Sebastian Engelmann           

Sebastian Engelmann received his Ph.D. in Materials Science at the University of Maryland, College Park in 2008. His main research activities in Prof. Gottlieb Oehrlein's group were improving the fundamental understanding of plasma-polymer interactions with main focus on 193nm PR resist materials interactions.

He is currently working in the Advanced Plasma Processing group at the IBM T.J. Watson Research Center in Yorktown Heights, N.Y, where he is developing plasma etch processes to support current and future device generations for exploratory CMOS device research and devices beyond the CMOS era. His main research activities are developing plasma processes that enable the integration of Trigate and Nanowire device geometries, novel materials (SiGe, III-V etc) or completely new technology apporaches (Photonics, MRAM, packaging etc.). Since 2015 he is also manager of the plasma processing group, looking at pioneering new uses of plasma etch technology in conventional and novel applications.

Current and Prior Positions

IBM
Research Staff Member and Manager
10/2015 - Present
Manage the advanced plasma processing group in Yorktown

IBM
Research Staff Member
9/2008 - Present
develop plasma processes for advanced semiconductor devices