K.N. Chen, C. Cabral Jr., et al.
Microelectronic Engineering
We report a first observation of the remarkably low electrical resistivity of copper germanide thin films formed at temperatures below 200°C. At these low temperatures, the ε-Cu3Ge phase with a monoclinic crystal structure is formed, with room-temperature resistivity which can be as low as 5.5 μΩ cm. The films are electrically stable up to at least 600°C, and, unlike pure copper, are also stable against oxygen and air exposure.
K.N. Chen, C. Cabral Jr., et al.
Microelectronic Engineering
L. Krusin-Elbaum
INTERMAG 2006
J.R. Thompson, J.G. Ossandon, et al.
Applied Physics Letters
M.O. Aboelfotoh
Journal of Applied Physics