Professional AssociationsProfessional Associations: IEEE Components, Packaging and Manufacturing Technology Society | IEEE, Senior Member
Katsuyuki Sakuma is a research staff member at the IBM T. J. Watson Research Center. He is also a Visiting Professor in the Department of Biomedical Engineering, Tohoku University, Japan and at National Chiao Tung University, Taiwan. His research interests include 3D integration technologies, bonding technologies, advanced packaging, and biomedical engineering.
He has published more than 85 peer-reviewed journal papers and conference proceeding papers, including three book chapters. He also holds 48 issued or pending U.S. and international patents. He has been recognized with the IBM Eleventh Invention Achievement Award in 2017 and an Outstanding Technical Achievement Award (OTAA) in 2015. He was also given the 2018 Exceptional Technical Achievement Award from IEEE Electronics Packaging Society and the 2017 Alumni Achievement Award from his Alma Mater, the School of Engineering at Tohoku University, for his exceptional contribution to 3D chip stack technology development in the global microelectronics packaging industry. He was co-recipient of IEEE CPMT Japan Society Best Presentation Award in 2012, and the IMAPS Best Paper Award of the interactive poster session in 2015.
He received his B.S. and M.S. degrees from Tohoku University, respectively, and the Ph.D. degree from Waseda University, Japan. He has been a senior member of IEEE and a member of the Japan Society of Applied Physics (JSAP). He has served as a committee member of the IEEE ECTC sub-committee since 2012, for the IEEE 3DIC technical program committee since 2016, and for the IEEE IRPS since 2017.
IEEE Transactions on Components, Packaging and Manufacturing Technology (CPMT) (2016 - present )
Institute of Electronics, Information and Communication Engineers (IEICE) (2003 -- 2005)
Technical Committee Chair
IEEE Electronic Components and Technology Conference (ECTC) (2016, 2017)
Technical Committee Member
IEEE Electronic Components and Technology Conference (ECTC) (2012 - present )
IEEE International 3D Systems Integration Conference (3DIC) (2016 - present )
IEEE International Reliability Physics Symposium (IRPS) (2017 - present )