Venkatraman Ramakrishna is a senior researcher in the IBM Research Lab in Bangalore, India. As an IBMer, he has also been on a temporary assignment as a research staff member at the IBM Center for Blockchain Innovation in Singapore.
Ramakrishna's current research area is blockchain and smart contracting technology, with a focus on blockchain and distributed ledger interoperability. His other interests in this area include performance, security, and privacy aspects of blockchain. He has been involved in the development and testing of applications on the Hyperledger Fabric platform since its genesis in late 2015. He has led the design and implementation of seminal use cases in the areas of trade-finance and KYC on the Fabric platform to serve prominent international banks and corporations. He has also led research and development in the performance measurement and analysis of Fabric and its applications. And he is a co-author of a practical guidebook for development on Hyperledger Fabric titled Hands-On Blockchain with Hyperledger: Building decentralized applications with Hyperledger Fabric and Composer.
Ramakrishna joined the IBM India Research Lab as a Researcher in April 2011. Before joining IBM Research, he was a member of the Microsoft Bing Infrastructure team in Redmond, WA, USA.
Ramakrishna graduated with a B.Tech. in Computer Science and Engineering from IIT Kharagpur in 2001. Subsequently he obtained an M.S. and Ph.D. in Computer Science from UCLA, where his advisor was Professor Peter Reiher. His doctoral dissertation is titled "Policy Management and Interoperation Through Negotiation in Ubiquitous Computing."
Before joining the blockchain team in the India Lab, Ramakrishna was a member of the Telecom Research Group at IRL, and worked on projects that spanned the areas of mobile commerce, mobile and back-end analytics, security, identity management, and social networking. His research interests lay in the areas of mobile and ubiquitous computing, security, blockchain and smart contracts technology, an cloud technology.