R.W. Dreyfus, R.T. Hodgson
Applied Physics Letters
The first use of an intense pulsed ion beam to anneal ion-implanted semiconductors is reported. Helium ion channeling shows that a single 80-ns pulse 200-keV H+ ions at ∼100 A/cm2 produced good crystallinity in silicon implanted with 1014 As/cm2 at 100 keV.
R.W. Dreyfus, R.T. Hodgson
Applied Physics Letters
J.E.E. Baglin, E.J. Bentz, et al.
Physical Review C
E. Rimini, W.K. Chu, et al.
Applied Physics Letters
H.J. Hovel, R.T. Hodgson, et al.
Solar Energy Materials