PaperElectrochemical characterization of adsorption-desorption of the cuprous-suppressor-chloride complex during electrodeposition of copperJohn G. Long, Peter C. Searson, et al.JES
PaperStructural and magnetic properties of Cr and Mn doped InNA. Ney, R. Rajaram, et al.Journal of Magnetism and Magnetic Materials
Conference paperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweepS. Cohen, J.C. Liu, et al.MRS Spring Meeting 1999