Future packaging materials: Cost performance, and environmental issues

C. Dimitrakopoulos, S. Purushothaman, et al.

DRC 1999

Sung K. Kang, Stephen L. Buchwalter, et al.

Proceedings - Electronic Components and Technology Conference

K.J. Stewart, M. Hatzakis, et al.

Polymer Engineering & Science

E. Babich, J. Paraszczak, et al.

Microelectronic Engineering