourages a long-term view of the impact of high temperature superconductivity. © 1988, Elsevier Science Publishers B.V.. All rights reserved.
Xikun Hu, Wenlin Liu, et al.
IEEE J-STARS
Frank Stem
C R C Critical Reviews in Solid State Sciences
Julian J. Hsieh
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Dipanjan Gope, Albert E. Ruehli, et al.
IEEE T-MTT