Martin Cochet, Karthik Swaminathan, et al.
ISCA 2024
This article describes the design, fabrication, and thermal performance of 300-mm-diameter wafer-scale Si microchannel coolers that demonstrated a junction temperature rise of less than 18 °C when dissipating about 14 kW of power. A thermal test wafer, which included hot-spot regions to mimic high-power compute cores, was attached to the wafer-scale microchannel cooler with Pb-Sn solder. Glass manifold layers were attached to the microchannel wafer using a frit material. The average apparent heat transfer coefficient, happ, was about 104000 W/(K-m2).
Martin Cochet, Karthik Swaminathan, et al.
ISCA 2024
Corey Liam Lammie, Hadjer Benmeziane, et al.
Nat. Rev. Electr. Eng.
Kailash Gopalakrishnan
DAC 2021
Yoichi Taira, Daiju Nakano, et al.
EURODISPLAY 2002