Elena Ferro, A. Vasilopoulos, et al.
ISCAS 2024
This article describes the design, fabrication, and thermal performance of 300-mm-diameter wafer-scale Si microchannel coolers that demonstrated a junction temperature rise of less than 18 °C when dissipating about 14 kW of power. A thermal test wafer, which included hot-spot regions to mimic high-power compute cores, was attached to the wafer-scale microchannel cooler with Pb-Sn solder. Glass manifold layers were attached to the microchannel wafer using a frit material. The average apparent heat transfer coefficient, happ, was about 104000 W/(K-m2).
Elena Ferro, A. Vasilopoulos, et al.
ISCAS 2024
Katsuyuki Sakuma
VLSI Technology and Circuits 2025
Juan Miguel De Haro, Rubén Cano, et al.
IPDPS 2022
Prabudhya Roy Chowdhury, Sathya Raghavan, et al.
ECTC 2023